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Butterfly Network Appoints David Horsley as Senior Vice President, Innovation – Butterfly Embedded™

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ultrasound-on-chip technical
Ultrasound-on-chip packs the components that generate and detect ultrasound waves onto a tiny semiconductor chip, shrinking a traditional ultrasound device into a compact, lower-cost electronic module. Like turning a bulky camera into a smartphone lens, it can enable portable, more affordable medical scanners and consumer health gadgets, creating new revenue opportunities and faster manufacturing scale — though commercial value depends on clinical acceptance and regulatory clearance.
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Ultrasonic sensor systems are devices that send out high-frequency sound pulses and measure the returning echoes to detect objects, measure distance or sense motion—think of how bats navigate using echoes. Investors care because these sensors are components in many growing industries (automotive safety, robotics, industrial automation, medical imaging), so their adoption, cost, and supply chain health can affect sales, margins and competitive position for suppliers and product-makers.
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Chirp Microsystems Co-Founder Joins Butterfly to Advance its Ultrasound-on-Chip™ Platform Strategy

NEW YORK & BURLINGTON, Mass.--(BUSINESS WIRE)-- Butterfly Network, Inc. (NYSE: BFLY) (“Butterfly”), a pioneer and leader in semiconductor-based ultrasound devices, programmable cloud software and AI, today announced the appointment of David Horsley, Ph.D. as Senior Vice President of Innovation – Butterfly Embedded™ to scale its Ultrasound-on-Chip™ co-development and licensing initiative. In this role, Dr. Horsley will lead strategy and go-to-market for Butterfly Embedded, overseeing new product development, partnerships, and commercialization efforts.

Butterfly Embedded is focused on extending the reach of the company’s proprietary semiconductor platform through co-development, licensing, and strategic collaborations with organizations developing novel ultrasound-enabled technologies. The program allows partners to integrate Butterfly’s core ultrasound technology into new products and applications, expanding its impact beyond the point-of-care ultrasound market.

Dr. Horsley is a Professor of Electrical and Computer Engineering and Co-Director of the Institute for NanoSystems Innovation at Northeastern University, as well as Adjunct Professor of Mechanical Engineering at the University of California, Berkeley. He is a Fellow of both IEEE and the National Academy of Inventors and has spent his career at the intersection of semiconductor innovation and the commercialization of advanced technologies. His body of work spans MEMS, ultrasonic sensor systems, and bringing deep-technology platforms from research to market.

Dr. Horsley previously served as Chief Technology Officer of the Emerging Sensors Business Unit at TDK InvenSense and co-founded Chirp Microsystems, a PMUT time-of-flight sensor pioneer acquired by TDK. He has also held engineering and research leadership roles at Hewlett Packard Laboratories and Onix Microsystems, contributing to the development and commercialization of advanced MEMS and ultrasound technologies.

“David combines world-class ultrasonic MEMS expertise with a track record of building commercially successful semiconductor technologies,” said Joseph DeVivo, President, Chief Executive Officer and Chairman of Butterfly. “Momentum around Butterfly Embedded is increasing, with a growing pipeline of inbound demand and early collaborations beginning to contribute revenue. We’re excited to have David join at this strategic moment to build on that foundation and accelerate the next phase of growth.”

“Butterfly’s Ultrasound-on-Chip™ platform represents a unique semiconductor approach to expanding how ultrasound can be integrated into next-generation technologies,” said Dr. Horsley. “As sensing, imaging, and computer vision become increasingly central to intelligent systems, ultrasound will play an important role in enabling new capabilities. I look forward to helping translate that innovation into scalable embedded applications and long-term growth opportunities.”

About Butterfly Network

Butterfly Network, Inc. (NYSE: BFLY) is driving a digital revolution in ultrasound imaging and sensing with its proprietary Ultrasound-on-Chip™ semiconductor technology and software solutions. Butterfly first proved its technology in the point-of-care ultrasound market – commercializing the world’s first single-probe, whole-body portable ultrasound device, which is now on its best-selling, third-generation: Butterfly iQ3™. The Company combines its advanced hardware with cloud software and AI, an enterprise workflow solution (Compass AI™) and other offerings to drive adoption of affordable, accessible ultrasound. Butterfly also enables third-party development of imaging AI apps through Butterfly Garden™, its software development kit and AI marketplace.

In addition to its medical imaging products, Butterfly Embedded™ is the Company’s Ultrasound-on-Chip™ licensing and co-development business designed to enable a new wave of ultrasound-enabled technologies across non-competitive healthcare markets and beyond. Through Butterfly Embedded™, partners can build and scale novel ultrasound applications powered by Butterfly’s proprietary semiconductor chip and software platform.

Butterfly’s innovations have been recognized by Prix Galien USA, Fierce 50, TIME’s Best Inventions and Fast Company’s World Changing Ideas, among other achievements. To learn more, visit: www.butterflynetwork.com

Media:

Liz Learned Snyder

Director, PR and Communications

media@butterflynetinc.com

Investors:

John Doherty

Chief Financial Officer

investors@butterflynetinc.com

Source: Butterfly Network, Inc.

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