New CPC Solution Tackles Growing Liquid Cooling Needs for AI
Rhea-AI Summary
Dover's (NYSE:DOV) subsidiary CPC has unveiled the Everis® UQD06 Series connectors, a new liquid cooling solution specifically designed for AI computing applications. The product features a larger 3/8-inch flow path and joins CPC's universal quick disconnect (UQD) line targeting hyperscale AI, data centers, and high-performance computing.
According to Hyperion Research, liquid cooling adoption in HPC/AI sites is expected to increase from current two-thirds to nearly 80% within the next 12-18 months. The new solution addresses the growing demand for optimized cooling systems capable of handling the substantial heat generated by AI workloads.
Positive
- Introduction of innovative UQD06 Series connectors with larger 3/8-inch flow path for enhanced cooling capacity
- Strong market opportunity with liquid cooling adoption in HPC/AI expected to reach 80% in 12-18 months
- Strategic positioning as technology partner to leading chip manufacturers and cooling integrators
Negative
- Higher flow rates may require increased pumping capabilities, potentially affecting system design and energy efficiency
News Market Reaction 1 Alert
On the day this news was published, DOV declined 2.24%, reflecting a moderate negative market reaction.
Data tracked by StockTitan Argus on the day of publication.
Everis® UQD06 Series connectors are designed specifically to handle AI's higher-flow liquid cooling requirements. The product is the latest in CPC's universal quick disconnect (UQD) line, which is purpose-built for hyperscale AI, data center and high-performance computing (HPC) applications.
"The substantial heat generated by AI workloads requires new ways to optimize flow in liquid cooling systems," said Patrick Gerst, General Manager of CPC's thermal business unit. "With the UQD06 Series, CPC is building on our long track record of delivering much-needed solutions for efficient cooling. We remain focused on supporting AI's expansion and unique liquid cooling specifications through innovation at scale."
While higher flow rates alone can improve cooling, the industry is seeking optimized cooling. "Increased flow often requires higher pumping capabilities, which can affect overall system design and energy efficiency," said Gerst. "Increasing the connector's flow path size is one way to add flow capacity."
According to Hyperion Research, about two-thirds of HPC/AI sites have implemented some form of liquid cooling, with adoption expected to reach nearly
"As a trusted technology partner to leading chip manufacturers and cooling integrators, we provide solutions that help protect mission-critical applications, particularly as AI continues to scale rapidly," says Michael Studer, Vice President of the CPC business unit.
For more information about the performance and versatility of CPC's liquid cooling portfolio or any of the other 10,000+ innovative connection solutions CPC offers, visit cpcworldwide.com.
About CPC:
CPC (Colder Products Company) is the leading provider of quick disconnect couplings, fittings and connectors for thermal management (liquid cooling of electronics), life sciences, biopharma, industrial and chemical handling markets. During its nearly 50 year-history, CPC has built a portfolio of 10,000-plus connector products. CPC is a business unit of Pump Solutions Group (PSG), an operating company within Dover Corporation.
About Dover:
Dover is a diversified global manufacturer and solutions provider with annual revenue of over
CPC Contact:
Jana Stender
(612) 564-2053
jana.stender@cpcworldwide.com
Dover Media Contact:
Adrian Sakowicz, VP, Communications
(630) 743-5039
asakowicz@dovercorp.com
Dover Investor Contact:
Jack Dickens, VP, Investor Relations
(630) 743-2566
jdickens@dovercorp.com
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SOURCE Dover