TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that officer Yung-Chin Hou, SVP and Deputy Co-COO, acquired 20,313 Common Shares on September 1, 2026 as a vested grant under the company’s Employee Restricted Stock Awards Rules, at no cash price. Following this vesting, Hou holds 682,716 Common Shares directly. He also has indirect holdings of 7,460 Common Shares through an Employee Stock Purchase Plan trust, 20,190 Common Shares through a Long-Term Incentive bonus plan trust over which he has investment control, and 60,802 Common Shares held by his spouse. The filing indicates these transactions were not made under a Rule 10b5-1 trading plan.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that officer Tzu-Sou Chuang, a VP, acquired 8,175 Common Shares on September 1, 2026 as a vested restricted stock award at no cost under the Employee Restricted Stock Awards Rules. After this vesting, Chuang directly holds 1,503,340 Common Shares, and also has indirect holdings of 5,806 shares through an Employee Stock Purchase Plan trust and 7,036 shares through a Long-Term Incentive bonus plan trust over which investment control has been obtained.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Executive Vice President and Co‑Chief Operating Officer Chin Yung‑Pei acquired 32,204 common shares on September 1, 2026 through vesting of restricted stock awards at no cost. After this vesting, Chin Yung‑Pei holds 5,204,139 common shares directly, plus additional indirect holdings through an employee stock purchase plan, a long‑term incentive trust, and a spouse. The transactions were not made under a Rule 10b5‑1 trading plan.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that Senior Vice President Tzonz-Sheng Chang acquired 12,881 Common Shares on September 1, 2026 through vesting under the company’s Employee Restricted Stock Awards Rules at no cash price. Following this grant, Chang holds 157,519 shares directly, plus indirect holdings of 5,428 shares via an ESPP trust, 10,581 shares via an LTI bonus plan trust over which he has investment control, and 173,000 shares held by his spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported that officer Fang Shu-Hua, SVP and GC, acquired 20,313 Common Shares (2330.TW) on September 1, 2026 through the vesting of employee restricted stock awards at no cash price. After this vesting, Fang holds 878,705 Common Shares directly, plus additional indirect holdings through an ESPP trust, an LTI bonus plan trust over which Fang has investment control, a spouse, an immediate family member, and two affiliated companies.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (symbol: TSM) is the issuer of record for a Form 4 filing submitted to the SEC.
Taiwan Semiconductor Manufacturing Co Ltd (TSM) reported that VP and reporting person Chuang Juiping acquired 8,175 Common Shares on September 1, 2026 through vesting of awards under the Employee Restricted Stock Awards Rules, bringing direct holdings to 247,913 Common Shares. The filing also lists additional indirect holdings in Common Shares and American Depositary Shares held through an ESPP trust, an LTI trust, and the reporting person's spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reports a technical adjustment to its previously approved first-quarter 2026 cash dividend. The board had approved a total cash dividend of NT$181,526,590,469, or NT$7.0 per common share, on May 12, 2026, with payment scheduled for October 8, 2026.
Because some shares from 2024 restricted stock awards were reclaimed between the approval date and the dividend record date, the number of common shares outstanding changed slightly. As a result, the cash dividend per share for the first quarter of 2026 is formally adjusted to NT$7. per common share, reflecting only a minuscule difference from the original per-share amount.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reports July 2026 updates on insider holdings, bond issuance and share cancellations. Two vice presidents, B.Z. Tien and S.S. Lin, each increased their TSMC common shareholdings by 5,000 shares between June 30, 2026 and July 31, 2026.
TSMC and its subsidiaries issued unsecured bonds under issuance 115-3, including Tranche A totaling NT$14.0 billion with a 2.03% coupon rate for the period July 2026 to July 2031, with bullet repayment and interest payable annually, and Tranche B totaling NT$4.5 billion with a 2.10% coupon rate for the period July 2026 to July 2036.
For July 2026, TSMC reports that there was no cancellation of TSMC common shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported insider purchases by Vice President Yuan Lipen and related parties. On August 18–19, 2026, a total of 2,350 common shares were purchased in open-market or private transactions at prices between $73.58 and $74.50 per share. These include direct purchases, shares purchased and held by the reporting person’s spouse, and common shares held under the issuer’s Employee Stock Purchase Plan through an ESPP Trust.