Pacific Sun Packaging, a Subsidiary of PMGC Holdings, Announces Attendance at 2025 ITAD Summit to Showcase Custom Protective Packaging for Enterprise IT Hardware
Pacific Sun Packaging, a subsidiary of PMGC Holdings (NASDAQ: ELAB), has announced its first-time participation in the 2025 ITAD Summit in Las Vegas. The company will showcase its custom-engineered protective packaging solutions for IT hardware at Booth A07 on July 29-30, 2025 at The Bellagio.
Founded in 2011, Pacific Sun specializes in protective packaging for sensitive IT components including CPUs, DIMMs, SSDs, HDDs, and fiber-optic modules. Their solutions cater to OEMs, data centers, and ITAD firms, focusing on ESD safety, dimensional precision, and supply chain durability. The company aims to strengthen existing relationships with data center operators and develop new partnerships in IT lifecycle management.
Pacific Sun Packaging, una controllata di PMGC Holdings (NASDAQ: ELAB), ha annunciato la sua prima partecipazione al 2025 ITAD Summit a Las Vegas. L'azienda presenterà le sue soluzioni di imballaggi protettivi su misura per hardware IT presso il Padiglione A07 il 29-30 luglio 2025 al Bellagio.
Fondata nel 2011, Pacific Sun è specializzata in imballaggi protettivi per componenti IT sensibili come CPU, DIMM, SSD, HDD e moduli in fibra ottica. Le loro soluzioni si rivolgono a OEM, data center e aziende ITAD, con particolare attenzione alla sicurezza ESD, alla precisione dimensionale e alla resistenza nella catena di approvvigionamento. L'azienda punta a rafforzare i rapporti esistenti con gli operatori di data center e a sviluppare nuove collaborazioni nella gestione del ciclo di vita IT.
Pacific Sun Packaging, una subsidiaria de PMGC Holdings (NASDAQ: ELAB), ha anunciado su primera participación en la Cumbre ITAD 2025 en Las Vegas. La empresa exhibirá sus soluciones de embalaje protector personalizadas para hardware de TI en el Stand A07 los días 29 y 30 de julio de 2025 en The Bellagio.
Fundada en 2011, Pacific Sun se especializa en embalajes protectores para componentes sensibles de TI como CPUs, DIMMs, SSDs, HDDs y módulos de fibra óptica. Sus soluciones están dirigidas a OEMs, centros de datos y empresas ITAD, enfocándose en la seguridad ESD, precisión dimensional y durabilidad en la cadena de suministro. La compañía busca fortalecer las relaciones existentes con operadores de centros de datos y desarrollar nuevas asociaciones en la gestión del ciclo de vida de TI.
Pacific Sun Packaging은 PMGC Holdings (NASDAQ: ELAB)의 자회사로서, 라스베이거스에서 열리는 2025 ITAD 서밋에 처음으로 참가한다고 발표했습니다. 이 회사는 2025년 7월 29-30일에 The Bellagio의 부스 A07에서 IT 하드웨어용 맞춤형 보호 포장 솔루션을 선보일 예정입니다.
2011년에 설립된 Pacific Sun은 CPU, DIMM, SSD, HDD, 광섬유 모듈 등 민감한 IT 부품을 위한 보호 포장에 특화되어 있습니다. 이들의 솔루션은 OEM, 데이터 센터, ITAD 업체를 대상으로 하며, ESD 안전, 치수 정확성, 공급망 내구성에 중점을 둡니다. 회사는 데이터 센터 운영자와의 기존 관계를 강화하고 IT 수명 주기 관리에서 새로운 파트너십을 구축하는 것을 목표로 하고 있습니다.
Pacific Sun Packaging, une filiale de PMGC Holdings (NASDAQ: ELAB), a annoncé sa première participation au ITAD Summit 2025 à Las Vegas. L'entreprise présentera ses solutions d'emballage protecteur sur mesure pour le matériel informatique au stand A07 les 29 et 30 juillet 2025 au Bellagio.
Fondée en 2011, Pacific Sun est spécialisée dans les emballages protecteurs pour composants informatiques sensibles tels que les CPU, DIMM, SSD, HDD et modules à fibre optique. Leurs solutions s'adressent aux OEM, centres de données et entreprises ITAD, mettant l'accent sur la sécurité ESD, la précision dimensionnelle et la durabilité de la chaîne d'approvisionnement. L'entreprise vise à renforcer ses relations existantes avec les opérateurs de centres de données et à développer de nouveaux partenariats dans la gestion du cycle de vie informatique.
Pacific Sun Packaging, eine Tochtergesellschaft von PMGC Holdings (NASDAQ: ELAB), hat ihre erstmalige Teilnahme am 2025 ITAD Summit in Las Vegas angekündigt. Das Unternehmen wird seine maßgeschneiderten Schutzverpackungslösungen für IT-Hardware am Stand A07 vom 29. bis 30. Juli 2025 im Bellagio präsentieren.
Gegründet im Jahr 2011, spezialisiert sich Pacific Sun auf Schutzverpackungen für empfindliche IT-Komponenten wie CPUs, DIMMs, SSDs, HDDs und Glasfasermodule. Ihre Lösungen richten sich an OEMs, Rechenzentren und ITAD-Unternehmen und legen den Fokus auf ESD-Sicherheit, präzise Maße und Haltbarkeit in der Lieferkette. Das Unternehmen möchte bestehende Beziehungen zu Rechenzentrumsbetreibern stärken und neue Partnerschaften im IT-Lifecycle-Management aufbauen.
- None.
- None.
- Serving Data Centers, ITAD Firms, and OEMs with U.S.-Engineered, High-Precision Solutions
- Showcasing U.S. designed Protective Packaging Built for Data Centers and Circular IT
NEWPORT BEACH, Calif., July 17, 2025 (GLOBE NEWSWIRE) -- Pacific Sun Packaging Inc., a subsidiary of PMGC Holdings Inc. (NASDAQ: ELAB) (the “Company,” “PMGC,” “we,” or “our”), a leader in high-precision, component-specific packaging for IT and electronics hardware, is pleased to announce its participation in the 2025 ITAD Summit in Las Vegas, Nevada, marking the company’s first appearance at the event. The company will exhibit at Booth A07 on July 29 - 30, 2025 at The Bellagio, Las Vegas, NV
Founded in 2011, Pacific Sun Packaging specializes in custom-engineered solutions to protect delicate IT components, including CPUs, DIMMs, SSDs, HDDs, and fiber-optic modules throughout storage, transport, and resale. The company’s solutions are widely used by OEMs, data centers, and ITAD firms requiring packaging that meets rigorous standards for ESD safety, dimensional precision, and supply chain durability.
“As the ITAD and data center industries evolve, packaging needs have become more technical and more critical,” said Mike Kerzie, Chief Executive Officer at Pacific Sun Packaging. “We’re proud to bring our U.S.-made, enterprise-grade packaging solutions to the summit and support the circular IT economy.”
The summit provides an opportunity for Pacific Sun to reconnect with its existing customer base primarily in data center operations and build relationships with new partners in the IT lifecycle management space. Known for its fast design cycles and scalable production, the company offers tailored packaging strategies that enhance resale value, reduce returns, and streamline integration.
Visit Pacific Sun Packaging at Booth A07 to explore how precision-engineered packaging solutions can improve your asset protection strategy.
About Pacific Sun Packaging Inc.
Founded in 2011, Pacific Sun Packaging Inc. is a specialty packaging provider focused on high-precision, component-level packaging solutions for the electronics and information technology (IT) hardware industries. The company’s solutions are trusted by OEMs, distributors, and contract manufacturers across the semiconductor, data center, and networking supply chains. Headquartered in San Clemente, California, Pacific Sun delivers reliable, scalable packaging built in America.
About PMGC Holdings Inc.
PMGC Holdings Inc. is a diversified holding company that manages and grows its portfolio through strategic acquisitions, investments, and development across various industries. We are committed to exploring opportunities in multiple sectors to maximize growth and value. For more information, please visit https://www.pmgcholdings.com.
Forward-Looking Statements
Statements contained in this press release regarding matters that are not historical facts are “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995, as amended. Words such as “believes,” “expects,” “plans,” “potential,” “would” and “future” or similar expressions such as “look forward” are intended to identify forward-looking statements. Forward-looking statements are made as of the date of this press release and are neither historical facts nor assurances of future performance. Instead, they are based only on our current beliefs, expectations and assumptions regarding the future of our business, future plans and strategies, projections, anticipated events and trends, the economy, activities of regulators and future regulations and other future conditions. Because forward-looking statements relate to the future, they are subject to inherent uncertainties, risks and changes in circumstances that are difficult to predict and many of which are outside of our control. Although the Company believes that the expectations expressed in these forward-looking statements are reasonable, it cannot assure you that such expectations will turn out to be correct, and the Company cautions investors that actual results may differ materially from the anticipated results. Therefore, you should not rely on any of these forward-looking statements. These and other risks are described more fully in PMGC’s filings with the United States Securities and Exchange Commission (“SEC”), including the “Risk Factors” section of the Company’s Annual Report on Form 10-K for the year ended December 31, 2024, filed with the SEC on March 28, 2025, and its other documents subsequently filed with or furnished to the SEC. Investors and security holders are urged to read these documents free of charge on the SEC’s web site at www.sec.gov. All forward-looking statements contained in this press release speak only as of the date on which they were made. Except to the extent required by law, the Company undertakes no obligation to update such statements to reflect events that occur or circumstances that exist after the date on which they were made.
Investor Relations Contact:
FAQ
When and where is Pacific Sun Packaging (NASDAQ: ELAB) presenting at the 2025 ITAD Summit?
What types of IT components does Pacific Sun Packaging provide protection solutions for?
Who are the main customers of Pacific Sun Packaging's protective solutions?
What is Pacific Sun Packaging's approach to custom packaging solutions?
