Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley

Applied Materials (NYSE: AMAT) and SK hynix announced a long-term R&D collaboration to accelerate next-generation DRAM and HBM innovations at Applied’s new EPIC Center in Silicon Valley.

Rhea-AI Summary

Applied Materials (NYSE: AMAT) and SK hynix announced a long-term R&D collaboration to accelerate next-generation DRAM and HBM innovations at Applied’s new EPIC Center in Silicon Valley.

The agreement makes SK hynix a founding partner, establishes co-innovation programs in materials, process integration and 3D advanced packaging, and ties to Applied’s $5 billion EPIC Center investment.

Positive

• EPIC Center investment of approximately $5 billion in U.S. advanced equipment R&D
• SK hynix named founding partner to co-locate engineers and accelerate joint development
• Targeted programs on DRAM, HBM, materials engineering, and 3D advanced packaging

Negative

• Higher capital commitments: EPIC Center spending expected to scale to approximately $5 billion over time

Argus Mar 11 session

+1.50% close to close Open Argus

Details

News Market Reaction – AMAT

On Mar 11, the first trading day after this news, AMAT closed 1.50% above the previous close.

Data tracked by StockTitan Argus for the Mar 11 session.

Key Figures

EPIC Center investment: $5 billion Announcement date: March 10, 2026

EPIC Center investment

$5 billion

Capital spending expected to scale as EPIC Center customer projects commence

Announcement date

March 10, 2026

Date of long-term R&D collaboration announcement with SK hynix

Historical Context

5 past events · Latest: Feb 24

5 events

1. Feb 24

   Supplier awards

   24h Move

   +1.2%

   Recognition of 12 suppliers for quality, service and sustainability performance.

2. Feb 17

   Investor conferences

   24h Move

   +1.2%

   Management participation in two March 2026 investor conferences with webcasts.

3. Feb 12

   Earnings results

   24h Move

   +8.1%

   Q1 FY2026 revenue, EPS and cash generation with Q2 guidance provided.

4. Feb 11

   Regulatory settlement

   24h Move

   -3.4%

   Civil settlement with BIS involving a $252.5 million payment over China shipments.

5. Feb 11

   EPIC partner news

   24h Move

   +3.3%

   Samsung joining the planned $5 billion EPIC Center as a founding member.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

dram, high-bandwidth memory, 3d advanced packaging, heterogeneous integration, +1 more

5 terms

dram technical

"next-generation DRAM and high-bandwidth memory (HBM) essential for AI"

A dram is a small, traditional unit used to measure either mass or liquid volume in manufacturing and pharmaceuticals — roughly 1.77 grams for a weight dram or about 3.7 milliliters for a fluid dram, similar to a small teaspoon or a couple of drops. Investors care because dram-based measurements affect drug dosing, packaging sizes, labeling compliance and raw-material usage, which in turn influence production costs, inventory counts and regulatory risk.

high-bandwidth memory technical

"next-generation DRAM and high-bandwidth memory (HBM) essential for AI"

High-bandwidth memory is a type of computer memory designed to move large amounts of data very quickly between memory and processors, like adding many wide lanes to a highway so trucks can deliver more goods at once. For investors, it matters because products that use this memory can handle heavier workloads with lower power use, which can boost competitiveness, increase demand for certain chips, and influence manufacturers’ pricing power and profit margins.

3d advanced packaging technical

"advance innovation in materials, process integration and 3D advanced packaging"

3D advanced packaging is a way of stacking and connecting multiple semiconductor chips or components in three dimensions to make smaller, faster, and more energy-efficient electronic modules. For investors it matters because this technique can boost product performance, reduce costs and enable new device features, potentially increasing a manufacturer’s competitiveness, profit margins and market share much like adding floors to a building increases usable space without expanding the land footprint.

heterogeneous integration technical

"connecting device-level innovation with heterogeneous integration to address emerging"

Heterogeneous integration is the practice of combining different types of electronic components — such as processors, memory, sensors and specialized chips — into a single package or tightly linked module, rather than building everything on one uniform chip. Like putting varied ingredients into one compact lunchbox to save space and improve function, it matters to investors because it can boost product performance, lower power use, shorten development time and create competitive or cost advantages that affect revenue and margins.

wafer fab equipment technical

"Advancing memory technology for the AI era requires new approaches to developing wafer fab equipment"

Wafer fab equipment is the specialized machines and tools used to build semiconductor chips on silicon wafers, handling steps like etching, deposition, inspection and testing. Think of it as the industrial kitchen appliances that turn raw ingredients into finished products; its availability and performance determine how many chips can be made, how quickly and at what cost, so changes in demand, lead times or technology upgrades directly affect manufacturers’ revenue, margins and investment plans.

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• Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth memory (HBM)
• Opening this year, Applied’s EPIC Center is designed to provide chipmakers and ecosystem partners with earlier access to Applied’s R&D portfolio, faster cycles of learning and accelerated transfer of next-generation technologies into high-volume manufacturing

SANTA CLARA, Calif., March 10, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced a long-term collaboration agreement with SK hynix Inc. to accelerate the development and deployment of next-generation DRAM and high-bandwidth memory (HBM) essential for AI and high-performance computing. Engineers from both companies will work side-by-side at Applied’s EPIC Center in Silicon Valley to advance innovation in materials, process integration and 3D advanced packaging as memory architectures move beyond current production nodes.

“Applied Materials and SK hynix share a long history of working together to improve the energy-efficient performance of advanced memory chips through innovations in materials engineering,” said Gary Dickerson, President and CEO of Applied Materials. “We are excited to have SK hynix join the EPIC Center as a founding partner, and we look forward to driving further breakthroughs together that accelerate commercialization of next-generation DRAM and HBM technologies for the AI era.”

“The continued scaling of AI systems is driving unprecedented demand for energy-efficient memory technologies,” said Nohjung Kwak, President and CEO of SK hynix. “One of the biggest hurdles in AI progress is the growing disconnect between memory speeds and advances in processors. Our advanced memory technologies are paving the way for faster and more energy-efficient data processing, and we look forward to partnering with Applied Materials at the new EPIC Center to deliver a roadmap of innovations that enable the next generation of memory solutions optimized for AI.”

Applied and SK hynix have signed a comprehensive technology development agreement to jointly address long‑term semiconductor R&D challenges for next‑generation memory. The initial set of co‑innovation programs will focus on exploring new materials, complex integration schemes and enabling HBM-class advanced packaging, with the goal of improving the performance and manufacturability of future memory architectures. The collaboration will leverage the EPIC Center’s high-velocity co-innovation model, where SK hynix engineers will work directly alongside Applied technologists to accelerate development of new technologies. SK hynix will also take advantage of Applied’s industry-leading advanced packaging R&D capabilities in Singapore, connecting device-level innovation with heterogeneous integration to address emerging challenges of 3D advanced packaging.

“Continued progress in memory increasingly relies on materials engineering innovations across both the device and packaging level,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “By combining the power of the EPIC Center in Silicon Valley with Applied’s advanced packaging capabilities in Singapore, our collaboration with SK hynix will enable us to co‑optimize the entire technology stack and accelerate the path to manufacturable memory innovations.”

“Advancing memory technology for the AI era requires new approaches to developing wafer fab equipment,” said Seon Yong Cha, Chief Technology Officer (CTO) of SK hynix. “Our co-innovation programs with Applied Materials will focus on new materials, integration approaches and thermal‑management technologies spanning device engineering and advanced packaging. Working alongside Applied engineers at the EPIC Center gives our teams faster learning cycles and manufacturing‑relevant validation for next‑generation AI memories.”

SK hynix becomes a founding partner of the EPIC Center, building momentum as industry leaders collaborate with Applied ahead of operational readiness this year. Applied’s new, $5 billion* EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley represents the largest-ever U.S. investment in advanced semiconductor equipment R&D. The center is designed from the ground up to dramatically reduce the time it takes to commercialize breakthrough technologies from early-stage research to full-scale manufacturing. For chipmakers, the EPIC Center will provide earlier access to Applied’s R&D portfolio, faster cycles of learning and accelerated transfer of next-generation technologies into high-volume manufacturing. In addition, the co-innovation programs at the EPIC Center will provide Applied with greater multi-node visibility to guide R&D investments while increasing R&D productivity and value sharing.

*Capital spending is expected to scale over time to approximately $5 billion as customer projects commence.

Forward-Looking Statements
This press release contains forward-looking statements, including those regarding Applied’s investment and growth strategies, the development of new materials and technologies, industry outlook and technology requirements, the plans and expectations for the EPIC Center, and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, without limitation: the demand for semiconductors and customers’ technology requirements; the ability to develop new and innovative technologies; the ability to obtain and protect intellectual property rights in key technologies; the ability to achieve the objectives of the EPIC Center; and other risks and uncertainties described in Applied’s filings with the Securities and Exchange Commission, including Applied’s most recent Forms 10-K, 10-Q and 8-K. All forward-looking statements are based on management’s current estimates, projections and assumptions, and Applied assumes no obligation to update them.

About Applied Materials
Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions that are at the foundation of virtually every new semiconductor and advanced display in the world. The technology we create is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver material innovation that changes the world. Learn more at www.appliedmaterials.com.

Contact:
Ricky Gradwohl (editorial/media) 408.235.4676
Mike Sullivan (financial community) 408.986.7977

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What did Applied Materials (AMAT) and SK hynix announce on March 10, 2026?

They announced a long-term R&D collaboration to accelerate next-generation DRAM and HBM development. According to the company, the agreement names SK hynix a founding EPIC Center partner and establishes co-innovation programs in materials, integration, and packaging.

How will the AMAT–SK hynix partnership use the EPIC Center in 2026?

The partnership will colocate engineers at the EPIC Center to speed technology transfer and validation. According to the company, SK hynix teams will work alongside Applied technologists to shorten development cycles and enable manufacturable memory innovations.

What technologies will AMAT and SK hynix focus on together under the agreement?

They will focus on next-generation DRAM, HBM, new materials, complex integration, and 3D advanced packaging. According to the company, initial co-innovation programs target materials engineering and thermal-management solutions for AI memory.

What does the EPIC Center investment mean for AMAT shareholders?

EPIC represents a large R&D capital commitment intended to accelerate commercialization of breakthrough tools. According to the company, capital spending is expected to scale over time to approximately $5 billion as customer projects commence.

Will the AMAT and SK hynix collaboration impact manufacturing locations or Singapore R&D?

Yes; the collaboration connects Silicon Valley EPIC work with Applied’s advanced packaging R&D in Singapore. According to the company, this links device-level innovation to heterogeneous integration and packaging validation efforts.