BAE Systems to Deliver Advanced Microelectronics to U.S. Defense Industrial Base
Award part of the National Security Technology Accelerator’s STEAM PIPE project

BAE Systems awarded
Microelectronics play a critical role in furthering the Department of Defense’s warfighting capabilities. BAE Systems’ work under the STEAM PIPE project will result in the development and delivery of advanced chiplet prototypes that will transition into military systems. The technology will be made available to the entire
“The highly specialized chiplets are small, modular pieces that can be combined to form a larger, more complex system-on-a-chip,” said Wes Allen, director of Microelectronics at BAE Systems’ FAST Labs. “This is the beginning of a new chiplet ecosystem that could result in breakthroughs like enabling smaller form factor electronic warfare technology on new platforms.”
Work on the project, which builds on the technology advances of recent programs and follows a recently announced delivery milestone on the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program, includes collaboration with subcontractors Extoll GmbH and Comcores ApS.
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Paul Roberts, BAE Systems
Mobile: 603-521-2381
paul.a.roberts@baesystems.com
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@BAESystemsInc
Source: BAE Systems