ACM Research Unveils Ultra ECDP Electrochemical Deplating Tool for Compound Semiconductor Gold Etch Processes
ACM Research (NASDAQ: ACMR) has launched its first Ultra ECDP Electrochemical Deplating tool designed for wide bandgap compound semiconductor manufacturing. The innovative system specializes in electrochemical wafer-level gold etching with enhanced features including improved uniformity, smaller undercut, and superior gold line appearance.
The Ultra ECDP tool supports specialized processes such as Au bump removal, thin film Au etching, and deep-hole Au deplating, featuring integrated pre-wet and cleaning chambers. The system is specifically engineered to handle various substrates including silicon carbide (SiC), gallium arsenide (GaAs), and lithium phosphate, addressing growing demand from electric vehicles, 5G/6G communication, RF, and AI applications.
ACM Research (NASDAQ: ACMR) ha lanciato il suo primo strumento Ultra ECDP Electrochemical Deplating pensato per la produzione di semiconduttori a banda larga. Il sistema innovativo si specializza nell'elettrochimico incisione del oro a livello di wafer, offrendo caratteristiche migliorate tra cui maggiore uniformità, minore undercut e un aspetto superiore della linea d’oro.
Lo strumento Ultra ECDP supporta processi specializzati come la rimozione di bump in oro, l’incisione di strati sottili di oro e deplating di oro in fori profondi, ed è dotato di camere integrate di pre-umidificazione e pulizia. Il sistema è progettato per gestire substrati diversi, tra cui carburo di silicio (SiC), arsenico di gallio (GaAs) e fosfato di litio, rispondendo alla crescente domanda proveniente da veicoli elettrici, comunicazioni 5G/6G, RF e applicazioni di IA.
ACM Research (NASDAQ: ACMR) ha lanzado su primera herramienta Ultra ECDP Electrochemical Deplating diseñada para la fabricación de semiconductores de banda ancha. El sistema innovador se especializa en grabado electroquímico de oro a nivel de wafer, con mejoras como mayor uniformidad, menor undercut y una apariencia de la pista de oro superior.
La herramienta Ultra ECDP soporta procesos especializados como la eliminación de bumps de oro, el grabado de oro en películas delgadas y el deplating de oro en orificios profundos, con cámaras integradas de pre-humedad y limpieza. El sistema está diseñado para manejar sustratos como carburo de silicio (SiC), arsenido de galio (GaAs) y fosfato de litio, respondiendo a la creciente demanda de vehículos eléctricos, comunicaciones 5G/6G, RF y aplicaciones de IA.
ACM Research (NASDAQ: ACMR)은 Wide Bandgap 화합물 반도체 제조를 위한 첫 Ultra ECDP Electrochemical Deplating 도구를 출시했습니다. 이 혁신적 시스템은 웨이퍼 수준의 금 에칭을 전기화학적으로 수행하며, 향상된 균일성, 더 작은 언더컷, 그리고 우수한 금 라인 외관 등 향상된 기능을 제공합니다.
Ultra ECDP 도구는 Au 범프 제거, 박막 Au 에칭, 심공 Au 디플레이팅과 같은 전용 공정을 지원하며, 사전 습윤 및 세정 챔버가 통합되어 있습니다. 이 시스템은 실리콘 카바이드(SiC), 갈륨 비소(GaAs), 인산리튬 등 다양한 기판을 처리하도록 설계되었으며, 전기차, 5G/6G 통신, RF 및 AI 애플리케이션의 증가하는 수요를 충족합니다.
ACM Research (NASDAQ: ACMR) a lancé son premier outil Ultra ECDP Electrochemical Deplating conçu pour la fabrication de semi-conducteurs à large bandegap. Le système innovant se spécialise dans l’épièrement électrochimique d’or au niveau de la plaquette, avec des améliorations telles qu’une meilleure uniformité, une coupe sous-dit plus réduite et une apparence des lignes en or supérieure.
L’outil Ultra ECDP prend en charge des procédures spécialisées telles que la suppression de bumps en or, l’émailage d’or en couches minces et le deplating d’or dans les trous profonds, avec des chambres intégrées de pré-humidification et de nettoyage. Le système est spécialement conçu pour traiter divers substrats, notamment le carbure de silicium (SiC), l’arséniure de gallium (GaAs) et le phosphate de lithium, répondant à la demande croissante des véhicules électriques, des communications 5G/6G, des RF et des applications d’IA.
ACM Research (NASDAQ: ACMR) hat sein erstes Ultra ECDP Electrochemical Deplating-Werkzeug für die Herstellung von Wide-Bandgap-Halbleitern vorgestellt. Das innovative System spezialisiert sich auf elektrochemische Goldätzung auf Wafer-Ebene mit verbesserten Merkmalen wie verbesserter Gleichmäßigkeit, kleinerem Undercut und einer besseren Goldlinienoptik.
Das Ultra ECDP-Werkzeug unterstützt spezialisierte Prozesse wie die Entfernung von Au-Bumps, das Ätzen dünner Au-Schichten und das Deplating von Gold in Tieflochungen, mit integrierten Vorbefeuchtungs- und Reinigungszellen. Das System ist speziell darauf ausgelegt, verschiedene Substrate wie Siliziumcarbid (SiC), Galliumarsenid (GaAs) und Lithiumphosphat zu verarbeiten und adressiert die wachsende Nachfrage aus Bereichen wie Elektrofahrzeuge, 5G/6G-Kommunikation, RF und KI-Anwendungen.
ACM Research (NASDAQ: ACMR) أطلقت أول أداة Ultra ECDP Electrochemical Deplating مصممة لتصنيع أشباه الموصلات ذات النطاق الواسع. النظام المبتكر يتخصص في النقش الكهربي للذهب على مستوى الرقاقة، مع ميزات محسّنة تشمل توحيداً أفضل، وتراجعاً فرعياً أصغر، ومظهر خط الذهب فائق.
تدعم أداة Ultra ECDP عمليات متخصصة مثل إزالة بقع الذهب Au، ونقش طبقات الذهب الرقيقة، وإذابة الذهب من خلال الثقوب العميقة، مع غرف ما قبل الترطيب والتنظيف المدمجة. تم تصميم النظام خصيصاً للتعامل مع ركيزات مختلفة بما في ذلك سيليكون كاربايد (SiC)، جرمانيوم القالیوم (GaAs)، وفوسفات الليثيوم، لتلبية الطلب المتزايد من مركبات السيارات الكهربائية، و الاتصالات 5G/6G، و RF، وتطبيقات الذكاء الاصطناعي.
ACM Research（纳斯达克股票代码：ACMR） 已推出首款 Ultra ECDP 电化学去镀工具，面向宽禁带半导体制造。该创新系统专注于晶圆级金电化学刻蚀，具备更高的均匀性、较小的阴刻和卓越的金线外观等改进特性。
Ultra ECDP 工具支持 专用工艺，如金凸点移除、薄膜金刻蚀，以及深孔金去镀，并配备集成的预湿润与清洗腔室。该系统专为处理多种衬底设计，包括碳化硅（SiC）、砷化镓（GaAs）和磷酸锂，满足电动汽车、5G/6G 通信、射频和人工智能应用日益增长的需求。
- Advanced multi-anode electrochemical deplating technology for superior uniformity and minimized side etching
- Modular design allowing integration of both plating and deplating processes in a single platform
- Horizontal full-face deplating capability to prevent cross contamination
- Addresses growing compound semiconductor market demand from EV, 5G/6G, RF, and AI sectors
- None.
Insights
ACM's new Ultra ECDP tool targets high-growth compound semiconductor market with superior gold etching technology, expanding their addressable market.
ACM Research has strategically expanded its product portfolio with the new Ultra ECDP Electrochemical Deplating tool, specifically designed for gold etching in compound semiconductor manufacturing. This represents a calculated move into the rapidly expanding compound semiconductor market, which is seeing increased demand from electric vehicles, 5G/6G communications, RF, and AI applications.
The technical advantages of this system are significant. The tool offers superior uniformity, minimized undercut, and enhanced gold line appearance – critical parameters for high-precision semiconductor manufacturing. The multi-anode electrochemical deplating technology enables precise control during the gold etching process, which is particularly challenging given gold's material properties.
What makes this product launch particularly notable is its timing and market positioning. Compound semiconductors like silicon carbide (SiC) and gallium arsenide (GaAs) are increasingly critical in high-performance applications where traditional silicon has limitations. By addressing the specific challenges of gold etching in these materials, ACM is positioning itself in a growing specialty segment with potentially higher margins than standard semiconductor equipment.
The modular design allowing integration of both plating and deplating processes within a single platform represents a potential efficiency advantage for manufacturers, potentially reducing both capital expenditure and cleanroom footprint requirements. This could translate to a compelling value proposition for customers seeking to optimize their compound semiconductor manufacturing processes.
The Ultra ECDP System Delivers Superior Uniformity and Minimized Undercut for High-Precision Au Bump, Thin Film, and Deep-Hole Deplating
FREMONT, Calif., Sept. 17, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced the launch of its first Ultra ECDP Electrochemical Deplating (“Ultra ECDP”) tool specifically designed for wide bandgap compound semiconductor manufacturing. The Ultra ECDP tool is engineered for electrochemical wafer-level gold (Au) etching performed outside of the wafer pattern area and delivers improved uniformity, smaller undercut and enhanced gold line appearance.
The Ultra ECDP tool offers specialized processes including Au bump removal, thin film Au etching, and deep-hole Au deplating, supported by integrated pre-wet and cleaning chambers. It features precise chemistry circulation and advanced multi-anode electrochemical deplating technology, the system achieves minimized side etching, excellent surface finish, and superior uniformity across all features.
“The compound semiconductor market continues to grow with strong demand from electric vehicles, 5G/6G communication, RF and AI applications, among others,” said Dr. David Wang, President and Chief Executive Officer of ACM Research. “Gold is emerging as an advantageous material for these devices, delivering high conductivity, corrosion resistance, and malleability, but it also presents etching and plating challenges. We believe ACM’s Ultra ECDP tool overcomes these barriers to provide a reliable, production-ready solution that helps customers achieve high-performance results. It is another example of how we innovate to address our customers’ challenges.”
The Ultra ECDP tool is engineered to address the evolving requirements of compound semiconductor manufacturing, accommodating the distinct physical characteristics—such as weight, stress, and thickness—of diverse substrates, including silicon carbide (SiC), gallium arsenide (GaAs), lithium phosphate (Li₃PO₄) and etc. Featuring a modular design, the Ultra ECDP tool has the flexibility to integrate both plating and deplating processes within a single platform, and utilizes multi-anode technology for controlling deplating in different areas. The Ultra ECDP tool also offers horizontal full-face deplating to prevent cross contamination during processing.
About the Ultra ECDP Tool
The Ultra ECDP tool is compatible with 6-inch and 8-inch platforms and accommodates 150 millimeter (mm), 159mm and 200mm wafer sizes. The system is configurable with two open cassettes and one vacuum arm, providing adaptability for various manufacturing environments.
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit https://www.acmr.com/.
© ACM Research, Inc. The ACM Research logo is trademark of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
| Media Contact: | Company Contacts: |
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| Kiterocket | Robert Metter |
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| Xi Wang | |
| ACM Research (Shanghai), Inc. | |
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| David Kim | |
| ACM Research (Korea), Inc. | |
| +82 1041415171 | |
| Taiwan | |
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FAQ
What is the new Ultra ECDP tool announced by ACM Research (NASDAQ: ACMR)?
What are the key features of ACM Research's Ultra ECDP system?
Which substrates can ACM Research's Ultra ECDP tool process?
What markets and applications is the ACM Research Ultra ECDP tool targeting?
How does the Ultra ECDP tool prevent contamination during processing?
