DuPont™ Pyralux® ML Wins New Product Introduction (NPI) Award from Circuits Assembly

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DuPont has announced that its Pyralux® ML Series of double-sided metal-clad laminates has won the 2025 NPI Award in the Laminates category from Circuits Assembly. The award, presented by the Printed Circuit Engineering Association (PCEA), recognizes innovative products in electronics assembly.

Launched in April 2024, Pyralux® ML laminates are designed for flexible and rigid-flex printed circuit boards (PCBs), specifically targeting high-reliability markets including aerospace, defense, electric vehicles, and AI-related networking. The laminates feature metal alloy components like copper-nickel (CuNi) and Kapton® all-polyimide dielectric technology, offering optimized resistivity and thermal management capabilities.

The evaluation criteria included innovation, compatibility, cost-effectiveness, design, reliability, flexibility, performance, and speed. According to Global Business Director Thean Ming Tan, the product is proving to be premier for optimizing thermal management in high-performance applications.

Award Recognizes the Leading New Products for Electronics Assembly

WILMINGTON, Del., March 11, 2025 /PRNewswire/ -- DuPont today proudly announced that its DuPont™ Pyralux^® ML Series of double-sided metal-clad laminates, has received the 2025 NPI Award in the Laminates category. The NPI Award, presented by Circuits Assembly, a publication run by PCEA (Printed Circuit Engineering Association), recognizes the most innovative and leading new products within the electronics assembly industry, including equipment, materials, and software, as judged by an independent panel of practicing industry engineers.

Launched in April 2024, Pyralux^® ML laminates are a unique addition to the extensive family of Pyralux^® laminates for flexible and rigid-flex printed circuit boards (PCBs). Developed for optimal thermal management, these laminates are an ideal solution for high-reliability markets such as aerospace, defense, electric vehicles (EVs), artificial intelligence (AI)-related networking and other electronic devices. The Pyralux^® ML laminate series provides exceptional performance in challenging environments, making it a versatile and innovative solution for many different applications.

Evaluations were based on a variety of criteria including creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, performance, user-friendliness, and speed/throughput. DuPont's trailblazing Pyralux^® ML laminates contain metal alloy, such as copper-nickel (CuNi), featuring Kapton^® all-polyimide dielectric technology. The alloys provide optimized resistivity for higher heat output, reduced thermal conductivity for better control of heat transfer, and thermoelectric properties as needed for the application.

"I'm thrilled that our Pyralux^® team has been recognized for their tremendous work on this innovative technology," said Thean Ming Tan, Global Business Director, Advanced Flex Technologies, DuPont Interconnect Solutions. "Pyralux^® ML is proving to be the premiere product for optimizing thermal management, a key performance factor for industries with high-performance, high-reliability requirements including aerospace, defense and critical industrial applications. Receiving this honor from a panel of industry experts underscores the value our products provide for our customers."

To learn more about DuPont's Pyralux^® ML laminates and other offerings, visit DuPont Interconnect Solutions at IPC APEX Expo. The company will exhibit and present PowerChats in the Insulectro Technology Village, Booth 4138, and will share Booth 3916 with Tritek Circuit Products. 

To learn more about the award, please visit the Circuits Assembly website.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont 
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.  

DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, ℠ or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted.  

 

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SOURCE DuPont

FAQ

What is the significance of DuPont's Pyralux ML winning the 2025 NPI Award?

The award recognizes Pyralux ML as a leading innovative product in the Laminates category for electronics assembly, validated by industry engineers for its thermal management capabilities and high-reliability applications.

What are the key features of DuPont's Pyralux ML Series laminates?

The laminates feature metal alloys like copper-nickel, Kapton polyimide technology, optimized resistivity, and enhanced thermal conductivity control for high-performance PCB applications.

Which industries are the target markets for DuPont's Pyralux ML laminates?

The laminates are designed for aerospace, defense, electric vehicles (EVs), AI-related networking, and other electronic devices requiring high reliability.

When was DuPont's Pyralux ML Series launched and what problem does it solve?

Launched in April 2024, Pyralux ML addresses thermal management challenges in flexible and rigid-flex printed circuit boards for high-reliability applications.