Ceva Inc. - CEVA STOCK NEWS

Ceva, Inc. launches Ceva-Waves™ Links™ IP Family, a multi-protocol wireless platform IP offering Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter connectivity solutions. The first member, Ceva-Waves Links100, is an IoT-focused platform currently deployed by a leading OEM customer. The demand for versatile connectivity drives the need for consolidated protocols in a single chip, with ABI Research forecasting significant growth in combo chipset shipments by 2028.

Ceva, Inc. joins Arm Total Design to accelerate the development of 5G custom SoCs, combining Arm Neoverse Compute Subsystems with Ceva PentaG-RAN for wireless infrastructure. The integrated offerings aim to lower cost and time-to-market for developing 5G SoCs.

Ceva, Inc. announces the release of RivieraWaves® UWB IP for FiRa 2.0, expanding its market reach beyond automotive and mobile into high-volume UWB navigation, detection, and remote control applications in smart homes, smart factories, and more. The UWB technology offers outstanding performance in micro-location in wireless environments, with a forecasted 14% CAGR in UWB-enabled device shipments over the next five years, reaching nearly 1.3 billion units by 2028.

Ceva, Inc. (NASDAQ: CEVA) reports Q4 revenue of $24.2 million, with GAAP loss per share of 34c, and non-GAAP diluted EPS of 10c. Royalty revenue increased by 13% year-over-year. Strategic license agreements signed with a U.S. based MCU leader for Wi-Fi 6 and a global automotive semiconductor leader for AI-enabling software. Full year saw record cellular IoT royalty revenues and shipments, strong demand for IP, and 53 license agreements signed.

Ceva, Inc. announced that SKAIChips Co. Ltd. has licensed the RivieraWaves Bluetooth 5.4 IP for the development of an Electronic Shelf Label (ESL) IC, aiming to address the growing ESL market. The collaboration aims to leverage Ceva's Bluetooth 5.4 IP to expedite the time to market for a cost-efficient, feature-rich ESL IC with minimal power draw. The ESL market is forecasted to grow significantly, and the adoption of Bluetooth-enabled ESLs is expected to increase. Ceva's Bluetooth 5.4 IP is the first platform to achieve Bluetooth SIG qualification, including all features of the standard, making it well-positioned to address the ESL market opportunity.

Ceva, Inc. (NASDAQ: CEVA) will announce results for the fourth quarter and full year 2023 on February 14, 2024, followed by a conference call to discuss the operating performance for the quarter. The conference call will be available via dial-in numbers and live webcast. A replay will also be available for those who cannot access the live broadcast.

Ceva, Inc. (NASDAQ: CEVA) and Sunplus Technology Co., Ltd. (TWSE: 2401) have expanded their collaboration to integrate Ceva's latest generation RivieraWaves Bluetooth audio solution into the Sunplus airlyra family of HD audio processors targeting wireless speakers, soundbars, and other premium wireless audio devices. The first wireless airlyra processors are already shipping with some of the world's premium audio brands. This collaboration aims to offer immersive audio at a cost-effective price, reduce system cost and complexity, and deliver excellence with the shortest latency and lowest power consumption performance.

Ceva, Inc. (NASDAQ: CEVA) and Actions Technology Co, Ltd. celebrate a monumental achievement as Actions surpasses sales of more than 100 million wireless audio and AIoT chips powered by Ceva's audio, voice, AI sensing, and wireless communications IPs. The long-term collaboration between the two companies has seen world's leading OEMs adopt Actions Technology's high-quality, low-latency wireless audio SoCs for consumer devices, including speakers, soundbars, earbuds, and smartwatches. Actions Technology, a leading fabless semiconductor company of AIoT SoCs, produces chips with industry-leading quality audio, lowest power consumption, and ultra-low latency. The collaboration between Ceva and Actions Technology in the fields of DSP and AI processing in the audio field and related wireless workloads has resulted in the deployment of Actions Technology's audio SoCs and AIoT processors by many of the world's leading customers, including Sony, Harman, Vizio, Honor, Xiaomi, realme, Hisense, TCL, Anker, boAt, Fire-Boltt, Noise, Nothing, Razer, RODE, Iflytek, Moma, and more.

Ceva, Inc. (NASDAQ: CEVA) and THX Ltd. announce RealSpace® Tuned by THX™, a premium software offering for OEMs to add support for immersive spatial audio customized to any audio device including TWS earbuds, wireless headphones, smartphones, speakers, and soundbars.