TSMC issues NT$18.5B in new unsecured bonds

TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reports July 2026 updates on insider holdings, bond issuance and share cancellations.

Rhea-AI Filing Summary

TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reports July 2026 updates on insider holdings, bond issuance and share cancellations. Two vice presidents, B.Z. Tien and S.S. Lin, each increased their TSMC common shareholdings by 5,000 shares between June 30, 2026 and July 31, 2026.

TSMC and its subsidiaries issued unsecured bonds under issuance 115-3, including Tranche A totaling NT$14.0 billion with a 2.03% coupon rate for the period July 2026 to July 2031, with bullet repayment and interest payable annually, and Tranche B totaling NT$4.5 billion with a 2.10% coupon rate for the period July 2026 to July 2036.

For July 2026, TSMC reports that there was no cancellation of TSMC common shares.

Filing Explained

As a Form 6-K furnishing material home-market information, the August 25 filing reports July month-end holdings changes: B.Z. Tien's disclosed shares rose from 13,051 to 18,051 and S.S. Lin's from 30,269 to 35,269 between June 30, 2026 and July 31, 2026, a 5,000-share increase for each vice president.

Key Figures

Shares held by B.Z. Tien as of 6/30/2026: 13,051 shares Shares held by B.Z. Tien as of 7/31/2026: 18,051 shares Shares held by S.S. Lin as of 7/31/2026: 35,269 shares +4 more

7 metrics

Shares held by B.Z. Tien as of 6/30/2026 13,051 shares Vice President holdings before July 2026 change

Shares held by B.Z. Tien as of 7/31/2026 18,051 shares Vice President holdings after July 2026 change

Shares held by S.S. Lin as of 7/31/2026 35,269 shares Vice President holdings after July 2026 change

Issuance 115-3 Tranche A amount NT$14.0 billion Unsecured bond issued July 2026–July 2031

Issuance 115-3 Tranche A coupon rate 2.03% Unsecured bond, interest payable annually

Issuance 115-3 Tranche B amount NT$4.5 billion Unsecured bond issued July 2026–July 2036

Issuance 115-3 Tranche B coupon rate 2.10% Unsecured bond tranche from July 2026

Key Terms

unsecured bonds, coupon rate, bullet repayment

3 terms

unsecured bonds financial

"the unsecured bonds issued by TSMC and its subsidiaries"

Unsecured bonds are loans a company issues that are not backed by specific assets or collateral; investors rely on the issuer’s promise to pay rather than a claim on property if the company fails. They matter to investors because they carry higher risk than secured debt—so issuers usually pay higher interest—but also sit behind secured creditors in repayment order, which affects potential recovery if the issuer defaults.

coupon rate financial

"Total Amount (in billions) | Coupon Rate | Repayment"

The coupon rate is the annual interest percentage a bond or similar debt security promises to pay, calculated on its face value and usually delivered in regular payments like a steady paycheck. For investors it shows the expected income from holding the bond and helps compare returns across investments; it also affects a bond’s market price because higher or lower prevailing interest rates make that fixed payment more or less attractive.

bullet repayment financial

"NT$14.0 | 2.03% | Bullet repayment; interest payable annually"

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What insider shareholding changes did TSM (Taiwan Semiconductor) report for July 2026?

TSMC reported that Vice Presidents B.Z. Tien and S.S. Lin each increased their holdings of TSMC common shares by 5,000 shares from June 30, 2026 to July 31, 2026, reaching 18,051 and 35,269 shares respectively.

What new bonds did TSM issue according to this Form 6-K?

TSMC and its subsidiaries issued unsecured bonds under issuance 115-3, including Tranche A of NT$14.0 billion at a 2.03% coupon for July 2026–July 2031, and Tranche B of NT$4.5 billion at a 2.10% coupon for July 2026–July 2036.

What are the repayment terms of TSM’s new Tranche A bond?

TSMC’s Tranche A bond under issuance 115-3 totals NT$14.0 billion, runs from July 2026 to July 2031, and has bullet repayment with interest payable annually at a 2.03% coupon rate.

What is the coupon rate on TSM’s Tranche B bond issued in July 2026?

The Tranche B unsecured bond issued by TSMC and its subsidiaries under issuance 115-3 has a total amount of NT$4.5 billion, a 2.10% coupon rate, and covers the period from July 2026 to July 2036.

Did TSM cancel any common shares in July 2026?

No. TSMC reports that there was no cancellation of TSMC common shares for the month of July 2026.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Available on EDGAR 08/25/2026 - 06:17 AM EDT Accepted by SEC EDGAR 08/25/2026 - 06:17 AM EDT Learn about SEC filing dates

1934 Act Registration No. 1-14700

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

_____________________________

FORM 6-K

_____________________________

REPORT OF FOREIGN PRIVATE ISSUER

PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

For the month of August 2026

(Commission File Number: 001-14700)

_____________________________

Taiwan Semiconductor Manufacturing Company Limited

(Translation of Registrant’s Name Into English)

_____________________________

No. 8, Li-Hsin Road 6

Hsinchu Science Park

Hsinchu 300-096, Taiwan
Republic of China

(Address of Principal Executive Offices)

_____________________________

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F  x            Form 40-F  o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Taiwan Semiconductor Manufacturing Company Limited

Date:   August 25, 2026

By

/s/ Wendell Huang

Wendell Huang

Senior Vice President and Chief Financial Officer

Taiwan Semiconductor Manufacturing Company Limited

("TSMC"; NYSE: TSM)

This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors; 5) the unsecured bonds issued by TSMC and its subsidiaries and 6) the cancellation of TSMC common shares for the month of July 2026.

1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:

Title

Name

Number of shares held as of

Changes

6/30/2026

7/31/2026

Vice President

B.Z. Tien

13,051

18,051

5,000

Vice President

S.S. Lin

30,269

35,269

5,000

Note: Shareholdings include shares held by the related parties.

2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
None.

3.The acquisition and disposition of assets by TSMC and its subsidiaries:

Equity investment: NT$0.7 billion of disposition.

4.The capital appropriations approved by TSMC board of directors:

None.

5.The unsecured bonds issued by TSMC and its subsidiaries:

Issuance

Tranche

Issuance Period

Total Amount (in billions)

Coupon Rate

Repayment and Interest Payment

115-3

A

July 2026 ~ July 2031

NT$14.0

2.03%

Bullet repayment; interest payable annually

B

July 2026 ~ July 2036

NT$4.5

2.10%

6.The cancellation of TSMC common shares:

None.