Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
Rhea-AI Summary
Ansys (NASDAQ: ANSS) announced that its PathFinder-SC has been certified as a new ESD analysis solution for TSMC's N2 process technology. The solution provides enhanced capacity and performance for cloud-based large-scale design verification.
The certification includes multiple Ansys solutions running on distributed cloud services: SeaScape cloud-optimized platform (including RedHawk-SC, PathFinder-SC, RedHawk-SC Electrothermal), and Totem. These tools ensure protection against electrical overstress in complex semiconductor designs for AI, HPC, 5G, automotive, memory, and GPU applications.
This collaboration with TSMC aims to provide customers with reliable verification solutions that maximize performance and power efficiency in advanced process technologies, particularly as chip sizes continue to increase.
Positive
- TSMC certification of PathFinder-SC for N2 process technology expands market opportunities
- Cloud-based solutions certification enables handling of larger, more complex chip designs
- Strategic partnership with TSMC strengthens Ansys' position in semiconductor design tools
Negative
- None.
News Market Reaction 1 Alert
On the day this news was published, ANSS gained 0.04%, reflecting a mild positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
Ansys' accelerated, high-capacity approach to verifying electrical design rules for final validation addresses critical industry need as chips rapidly increase in size
/ Key Highlights
- Ansys PathFinder-SC™ electrostatic discharge (ESD) reliability analysis solution for point-to-point (P2P) and current density (CD) is certified for TSMC's N2 process technology
- TSMC certified the accuracy of Ansys SeaScape™ cloud-optimized electronic design automation platform solutions including Ansys RedHawk-SC™, PathFinder-SC, Ansys RedHawk-SC Electrothermal™, in addition to Ansys Totem™ running on distributed cloud services
To promote the cloud as a high-capacity, high-speed option for mutual customers, Ansys and TSMC collaborated to complete certification for SeaScape that includes RedHawk-SC, PathFinder-SC, and RedHawk-SC Electrothermal 3D-IC multiphysics analysis platform. Ansys Totem solution for transistor-level and mixed-signal design is also certified, delivering customers the same verification reliability and accuracy when running projects in a distributed cloud environment.
"As the scale and size of chips continues to increase, we need to consider new approaches and new technologies that ensure our customers have access to optimal design solutions that maximize the performance and power efficiency of our cutting-edge process technologies," said Lipen Yuan, senior director of advanced technology business development at TSMC. "Our collaboration with Open Innovation Platform® (OIP) partners like Ansys delivers a proven, reliable verification solution for customers advancing the forefront of semiconductor design."
"The Ansys multiphysics platform continues to prove itself a strong technical solution for a range of physics, from power integrity to high-speed electromagnetics," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "Our collaboration with TSMC extends multiphysics analysis for joint customers that are designing some of the most complex chips in the world and looking to take advantage of the cloud to accelerate their productivity."
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement™
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in
ANSS–T
/ Contacts
Media | Mary Kate Joyce |
724.820.4368 | |
Investors | Kelsey DeBriyn |
724.820.3927 | |
View original content to download multimedia:https://www.prnewswire.com/news-releases/ansys-semiconductor-solutions-certified-by-tsmc-for-reliable-accurate-analysis-of-evolving-chip-designs-302418505.html
SOURCE Ansys