Coherent Begins Customer Sampling of 300mm High Thermal Conductivity Silicon Carbide Substrates for AI Infrastructure
Coherent (NYSE: COHR) announced it has begun customer sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates with leading AI semiconductor partners as of August 17, 2026.
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Rhea-AI Summary
Coherent (NYSE: COHR) announced it has begun customer sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates with leading AI semiconductor partners as of August 17, 2026. The move shifts the 300mm SiC platform from internal development into customer evaluation for AI and high-performance computing (HPC) applications.
The vertically integrated platform spans SiC crystal growth, wafering, polishing, and characterization, supporting future high-volume manufacturing. Coherent reports that the substrates are engineered to improve heat spreading by up to 25% versus current solutions while remaining compatible with existing semiconductor manufacturing infrastructure, targeting thermal constraints in next-generation AI processors and datacenters.
Details
Market move: COHR -12.84% in the Aug 18 session. 300mm SiC customer sampling
On Aug 18, the first trading day after this news, COHR closed 12.84% below the previous close. Argus tracked a trough of -9.4% from its starting point during tracking. Our momentum scanner recorded 157 alerts for this stock that day. Relative volume reached 3.5x the daily average during tracking.
Data tracked by StockTitan Argus for the Aug 18 session.
Key Figures
- Substrate Diameter
- 300mm
- Silicon carbide substrates entering customer sampling
- Heat-Spreading Improvement
- up to 25% more
- Compared with current solutions
Previous AI Reports
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CHIPS Act letter of intent for up to $50 million supporting AI manufacturing expansion
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SiC thick epitaxy advanced power-device capability for AI datacenter applications
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AI-scale optical innovations and industry participation presented at OFC 2026
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224Gbps quad TIA launched for 800G and 1.6T optical transceivers
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Executives scheduled OFC 2026 appearances focused on AI networking
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Key Terms
silicon carbide technical
thermal conductivity technical
high-performance computing technical
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SAXONBURG, Pa., Aug. 17, 2026 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners. The milestone advances Coherent’s scalable materials platform for the growing thermal management requirements of artificial intelligence (AI) and high-performance computing (HPC) systems.
As AI processors move toward higher power densities, effective heat removal is becoming a primary constraint on system performance, reliability, and datacenter efficiency. Customer sampling moves Coherent’s 300mm SiC platform from internal development to customer evaluation across the AI semiconductor ecosystem.
Silicon carbide combines high thermal conductivity, mechanical strength, and thermal stability for next-generation heat spreaders and related packaging solutions. Coherent’s vertically integrated capabilities in SiC crystal growth, wafering, polishing, and characterization provide control across the production process and support progression toward future high-volume manufacturing. The high thermal conductivity substrates are engineered to improve heat spreading by up to
“AI performance is increasingly constrained by the industry’s ability to remove heat from next-generation processors,” said Craig Mullaney, Senior Vice President and General Manager at Coherent. “Advanced SiC thermal management materials can play an important role in addressing that challenge. By combining decades of silicon carbide expertise with a scalable 300mm manufacturing platform, Coherent is helping build the materials foundation for future AI infrastructure.”
This milestone marks the next step in Coherent’s roadmap to expand its 300mm SiC platform for AI and high-performance computing. By combining customer engagement, vertically integrated materials expertise, and a scalable manufacturing strategy, Coherent is positioning its SiC capabilities to support successive generations of AI infrastructure.
For more information, please visit: https://www.coherent.com/news/press-releases/Coherent-expands-silicon-carbide-platform-with-300mm-capability-to-support-growing-demand-of-ai-and-datacenters.
About Coherent
Coherent is the global photonics leader. We harness photons to drive innovation. Industry leaders in the datacenter, communications, and industrial markets rely on Coherent’s world-leading technology to fuel their own innovation and growth.
Founded in 1971 and operating in more than 20 countries, Coherent brings the industry’s broadest, deepest technology stack; unmatched supply chain resilience; and global scale to help its customers solve their toughest technology challenges. For more information, visit us at coherent.com.
Media Contact:
innovations@coherent.com
An image accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/3c1bdb4c-c9ee-4556-ac7d-7022f3f1fce3
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