Camtek Introduced 5th Generation of the Eagle System Supporting Expected Growth In 2025
Rhea-AI Summary
Camtek (NASDAQ: CAMT) has unveiled its Eagle Generation-5 (Eagle G5) inspection system, marking a significant advancement in inspection and metrology capabilities. The new system offers improved wafer throughput and optical resolution, meeting current market demands and future customer needs. The Eagle G5 is designed for advanced packaging applications such as HPC, CIS, and SiC.
Camtek has already received orders for 2025 deliveries. CEO Rafi Amit expressed excitement about the launch, stating that it will strengthen Camtek's position in 2D inspection and 3D metrology markets. The Eagle G5 is the first of several new products developed in recent years to address upcoming Advanced Packaging technologies, including fine pitch micro bumps and hybrid bonding interconnects.
The company anticipates 2025 to be another growth year, driven by healthy demand in end-markets and contributions from new products.
Positive
- Launch of advanced Eagle Generation-5 (Eagle G5) inspection system
- Improved wafer throughput and optical resolution
- Orders received for 2025 deliveries
- Expectation of strengthened market position in 2D inspection and 3D metrology
- Anticipation of growth in 2025
Negative
- None.
News Market Reaction 1 Alert
On the day this news was published, CAMT gained 1.67%, reflecting a mild positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
The first in a number of new products following recent years' R&D efforts
MIGDAL HAEMEK,

Camtek's Eagle system is the advanced packaging standard solution for current and future 2D inspection and 3D metrology, targeted to applications such as HPC (high performance computing), CIS (CMOS image sensors), SiC (Silicon Carbide), and others. Camtek has already received orders for this system for 2025 deliveries.
Rafi Amit, Camtek's CEO commented, "I am very excited about the launch of our fifth generation Eagle platform. It pushes the boundaries of performance for inspection and metrology and I expect it to strengthen our dominant position in both the 2D inspection and 3D metrology in advanced packaging markets. This system is the first in a number of new products that we have been working on in recent years and will provide inspection and metrology solutions for the upcoming Advanced Packaging technologies that are characterized by fine pitch of micro bumps and hybrid bonding interconnects."
"The healthy demand in our end-markets, together with the initial contribution from our new products, underlies our expectations that 2025 will be another growth year for Camtek."
For more information about Camtek Ltd. and its advanced inspection and metrology solutions, please visit www.camtek.com.
ABOUT CAMTEK LTD.
Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry. Camtek's systems inspect IC and measure IC features on wafers throughout the production process of semiconductor devices, covering the front and mid-end and up to the beginning of assembly (Post Dicing). Camtek's systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry's leading global IDMs, OSATs, and foundries.
With manufacturing facilities in
This press release is available at www.camtek.com
This press release contains statements that may constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on Camtek's current beliefs, expectations and assumptions about its business and industry, all of which may change. Forward-looking statements can be identified by the use of words including "believe," "anticipate," "should," "intend," "plan," "will," "may," "expect," "estimate," "project," "positioned," "strategy," and similar expressions that are intended to identify forward-looking statements, including our expectations and statements relating to the compound semiconductors market and our position in this market and the anticipated timing of delivery of the systems. These forward-looking statements involve known and unknown risks and uncertainties that may cause the actual results, performance or achievements of Camtek to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. Factors that may cause our actual results to differ materially from those contained in the forward-looking statements include, but are not limited to, the effects of the evolving nature of the war situation in
While we believe that we have a reasonable basis for each forward-looking statement contained in this press release, we caution you that these statements are based on a combination of facts and factors currently known by us and our projections of the future, about which we cannot be certain. In addition, any forward-looking statements represent Camtek's views only as of the date of this press release and should not be relied upon as representing its views as of any subsequent date. Camtek does not assume any obligation to update any forward-looking statements unless required by law.
CAMTEK LTD.
Moshe Eisenberg, CFO
Tel: +972 4 604 8308
Mobile: +972 54 900 7100
moshee@camtek.com
INTERNATIONAL INVESTOR RELATIONS
EK Global Investor Relations
Ehud Helft
Tel: (US) 1 212 378 8040
camtek@ekgir.com
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SOURCE Camtek Ltd.