Welcome to our dedicated page for Ceva news (Ticker: CEVA), a resource for investors and traders seeking the latest updates and insights on Ceva stock.
Ceva, Inc. reports news around its silicon and software intellectual property for the Smart Edge, where its Ceva AI fabric portfolio is used to connect, sense and infer in edge devices. Company updates commonly cover IP licensing agreements, royalty trends, design wins and product launches across 5G, cellular IoT, Bluetooth, Wi-Fi, UWB, satellite communications, Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software.
Recurring developments also include quarterly results, conference participation, customer deployments such as spatial audio software in headsets, and board governance changes. Ceva's business model centers on licensing fees, related revenue and royalties from products that incorporate its intellectual property.
Ceva (NASDAQ: CEVA) announced that Bestechnic has integrated Ceva-Waves Wi-Fi 6 and Bluetooth dual-mode IP platforms in their new Bluetooth/Wi-Fi combo products, including the BES2610 and BES2800 families. Bestechnic, having shipped over 1 billion smart audio SoCs with Ceva's Bluetooth technology, is expanding their partnership to address the growing Wi-Fi 6 market, projected to reach 2.7 billion units annually by 2027.
The new combo devices feature Bluetooth 5.4 dual-mode capability and Wi-Fi 6 subsystem, optimized for ultra-low power consumption with 2.4GHz Wi-Fi RX current as low as 14mA. These solutions target smart wearables, smart home, and smart audio applications, particularly focusing on devices requiring high-throughput wireless connectivity and lossless audio streaming capabilities.
Ceva and MediaTek have announced a partnership to integrate Ceva-RealSpace Elevate multi-channel spatial audio with head tracking into MediaTek's Dimensity 9400 flagship 5G smartphone chip. The solution will enhance mobile entertainment experiences through Bluetooth LE Audio.
The collaboration aims to deliver immersive three-dimensional sound environments that replicate natural hearing. The technology will be compatible with True Wireless Stereo (TWS) earbuds and headphones, offering features like stereo content spatialization and precise head tracking. The solution leverages Dimensity 9400's Bluetooth LE Audio capabilities for low latency streaming and improved battery life.
Ceva-RealSpace Elevate, available for licensing to smartphone OEMs, will be demonstrated at CES 2025. The solution supports various audio formats and includes a high-quality microphone array for spatial audio recording.
Ceva has unveiled the Ceva-Waves Links200, a groundbreaking multi-protocol wireless connectivity platform IP that supports next-generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4 technologies. The platform features a new Ceva-developed radio designed for TSMC's 12nm process, delivering data rates up to 7.5 Mbps - more than double traditional Bluetooth speeds.
The Links200 combines Bluetooth HDT with IEEE 802.15.4 support for Zigbee, Thread, and Matter protocols, enabling concurrent multi-link communication. The solution targets hearables, wearables, and wireless consumer electronics, supporting lossless, multi-channel, low-latency audio streaming for devices like TWS earbuds, headsets, and car audio systems.
Key features include full Bluetooth dual mode support, comprehensive integration of RF, modem, controller, and software stacks, advanced audio support, and compatibility with Ceva's sensing and inference IPs.
Ceva-NeuPro-Nano has won the Best IP/Processor of the Year award at the EE Awards Asia event in Taipei. The Neural Processing Units (NPUs) are designed to deliver optimal balance of ultra-low power and performance for embedded AI workloads in consumer, industrial, and AIoT products.
The technology features a fully programmable architecture that efficiently executes Neural Networks, supports advanced machine learning data types, and includes Ceva-NetSqueeze AI compression technology that enables up to 80% memory footprint reduction. The NPUs come with Ceva-NeuPro Studio, a unified AI stack supporting open AI frameworks including LiteRT for Microcontrollers and microTVM.
This solution addresses key challenges in embedded AI implementation, making artificial intelligence more accessible and practical for various applications including voice, vision, predictive maintenance, and health sensing in IoT devices.
Ceva, Inc. (NASDAQ: CEVA), a leading licensor of silicon and software IP for Smart Edge devices, announced its participation in several upcoming investor events and conferences:
- 13th Annual ROTH Technology Conference on November 20, 2024, at the Hard Rock Hotel, New York.
- Barclays 22nd Annual Global Technology Conference on December 11, 2024, at The Palace Hotel, San Francisco.
- Northland Growth Conference 2024 2.0 on December 12, 2024, virtually.
- CES 2025 from January 7-10, 2025, in Las Vegas, Nevada.
- 27th Annual Needham Growth Conference on January 14-15, 2025, at Lotte New York Palace Hotel, NY.
For meetings, contact respective representatives. Ceva's CES 2025 meeting suite is by invitation only, and the Needham conference presentation will be webcast live with details on Ceva's investor relations website.
Ceva reported strong Q3 2024 financial results with total revenue of $27.2 million, up 13% year-over-year. The quarter saw record device shipments of 522 million units, including over 400 million combined Bluetooth, Wi-Fi, and cellular IoT shipments. Licensing revenue increased 12% to $15.6 million, while royalty revenue grew 15% to $11.6 million. The company secured 10 IP licensing agreements and raised its full-year 2024 guidance to 7-9% growth. Non-GAAP net income increased 137% to $3.4 million, with EPS of $0.14. The board authorized an additional 700,000 shares for repurchase.
Ceva has announced an expansion of its share repurchase program, adding 700,000 shares of common stock to the existing plan. Combined with approximately 356,000 shares available under the current program as of September 30, 2024, this brings the total to 1,056,000 shares available for repurchase. The company plans to execute these repurchases through open market or private transactions, subject to market conditions and trading regulations. CEO Amir Panush emphasized that this decision reflects management's confidence in Ceva's business performance and growth strategy, highlighting the company's strong balance sheet position.
Ceva, Inc. (NASDAQ: CEVA), a leading licensor of silicon and software IP for Smart Edge devices, has announced its schedule for the third quarter 2024 earnings release and conference call. The company will release its Q3 2024 results on November 7, 2024, before the NASDAQ market opens. Following the release, Ceva management will host a conference call at 8:30 a.m. Eastern Time to discuss the quarter's operating performance.
The conference call will be accessible via phone for both U.S. and international participants, as well as through a live webcast. For those unable to attend the live broadcast, a replay will be available by phone and on Ceva's website until November 14, 2024.
Ceva and Edge Impulse have announced a collaboration to enhance Ceva-NeuPro-Nano NPUs with support for Edge Impulse Platform. This integration will enable AI developers to rapidly develop, train, and deploy advanced embedded ML applications for Ceva NPUs with cycle-accurate performance, before physical hardware is available.
The partnership aims to accelerate time-to-market for NeuPro-Nano based silicon targeting AIoT devices. Ceva-NeuPro-Nano NPU IP is designed for embedded ML applications, delivering ultra-low power and high performance in a small area. Edge Impulse Platform complements the hardware by providing 'no code' AI tools, simplifying the deployment and benchmarking of embedded ML applications.
This collaboration allows NeuPro-Nano customers to leverage Edge Impulse Platform to unlock the full potential of embedded ML in their AIoT products pre-silicon, facilitating rapid, scalable deployment of edge AI across industries with unprecedented performance.
Ceva (NASDAQ: CEVA) has won the Cabin-Driving Integrated Technology Breakthrough Award at the OFweek China Automotive Industry Awards 2024 for its Ceva-Waves UWB technology. This ultra-wideband IP offers low-power solutions for mobile, automotive, consumer, and IoT applications.
Key features of Ceva-Waves UWB include:
- Centimeter-level accuracy and robust location information
- Time-of-Flight ranging and Angle-of-Arrival processing
- Doppler Radar support for presence/gesture detection
- Compliance with 802.15.4 HRP, FiRa 2.0, and CCC DK3.0 requirements
The technology has been licensed by global automotive semiconductor leaders in China and Japan for automotive sensing applications. It's suitable for various uses, including secure digital key functionality, Child Presence Detection, indoor navigation, asset tracking, and tap-free payment systems.