Amtech Systems to Announce Fiscal 2026 Third Quarter Financial Results on August 5, 2026

Key Terms

semiconductor device packaging technical

The materials and structures that enclose a semiconductor chip and provide electrical connections to the outside world, physical protection, and heat dissipation. Like a protective case and connector for a tiny engine, packaging determines how well a chip performs, how small or cool it can run, and how cheaply and reliably it can be made and assembled—factors that affect manufacturing yield, product cost, supply chains, and ultimately company margins and delivery timelines.

advanced substrate fabrication technical

Advanced substrate fabrication is the specialized process of producing high‑precision base layers or platform materials on which electronic components, chips, or delicate devices are built. Like laying a building’s foundation, small improvements in these base materials can markedly boost product speed, reliability and manufacturing yield, so changes in this process affect costs, supply constraints and a company’s competitive edge—key factors for investors.

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TEMPE, Ariz.--(BUSINESS WIRE)-- Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, will announce financial results for its fiscal 2026 third quarter ended June 30, 2026 on August 5, 2026 after market close.

Amtech Systems will host a conference call at 5:00 pm ET on August 5, 2026 to discuss fiscal 2026 third quarter financial results. The call will be available to interested parties by dialing 1-412-365-5127. A live webcast of the conference call will be available in the Investor Relations section of Amtech’s website at: https://www.amtechsystems.com/investors/events. A replay of the webcast will be available in the Investor Relations section of the company’s website at https://www.amtechsystems.com/investors/events shortly after the conclusion of the call.

About Amtech Systems, Inc.

Amtech Systems, Inc. (NASDAQ: ASYS) provides equipment, consumables and services for AI semiconductor device packaging and advanced wafer substrate fabrication. Our products include advanced packaging and electronics assembly equipment for applications such as AI GPUs and advanced automotive electronics. Consumable and other solutions are used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon (Si) power devices, digital and analog devices, power electronic packages, advanced semiconductor packages and electronic assemblies. We sell these products to semiconductor device and module manufacturers worldwide, particularly in Asia, North America and Europe. To learn more about Amtech, please visit our website at https://www.amtechsystems.com.

Amtech Systems may use its website (www.amtechsystems.com), investor relations page (https://www.amtechsystems.com/investors), and LinkedIn page (https://www.linkedin.com/company/amtechsystems) to disclose material non-public information and for complying with its disclosure obligations under Regulation FD. Accordingly, investors and other interested parties should monitor these sites, in addition to following Amtech Systems press releases, Securities and Exchange Commission (SEC) filings, public conference calls and public presentations/webcasts.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260722640285/en/

Investor Relations Contact:
Darrow Associates
Jordan Darrow
631-766-4528
jdarrow@darrowir.com

Source: Amtech Systems, Inc.