Credo to Showcase Broad Portfolio of Connectivity Solutions for AI Scale-Out and Scale-Up Fabrics at 2026 OCP Global Summit

Credo (CRDO) will showcase optical and copper connectivity products at the 2026 OCP Global Summit, taking place October 12–15 in San Jose.

See more from StockTitan in Google Search and AI answers. Adds StockTitan as a preferred source · opens Google

Add on Google Not now

SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, will showcase its newest optical and copper interconnect products for scaling AI infrastructure at OCP Global Summit 2026, which takes place October 12-15 at the San Jose Convention Center.

Credo will showcase its newest optical and copper interconnect products for scaling AI infrastructure at OCP Global Summit 2026, which takes place October 12-15 at the San Jose Convention Center.

Credo Booth Demonstration Highlights (Booth B2, October 13-15)

• Micro-Emitter NPO Enabled Optical Backplane for Scale-Up: Through collaboration with SENKO, Credo has developed a high-reliability micro-emitter blind-mate optical backplane architecture that delivers up to 10x higher bandwidth compared to the latest copper backplanes.
• 1.6T ZeroFlap Active Light Cable (ALC): Closes a mid-reach gap between copper’s distance limits and the power and cost overhead of traditional pluggable optics.
• 1.6T ZeroFlap Optics: Transceivers featuring Credo’s latest ZeroFlap DSP and integrated silicon photonics, paired with real-time link telemetry through the Credo PILOT observability platform.
• 1.6T ZeroFlap Active Electrical Cable (AEC): Advanced AEC solution delivering high-speed AI interconnects with real-time functional testing, diagnostics, and fault analysis through PILOT.
• Toucan Gen6 PCIe AEC: PCIe rack-level connectivity solution for GPU-intensive AI workloads, using PILOT to provide real-time telemetry and rapid fault isolation; demonstrated on the CWF Intel platform.
• OmniConnect Weaver: Credo’s FPGA-implementation of its memory fanout gearbox (Weaver), breaking the AI inference memory wall; demonstrated with a live, interactive GUI.
• 1.6T Cardinal DSP + SiPho Integration: A fully integrated optical module pairing Credo’s 1.6T Cardinal DSP with an in-house Silicon Photonics PIC, demonstrating multi-vendor live interoperability.

Featured Sessions:

• Executive Session with Credo President and CEO Bill Brennan
  Wider. Slower. Better: Optics That Can Beat Copper
  October 12 at 3:20 p.m. – Lower Level – LL21DE
• Expo Hall Session with Credo AVP of Product LK Bhupathi
  Going Wide: Scalable and Reliable Optical Interconnects for AI Clusters
  October 13 at 3:30 p.m. – Concourse Level – Expo Hall Theater

Presentations:

• More Signal, Less Noise: Improving AI Cluster Returns Through Standardized Transceiver Telemetry in the OCP Optics Reliability Workstream
  October 13 at 2:05 p.m. – Concourse Level – 210AE
  Chris Collins, Credo AVP of Sales & Optical Product Marketing, Credo
• Extending Community SONiC for Advanced Optics Telemetry Aligned with OCP Standards
  October 14 at 3:40 p.m. – Concourse Level – 230A
  Rajan Pai, VP of Optical Solutions, Credo
• An Open Lightweight Serial Interconnect for Composable AI Architectures
  October 15 at 2:15 p.m. – Concourse Level – 211
  Vishal Shah, VP of Product, Credo
  Allan Cantle, CEO, Nallasway

To request a meeting or product demo, please contact sales@credosemi.com.

About Credo

Credo’s mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. Our high-speed copper and optical interconnect technologies deliver industry-leading power and performance from chip to cluster to meet the ever-expanding data infrastructure demands of AI.

Our vertically integrated connectivity portfolio is comprised of our flagship purple ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers; optical components including silicon photonics-based photonic integrated circuits (SiPho PICs) and DSPs; OmniConnect AI memory and chip-to-chip interconnect; and retimers for Ethernet and PCIe—supported by our PILOT diagnostic and analytics software platform. Credo innovations enable our customers to connect the systems that connect the world.

For more information, please visit https://www.credosemi.com. Follow Credo on LinkedIn.

Credo, the Credo logo and the color purple when associated with AECs are registered trademarks of Credo Technology Group Limited in the United States and other jurisdictions. All other trademarks referenced herein are the property of their respective owners.

View source version on businesswire.com: https://www.businesswire.com/news/home/20261009157633/en/

Media Contact:
Kristin Hehir
kristin.hehir@credosemi.com

Investor Contact:
Dan O’Neil
dan.oneil@credosemi.com

Source: Credo

Key Terms

silicon photonics technical

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

fpga technical

A field-programmable gate array (FPGA) is a type of computer chip whose internal wiring can be changed after it is made, allowing engineers to program custom hardware functions without designing a new chip. For investors, FPGAs matter because that flexibility lets companies quickly adapt products to new software, standards, or customer needs—like a toolbox that can be rearranged to build different machines—so demand and pricing can shift with trends in data centers, telecommunications, AI, and specialized electronics.

pcie technical

PCIe (PCI Express) is a high-speed connection standard used inside computers and servers to link components like graphics cards, storage drives, and network adapters so they can send data quickly to each other. Investors care because faster, more efficient PCIe support can make a product more competitive—think of it as wider, faster highway lanes for data—which affects device performance, upgrade flexibility, manufacturing cost and customer demand.

blind-mate technical

A blind-mate is a type of connector or mating arrangement that allows two components to connect securely without the person having to see the connection point. It uses alignment features, tapered guides, spring-loaded contacts or sliding interfaces so a board, module, cable or cartridge can be pushed into place and make electrical and/or mechanical contact automatically; common examples include modules that slide into a chassis or rack and mate with a backplane. Blind-mate designs trade off the need for visual alignment for requirements on precise guides, tolerances and contact durability, and they may include features to prevent damage from misalignment or repeated insertions.