Credo to Showcase 1.6T Optical Connectivity Solutions for AI Scale-Out Fabrics at ECOC 2026

Credo plans live ECOC 2026 demos of 1.6T optics and observability tools tailored for large-scale AI and cloud networks.

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SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, will showcase its latest optical connectivity technologies and silicon photonics innovations at ECOC 2026, taking place September 21-23 at FYCMA in Málaga, Spain.

Credo Booth Demonstration Highlights (Booth #2056)

• 1.6T 2xDR4 Fully Retimed Module
  Powered by Credo's Cardinal 802 1.6T DSP and Kfir 200G silicon photonics PIC, the solution delivers advanced optical connectivity to support the growing bandwidth demands of AI and cloud infrastructure.
• 800G & 1.6T ZeroFlap Optics + PILOT
  High-performance optical interconnect solutions featuring real-time link health monitoring and root-cause diagnostics through the Credo PILOT observability platform, enabling greater visibility and reliability at AI scale.

Presentations

• Workshop: Can Fast Narrow Channels Keep Rising Without Limit or Will Slow and Wide Become the Winner?
  September 20 at 4:00 p.m., PV-R Multipurpose Room
  Credo Speaker: Mohsen Asad, Senior Director of Core Technology
• Presentation: Scaling Optical Reliability with Bandwidth Across AI Clusters
  September 23 at 2:40 p.m., Market Focus Theatre
  Credo Speaker: Rajan Pai, Vice President of Optical Solutions

To request a meeting or product demo, please contact sales@credosemi.com.

About Credo

Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI.

Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photonics-based photonic integrated circuits (SiPho PICs) and DSPs; OmniConnect AI memory and chip-to-chip interconnect; and retimers for Ethernet and PCIe—supported by our PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world.

For more information, please visit https://www.credosemi.com. Follow Credo on LinkedIn.

Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260918966627/en/

Media Contact:
Kristin Hehir
kristin.hehir@credosemi.com

Investor Contact:
Dan O’Neil
dan.oneil@credosemi.com

Source: Credo

Key Terms

silicon photonics technical

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

silicon photonics PIC technical

A silicon photonics PIC is a photonic integrated circuit built on silicon that sends, controls and processes light signals on a chip much like an electronic chip routes electrons. Think of it as replacing bundles of tiny fiber-optic parts with a single microchip that handles lasers, modulators and detectors. It matters to investors because the technology can lower power, size and cost for high-speed data links, telecom and sensing markets, which affects companies’ growth and capital needs.

optical interconnect technical

Optical interconnect is a way of linking electronic components using pulses of light instead of traditional electrical wires, like swapping copper cables for fiber-optic highways inside and between devices. It matters to investors because light-based connections can carry much more data, use less power and generate less heat than electrical links, which can lower operating costs and enable faster, more scalable products for data centers, telecom and high-performance computing markets.