Ceva Appoints Semiconductor Industry Veteran Ziv Hammer as Executive Vice President to Lead Connectivity & Sensing
Ceva creates a new EVP role to unify connectivity, sensing and CTO functions under veteran semiconductor executive Ziv Hammer.
Rhea-AI Summary
Ceva (CEVA) appointed semiconductor industry veteran Ziv Hammer as Executive Vice President, Connectivity & Sensing, a newly created role reporting to CEO Amir Panush.
The position unifies Ceva's connectivity and sensing businesses and CTO Office under a single leader. Based in Silicon Valley, Hammer will work closely with customers seeking more complete and customized system solutions, particularly for emerging opportunities in Physical AI. He will oversee the Wireless IoT, Mobile Broadband and Sensing & Audio Software businesses and the CTO Office, building on existing technology and market momentum.
Hammer previously held senior roles at Intel, Infineon Technologies and GlobalFoundries, where he led global engineering organizations of more than 1,000 employees and helped customers take complex semiconductor designs from concept to production.
Positive
- None.
Negative
- None.
Key Figures
- Industry experience
- More than two decades
- Ziv Hammer's semiconductor industry experience
- Organizations led
- More than 1,000 employees
- Global engineering organizations previously led by Hammer
Key Terms
silicon ip technical
iot technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
Former Intel, Infineon and GlobalFoundries executive brings more than two decades of experience
developing and commercializing advanced semiconductor technologies, strengthening Ceva's technology
execution and customer relationships from Silicon Valley
Hammer brings more than two decades of experience spanning wireless connectivity, secure IoT, client computing, datacenter infrastructure and silicon IP, with responsibility for developing technologies, building engineering organizations and bringing complex semiconductor products to market. He will lead the company's Wireless IoT, Mobile Broadband and Sensing & Audio Software businesses and CTO Office, building on their technology and market momentum.
Hammer joins Ceva following senior roles at Intel, Infineon Technologies and GlobalFoundries, where he led global engineering organizations of more than 1,000 employees across compute, connectivity, IoT and semiconductor technologies. Most recently, as Senior Vice President, Design Platforms and Services at GlobalFoundries, he worked across technology, IP, design enablement and ecosystem partners to help customers take complex and customized silicon designs from concept to production.
"Ziv combines deep technical expertise with an exceptional track record of building world-class organizations and bringing complex semiconductor technologies from concept to market," said Amir Panush, Chief Executive Officer of Ceva. "As customers look to differentiate their products through increasingly sophisticated system solutions, his experience will be invaluable as we expand our offering toward Physical AI. His leadership and presence in Silicon Valley will also enable us to deepen our engagement with customers and partners and ensure our technologies remain closely aligned with the opportunities they are pursuing."
"I'm excited to join Ceva at a time when the semiconductor industry is being reshaped by increasingly intelligent and connected devices," said Hammer. "Ceva has an exceptional portfolio of technologies and engineering talent, together with a broad customer base across many of the markets driving the smart edge. I look forward to working closely with our teams, customers and partners to turn emerging requirements into differentiated solutions and successful products."
About Ceva
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.
With more than 22 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today's most advanced smart edge products - from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra‑low‑power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva's IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.
Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.

View original content to download multimedia:https://www.prnewswire.com/news-releases/ceva-appoints-semiconductor-industry-veteran-ziv-hammer-as-executive-vice-president-to-lead-connectivity--sensing-302878415.html
SOURCE Ceva, Inc.