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Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs

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Ansys (NASDAQ: ANSS) announced that its PathFinder-SC has been certified as a new ESD analysis solution for TSMC's N2 process technology. The solution provides enhanced capacity and performance for cloud-based large-scale design verification.

The certification includes multiple Ansys solutions running on distributed cloud services: SeaScape cloud-optimized platform (including RedHawk-SC, PathFinder-SC, RedHawk-SC Electrothermal), and Totem. These tools ensure protection against electrical overstress in complex semiconductor designs for AI, HPC, 5G, automotive, memory, and GPU applications.

This collaboration with TSMC aims to provide customers with reliable verification solutions that maximize performance and power efficiency in advanced process technologies, particularly as chip sizes continue to increase.

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Positive

  • TSMC certification of PathFinder-SC for N2 process technology expands market opportunities
  • Cloud-based solutions certification enables handling of larger, more complex chip designs
  • Strategic partnership with TSMC strengthens Ansys' position in semiconductor design tools

Negative

  • None.

News Market Reaction 1 Alert

+0.04% News Effect

On the day this news was published, ANSS gained 0.04%, reflecting a mild positive market reaction.

Data tracked by StockTitan Argus on the day of publication.

Ansys' accelerated, high-capacity approach to verifying electrical design rules for final validation addresses critical industry need as chips rapidly increase in size

/ Key Highlights

PITTSBURGH, April 2, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud. This solution presents new opportunities to perform robust ESD analysis for P2P and CD — both earlier in the design process and at end stage ESD validation — for large, complex designs including System-on-Chip and multi-die integrated circuits. This ensures chips are protected from electrical overstress, delivering safe and reliable semiconductor products for applications including AI, high-performance computing (HPC), 5G mobile communications, automotive, memory, and graphic processors (GPUs).

To promote the cloud as a high-capacity, high-speed option for mutual customers, Ansys and TSMC collaborated to complete certification for SeaScape that includes RedHawk-SC, PathFinder-SC, and RedHawk-SC Electrothermal 3D-IC multiphysics analysis platform. Ansys Totem solution for transistor-level and mixed-signal design is also certified, delivering customers the same verification reliability and accuracy when running projects in a distributed cloud environment.

"As the scale and size of chips continues to increase, we need to consider new approaches and new technologies that ensure our customers have access to optimal design solutions that maximize the performance and power efficiency of our cutting-edge process technologies," said Lipen Yuan, senior director of advanced technology business development at TSMC. "Our collaboration with Open Innovation Platform® (OIP) partners like Ansys delivers a proven, reliable verification solution for customers advancing the forefront of semiconductor design."

"The Ansys multiphysics platform continues to prove itself a strong technical solution for a range of physics, from power integrity to high-speed electromagnetics," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "Our collaboration with TSMC extends multiphysics analysis for joint customers that are designing some of the most complex chips in the world and looking to take advantage of the cloud to accelerate their productivity."

/ About Ansys 

Our Mission: Powering Innovation that Drives Human Advancement™

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS–T

/ Contacts

Media

Mary Kate Joyce


724.820.4368


marykate.joyce@ansys.com 

Investors

Kelsey DeBriyn


724.820.3927


kelsey.debriyn@ansys.com 

Cision View original content to download multimedia:https://www.prnewswire.com/news-releases/ansys-semiconductor-solutions-certified-by-tsmc-for-reliable-accurate-analysis-of-evolving-chip-designs-302418505.html

SOURCE Ansys

FAQ

What is the significance of TSMC's certification of Ansys PathFinder-SC for N2 process technology?

The certification enables reliable ESD analysis for large-scale chip designs, ensuring protection against electrical overstress in complex semiconductor applications like AI and HPC.

Which Ansys (ANSS) solutions are now certified for TSMC's cloud services?

SeaScape platform (including RedHawk-SC, PathFinder-SC, RedHawk-SC Electrothermal) and Totem solution are certified for TSMC's distributed cloud services.

What types of semiconductor applications will benefit from Ansys (ANSS) certified solutions?

The solutions benefit AI, high-performance computing, 5G mobile communications, automotive, memory, and graphic processors designs.

How does PathFinder-SC enhance semiconductor design verification?

It provides superior capacity and performance for cloud-based ESD analysis, enabling both early-stage and end-stage validation for large, complex chip designs.
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