Flex Expands Liquid Cooling Footprint at Equinix Co-Innovation Facility
Flex (NASDAQ: FLEX) deployed a rack-level liquid cooling demonstration at the Equinix Co-Innovation Facility in Ashburn, Virginia on Nov 12, 2025. The demo integrates JetCool single-phase direct liquid cooling (DLC) into a single OCP ORv3 rack combining rack, cooling, and power products from Flex.
Key technical highlights include JetCool SmartPlate for Dell PowerEdge R760 (closed-loop, no external CDU), SmartPlate's 15% total IT power reduction, DLC operation at coolant inlet temperatures up to 70°C with up to 90% water savings and 50% lower cooling power, a SmartSense 6U L2L CDU supporting up to 300kW, and cold-plate cooling up to 4kW per socket.
Flex (NASDAQ: FLEX) ha realizzato una dimostrazione di raffreddamento liquido a livello rack presso la Equinix Co-Innovation Facility di Ashburn, Virginia, il 12 nov 2025. La dimostrazione integra JetCool raffreddamento liquido diretto a singola fase (DLC) in un unico rack OCP ORv3 combinando prodotti rack, raffreddamento e alimentazione di Flex.
Principali punti tecnici includono JetCool SmartPlate per Dell PowerEdge R760 (ciclo chiuso, nessuna CDU esterna), la riduzione del 15% della potenza IT totale, l'operatività DLC a temperature di ingresso del refrigerante fino a 70°C con fino a un risparmio del 90% sull'acqua e 50% in meno potenza di raffreddamento, una CDU SmartSense 6U L2L che supporta fino a 300 kW, e raffreddamento a piastra fredda fino a 4 kW per socket.
Flex (NASDAQ: FLEX) desplegó una demostración de enfriamiento líquido a nivel de rack en las instalaciones de co-innovación de Equinix en Ashburn, Virginia, el 12 de noviembre de 2025. La demostración integra JetCool enfriamiento líquido directo de una sola fase (DLC) en un solo rack OCP ORv3, combinando productos de rack, enfriamiento y energía de Flex.
Entre los aspectos técnicos clave se incluyen JetCool SmartPlate para Dell PowerEdge R760 (circuito cerrado, sin CDU externa), la reducción del 15% de la potencia total de TI, operación DLC a temperaturas de entrada del refrigerante de hasta 70°C con hasta un ahorro de agua del 90% y 50% menos potencia de enfriamiento, una CDU SmartSense 6U L2L compatible con hasta 300 kW, y enfriamiento en placa fría de hasta 4 kW por socket.
Flex (NASDAQ: FLEX)는 버지니아주 애슈번의 Equinix Co-Innovation Facility에서 랙 수준의 액체 냉각 시연을 2025년 11월 12일에 배치했습니다. 이 시연은 Flex의 랙, 냉각 및 전력 제품을 하나의 OCP ORv3 랙에 결합한 단일 상(DLC)을 JetCool로 통합합니다.
주요 기술 하이라이트로는 Dell PowerEdge R760용 JetCool SmartPlate(루프 종료, 외부 CDU 불필요), SmartPlate의 총 IT 전력 15% 감소, 냉각수 유입 온도 최대 70°C에서 DLC 작동, 최대 90%의 물 절감 및 냉각 전력 50% 감소, 300kW까지 지원하는 SmartSense 6U L2L CDU, 및 소켓당 4kW까지의 차가운 플레이트 냉각이 포함됩니다.
Flex (NASDAQ: FLEX) a déployé une démonstration de refroidissement liquide au niveau du rack dans l'Équinix Co-Innovation Facility à Ashburn, Virginie, le 12 novembre 2025. La démonstration intègre le refroidissement liquide direct à phase unique JetCool (DLC) dans un seul rack OCP ORv3, en combinant les produits rack, refroidissement et alimentation de Flex.
Les points techniques clés incluent le JetCool SmartPlate pour Dell PowerEdge R760 (circulation fermée, sans CDU externe), la réduction de 15% de la puissance IT totale, le fonctionnement DLC à des températures d'entrée du liquide jusqu'à 70°C avec jusqu'à 90% d'économie d'eau et 50% de réduction de la puissance de refroidissement, une CDU SmartSense 6U L2L supportant jusqu'à 300 kW, et un refroidissement par plaque froide jusqu'à 4 kW par socket.
Flex (NASDAQ: FLEX) führte eine Demonstration der Flüssigkeitskühlung auf Rack-Ebene in der Equinix Co-Innovation Facility in Ashburn, Virginia, am 12. November 2025 durch. Die Demonstration integriert JetCool Direct Liquid Cooling (DLC) in einem einzelnen OCP ORv3 Rack und kombiniert Rack-, Kühl- und Stromprodukte von Flex.
Zu den technischen Highlights gehören JetCool SmartPlate für Dell PowerEdge R760 (Kreislauf geschlossen, keine externe CDU), SmartPlate's 15% Reduzierung der gesamten IT-Leistung, DLC-Betrieb bei Kühlmittelzufuhrtemperaturen bis zu 70°C mit bis zu 90% Wasserersparnis und 50% weniger Kühlleistung, eine SmartSense 6U L2L CDU, die bis zu 300 kW unterstützt, und eine kalte Plattenkühlung bis zu 4 kW pro Socket.
Flex (NASDAQ: FLEX) نفذت عرضاً لتبريد سائل على مستوى الرف في منشأة Equinix Co-Innovation في آشبورن، فيرجينيا في 12 نوفمبر 2025. يدمج العرض JetCool التبريد السائل المباشر ذو الطور الواحد DLC في رف OCP ORv3 واحد مع دمج منتجات الرف والتبريد والطاقة من Flex.
تشمل النقاط التقنية الرئيسية JetCool SmartPlate لـ Dell PowerEdge R760 (دائرة مغلقة، بدون CDU خارجية)، تقليل 15% من إجمالي طاقة IT، تشغيل DLC عند درجات حرارة مدخل المبرد حتى 70°C مع توفير حتى 90% من الماء وتوفير 50% في قدرة التبريد، CDU SmartSense 6U L2L تدعم حتى 300 kW، وتبريد على اللوحة الباردة حتى 4 kW لكل مقبس.
- 15% reduction in total IT power consumption from SmartPlate
- DLC reduces water usage by up to 90%
- Cooling power consumption lowered by up to 50% versus other liquid cooling
- SmartSense 6U CDU supports up to 300kW in a 6U rackmount
- Cold-plate cooling capacity of 4kW per processor socket
- Demonstration limited to on-site deployments; no commercial contract value disclosed
- Demo uses specific Dell PowerEdge R760/R660 models, limiting immediate generality
Insights
Flex deployed an integrated single-phase DLC rack at Equinix CIF, demonstrating measurable power and water savings for high-density AI/HPC environments.
Flex integrated JetCool single-phase direct liquid cooling into an OCP ORv3 rack at the Equinix Co-Innovation Facility on
The disclosed metrics are concrete: a
Key dependencies and risks are clear from the content: actual customer benefit depends on integration with facility secondary loops (the Equinix TCS interface is highlighted) and on demonstrated live performance in production settings. The on-site demonstration and live metrics at Equinix CIF reduce uncertainty, but broader commercial outcomes will depend on adoption at additional sites in Europe and Asia, installer/operator acceptance of warmer inlet temperatures, and sustained support and warranty performance over time.
Watch for three near-term, monitorable items: live performance metrics at the Equinix CIF (on-site demonstration), additional demonstrations planned in Europe and Asia, and any reported customer adoption beyond demonstrations. Expect observable signals within the next 6–18 months as demonstrations convert to deployments.
New rack-level demonstration in
News summary
- Demonstration showcases standalone and facility-integrated single-phase direct liquid cooling (DLC) capabilities incorporated into a single OCP ORv3 rack
- DLC solution reduces data center water and power consumption significantly in AI and high-performance computing (HPC) environments
This latest deployment will incorporate standalone and facility-integrated single-phase direct liquid cooling (DLC) capabilities from JetCool, a Flex company specializing in advanced liquid cooling technologies, into a single Open Compute Project (OCP) ORv3 rack. The entire system — rack, cooling solution, power products — is manufactured by Flex, whose end-to-end portfolio is uniquely suited to solve for data center power, heat, and scale challenges globally.
The deployment at the Equinix CIF will feature:
- JetCool's self-contained SmartPlate System for Dell PowerEdge R760 servers, which delivers closed-loop cooling while eliminating the need for external coolant distribution units (CDUs) or facility plumbing, enabling customers to transition from air to liquid cooling with minimal disruption. SmartPlate Systems have demonstrated a 15 percent reduction in total IT power consumption, enabling customers to maximize compute in power constrained environments.
- DLC capabilities for two Dell PowerEdge R660 systems equipped with JetCool cold plates. JetCool's DLC solutions are designed to operate with very warm coolant inlet temperatures — up to 70°C — reducing water usage by up to 90 percent and cooling power consumption by as much as 50 percent compared to other liquid cooling technologies, while enabling reliable performance at extreme compute densities.
- SmartSense 6U Liquid-to-Liquid (L2L) CDU, a facility-ready 6U rackmount that can support high-density DLC environments by cooling up to 300kW. It will interface directly with the Equinix TCS secondary loop and enable full DLC operation.
- Additional manifold, busbar, and quick disconnect solutions within the Flex ORv3 rack that will bring all liquid cooling capabilities into a single unit.
"We are proud to bring Flex's high-performance, energy-efficient liquid cooling solutions into data center facilities such as the Equinix CIF," said Rob Campbell, president of the Communications, Enterprise, and Cloud Business at Flex. "This milestone builds on our longstanding collaboration with Equinix across power and cooling infrastructure. As the demand for AI and HPC workloads continues to accelerate, Flex's end-to-end portfolio will enable data center operators to bring infrastructure to market faster."
Building off its presence at the CIF for over a year and its work with Equinix to help deploy products across its global facilities, Flex's newest consolidated demonstration will showcase how it continues to deploy scalable liquid cooling infrastructure solutions across the world for next-generation, high-density compute environments. As one of the world's largest manufacturers, Flex produces millions of servers annually, bringing unparalleled scale, integration expertise, and supply chain strength to the industry. Flex provides comprehensive service, support, maintenance, and warranty coverage for its liquid cooling solutions — from cold plates and manifolds to quick disconnects and CDUs — a level of end-to-end lifecycle support that sets it apart in the industry.
Flex's deployment at the Equinix CIF will demonstrate how JetCool's unique, safe, and efficient approach to single-phase liquid cooling — capable of cooling up to 4kW in a single processor socket, with headroom for higher thermal loads — can translate into significant energy savings that back the industry's transition to sustainable, high-performance computing.
"The Equinix Co-Innovation Facility provides a collaborative environment where emerging infrastructure technologies can be tested and refined for real-world, high-density compute environments," said Pawel Wlodarczak, Innovation Director at Equinix. "Demonstrations like this help our partners explore new approaches to meeting our customers' performance and sustainability needs."
Customers and partners can visit the Equinix CIF to experience the demonstration, which will be featured on-site with live performance metrics and technical information. JetCool innovation is also featured at Telehouse, Flex's facility in
About Flex
Flex (Reg. No. 199002645H) is the manufacturing partner of choice that helps leading brands design, build, and manage products that improve the world. With a global footprint spanning 30 countries, Flex delivers advanced manufacturing and supply chain solutions, innovative products and technology, and lifecycle services that support customers from concept to scale. In the AI era, Flex is helping customers accelerate data center deployment by solving power, heat, and scale challenges through cutting-edge power and cooling technology and scalable IT infrastructure solutions.
About JetCool
JetCool, a Flex company, is a global leader in advanced thermal management for compute-intensive applications. Trusted by top chipmakers, OEMs, and data centers, JetCool delivers a comprehensive portfolio of liquid cooling solutions that enhance performance, increase energy efficiency, and support sustainability goals. Engineered for the demands of artificial intelligence (AI) and next-generation computing, JetCool's liquid cooling technologies deliver reliable, scalable, and future-ready performance for data centers worldwide.
Media Contacts:
Erin Knapp
Matter Communications for JetCool
JetCool@matternow.com
Investors & Analysts
Michelle Simmons
Senior Vice President, Global Investor Relations and Public Relations
(669) 242-6332
Michelle.Simmons@flex.com
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SOURCE Flex
FAQ
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