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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSMWF) SEC Filings

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Welcome to our dedicated page for TAIWAN SEMICONDUCTOR MANUFACTURING CO SEC filings (Ticker: TSMWF), a comprehensive resource for investors and traders seeking official regulatory documents including 10-K annual reports, 10-Q quarterly earnings, 8-K material events, and insider trading forms.

Our SEC filing database is enhanced with expert analysis from Rhea-AI, providing insights into the potential impact of each filing on TAIWAN SEMICONDUCTOR MANUFACTURING CO's stock performance. Each filing includes a concise AI-generated summary, sentiment and impact scores, and end-of-day stock performance data showing the actual market reaction. Navigate easily through different filing types including 10-K annual reports, 10-Q quarterly reports, 8-K current reports, proxy statements (DEF 14A), and Form 4 insider trading disclosures.

Designed for fundamental investors and regulatory compliance professionals, our page simplifies access to critical SEC filings. By combining real-time SEC filing updates, Rhea-AI's analytical insights, and historical stock performance data, we provide comprehensive visibility into TAIWAN SEMICONDUCTOR MANUFACTURING CO's regulatory disclosures and financial reporting.

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Taiwan Semiconductor Manufacturing Co Ltd (TSM) reported that VP and reporting person Chuang Juiping acquired 8,175 Common Shares on September 1, 2026 through vesting of awards under the Employee Restricted Stock Awards Rules, bringing direct holdings to 247,913 Common Shares. The filing also lists additional indirect holdings in Common Shares and American Depositary Shares held through an ESPP trust, an LTI trust, and the reporting person's spouse.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reports a technical adjustment to its previously approved first-quarter 2026 cash dividend. The board had approved a total cash dividend of NT$181,526,590,469, or NT$7.0 per common share, on May 12, 2026, with payment scheduled for October 8, 2026.

Because some shares from 2024 restricted stock awards were reclaimed between the approval date and the dividend record date, the number of common shares outstanding changed slightly. As a result, the cash dividend per share for the first quarter of 2026 is formally adjusted to NT$7. per common share, reflecting only a minuscule difference from the original per-share amount.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reports July 2026 updates on insider holdings, bond issuance and share cancellations. Two vice presidents, B.Z. Tien and S.S. Lin, each increased their TSMC common shareholdings by 5,000 shares between June 30, 2026 and July 31, 2026.

TSMC and its subsidiaries issued unsecured bonds under issuance 115-3, including Tranche A totaling NT$14.0 billion with a 2.03% coupon rate for the period July 2026 to July 2031, with bullet repayment and interest payable annually, and Tranche B totaling NT$4.5 billion with a 2.10% coupon rate for the period July 2026 to July 2036.

For July 2026, TSMC reports that there was no cancellation of TSMC common shares.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM) reported insider purchases by Vice President Yuan Lipen and related parties. On August 18–19, 2026, a total of 2,350 common shares were purchased in open-market or private transactions at prices between $73.58 and $74.50 per share. These include direct purchases, shares purchased and held by the reporting person’s spouse, and common shares held under the issuer’s Employee Stock Purchase Plan through an ESPP Trust.

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Taiwan Semiconductor Manufacturing Company Limited reported significantly stronger interim results for the six months ended June 30, 2026. Net revenue was NT$2,404,483,690 thousand, up from NT$1,773,045,533 thousand, with a gross margin of 67% and income from operations of NT$1,425,568,793 thousand.

Net income reached NT$1,279,582,227 thousand versus NT$758,226,085 thousand, and basic EPS was NT$49.33 compared with NT$29.31. Cash generated by operating activities rose to NT$1,482,341,242 thousand, supporting heavy capital expenditures of NT$846,764,746 thousand and lifting cash and cash equivalents to NT$3,134,218,213 thousand. Total assets were NT$9,375,654,727 thousand and equity NT$6,474,470,981 thousand as of June 30, 2026.

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Taiwan Semiconductor Manufacturing Company Limited and Sony Semiconductor Solutions Corporation signed a definitive agreement to establish Advanced Vision Semiconductor Manufacturing Corporation, a joint venture in Koshi City, Kumamoto Prefecture, Japan, focused on developing and manufacturing next-generation smartphone image sensors using advanced process technology.

Sony plans to contribute approximately 465 billion yen through cash and a company split transferring its newly constructed fab, while TSMC plans cash contributions of approximately 282 billion yen, with both made in phases based on market demand and other conditions. Sony will be the sole controlling shareholder, with the JV intended to be a consolidated subsidiary of Sony Group Corporation and led by a Sony-appointed Representative Director. The JV targets volume production in 2029 and contemplates additional investment supported by the Japanese government. Completion is subject to required regulatory approvals and customary closing conditions.

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Taiwan Semiconductor Manufacturing Company Limited reported strong results for the second quarter of 2026, with consolidated revenue of NT$1,270.38 billion, net income of NT$706.56 billion, and diluted earnings per share of NT$27.25. For the six months ended June 30, 2026, net sales totaled 2,404,483,690 and net income was 1,279,582,227. As of June 30, 2026, total assets were 9,375,654,727 and equity attributable to shareholders was 6,432,518,334.

The Board approved a NT$7.0 per share cash dividend for the second quarter of 2026. The record date for common shareholders is December 16, 2026, with an ex-dividend date of December 10, 2026, and payment scheduled for January 7, 2027. The shareholders’ register will be closed December 12–16, 2026, and eligible foreign shareholders will have the option to receive cash dividends in U.S. dollars. The ex-dividend and record dates for TSMC American Depositary Shares are also December 10 and December 16, 2026, respectively.

To support long-term capacity plans and its technology roadmap, the Board approved capital appropriations of approximately US$29,442.50 million for advanced technology and packaging capacity, mature and specialty technologies, and fab construction and facilities. In addition, the Board approved forming a new joint venture with Sony Semiconductor Solutions Corporation for next-generation image sensors, including a share subscription of up to 282 billion Japanese yen in the joint venture.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Yeap Choh Fei reported a purchase of 57 Common Shares (2330.TW) on 2026-08-07 at $73.31 per share. The shares were bought by the administrator of the company’s Employee Stock Purchase Plan (ESPP) on the filer’s behalf and are held indirectly through an ESPP Trust.

After this ESPP purchase, indirect holdings through the ESPP Trust total 6,493 shares. Yeap also reports 213,375 shares held directly and 10,581 shares held indirectly through a trust associated with the company’s Long-Term Incentive (LTI) Bonus Plan, over which the filer has obtained investment control.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Kevin Xiaoqiang Zhang, SVP and Deputy Co-COO, reported purchasing 63 Common Shares (2330.TW) on 2026-08-07 at $73.310 per share. According to the company’s Employee Stock Purchase Plan, these shares were bought by the ESPP administrator on his behalf under predetermined terms and are held indirectly via an ESPP Trust, bringing that position to 7,286 Common Shares.

Separate holdings reported as of the same date include 329,663 Common Shares held directly, 2,500 American Depositary Shares (TSM) held directly, and 20,190 Common Shares held indirectly through an LTI Trust. Each American Depositary Share represents five Common Shares. The purchase price was translated from an average price of NT$2,367.1117 using an exchange rate of NT$32.288 to US$1.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Lipen Yuan reported an indirect purchase of 42 Common Shares of TSM on 2026-08-07 at $73.31 per share. The shares were bought by the administrator of the company’s Employee Stock Purchase Plan (ESPP) and held in an ESPP trust.

After this transaction, Yuan reports 1,260 shares held indirectly via the ESPP trust, 5,000 shares held directly, and 1,650 shares held indirectly through a spouse.

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FAQ

How many TAIWAN SEMICONDUCTOR MANUFACTURING CO (TSMWF) SEC filings are available on StockTitan?

StockTitan tracks 212 SEC filings for TAIWAN SEMICONDUCTOR MANUFACTURING CO (TSMWF), including 10-K annual reports, 10-Q quarterly reports, 8-K current reports, and Form 4 insider trading disclosures. Each filing includes AI-generated summaries, impact scoring, and sentiment analysis.

When was the most recent SEC filing for TAIWAN SEMICONDUCTOR MANUFACTURING CO (TSMWF)?

The most recent SEC filing for TAIWAN SEMICONDUCTOR MANUFACTURING CO (TSMWF) was filed on September 2, 2026.