JetCool Collaborates with Broadcom to Deliver Innovative Liquid Cooling for Next-Generation AI XPUs

Rhea-AI Summary

JetCool (FLEX) announced a collaboration with Broadcom to deliver production-ready single-phase direct-to-chip liquid cooling for next-generation AI XPUs.

The solution targets sustained multi-kilowatt ASIC operation at 4 W/mm² heat flux and pairs JetCool's cold plates and CDUs with Flex's global manufacturing scale to enable high-volume hyperscale AI deployment.

Positive

• Enables sustained multi-kilowatt ASIC operation at 4 W/mm² heat flux
• Combines JetCool direct-to-chip cooling with Flex global mass production
• Positions solution as production-ready for hyperscale AI infrastructure

Negative

• None.

Key Figures

Heat flux capability: 4 W/mm²

1 metrics

Heat flux capability 4 W/mm² Target per-device heat flux for Broadcom ASIC operation using JetCool cooling

Market Reality Check

Price: $60.91 Vol: Volume 2,877,840 is below...

normal vol

$60.91 Last Close

Volume Volume 2,877,840 is below the 20-day average of 3,638,570 (relative volume 0.79x). normal

Technical Price $60.91 is trading above the 200-day MA of $57.21, after a -0.68% daily move.

Peers on Argus

FLEX fell 0.68% while key peers were mixed: JBL +0.81%, CLS +0.13%, FN +1.54%, T...

FLEX fell 0.68% while key peers were mixed: JBL +0.81%, CLS +0.13%, FN +1.54%, TEL -2.14%, GLW +3.19%, pointing to a stock-specific reaction rather than a broad sector move.

Common Catalyst AI-related data center infrastructure appeared in peer news, including GLW’s AI connectivity announcement.

Previous Partnership,AI Reports

2 past events · Latest: Mar 02 (Positive)

Same Type Pattern 2 events

Date	Event	Sentiment	Move	Catalyst
Mar 02	AI partnership	Positive	+3.9%	U.S. manufacturing collaboration with AMD on Instinct AI GPU platforms.
Aug 08	AI partnership	Positive	+3.3%	Musashi collaboration on energy storage systems for AI data centers.

Pattern Detected

AI-focused partnership announcements have previously coincided with positive single-day moves in FLEX shares.

Recent Company History

Over the past several quarters, Flex has highlighted partnerships that expand its role in AI infrastructure. A partnership,AI collaboration with AMD on March 2, 2026 drove a +3.92% move, and an earlier AI data center partnership with Musashi on August 8, 2024 saw a +3.31% reaction. Today’s Broadcom–JetCool collaboration fits this pattern of Flex aligning manufacturing and engineering capabilities with leading AI silicon providers to support high-performance data center deployments.

Historical Comparison

+3.6% avg move · Across two prior partnership,AI announcements, FLEX moved an average of +3.62%, while today’s move o...

partnership,AI

+3.6%

Average Historical Move partnership,AI

Across two prior partnership,AI announcements, FLEX moved an average of +3.62%, while today’s move of -0.68% reflects a weaker, contrary reaction.

Flex has progressively layered AI infrastructure partnerships: energy storage with Musashi, manufacturing of AMD GPU platforms, and now liquid cooling integration with Broadcom and JetCool for next‑generation AI XPUs.

Market Pulse Summary

This announcement extends Flex’s role in AI infrastructure through JetCool’s collaboration with Broa...

Analysis

This announcement extends Flex’s role in AI infrastructure through JetCool’s collaboration with Broadcom on liquid cooling for multi‑kilowatt AI XPUs, targeting heat flux up to 4 W/mm². It complements prior AI partnerships on GPUs and energy storage, underscoring a strategy built around high-performance data centers. Investors may watch for design wins, production ramps through Flex’s global footprint, and how these collaborations contribute to revenue and margin trends disclosed in future filings.

Key Terms

liquid cooling, asic, direct-to-chip, thermal architecture, +2 more

6 terms

liquid cooling technical

"a leading provider of end-to-end liquid cooling solutions for high-density compute"

Liquid cooling is a method that uses a flowing liquid—like water or a special coolant—to carry heat away from electronic components, similar to how a car radiator moves heat away from an engine. For investors, it matters because it can lower energy and maintenance costs, enable higher-performance computing, reduce the footprint of data centers, and support sustainability targets, all of which can affect a company’s operating margins and capital spending needs.

asic technical

"enabling sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm²"

ASIC is Australia’s corporate, markets and financial services regulator that enforces rules for companies, financial advisers and market operators; think of it as the referee and rulebook keeper for financial activity. It matters to investors because ASIC’s oversight, investigations and enforcement actions affect company credibility, legal risk and market fairness—actions that can change stock prices, investor confidence and the safety of financial products.

direct-to-chip technical

"developed a single-phase direct-to-chip cooling solution designed to integrate"

Direct-to-chip describes a testing or manufacturing approach where a biological sample, chemical reagent, or material is placed directly onto a small electronic or microfluidic chip that performs analysis or processing, skipping many intermediate handling steps. For investors it signals faster, cheaper and more compact workflows—think of it like scanning a fingerprint instantly instead of mailing it to a lab—which can lower operating costs, speed product rollout, and expand use in point-of-care or high-volume production settings.

thermal architecture technical

"Thermal architecture now directly impacts system performance, long-term reliability"

Thermal architecture is the planned arrangement of materials, components and pathways that control how heat is generated, moved and removed inside a product or system. Think of it as the building’s heating and ventilation plan but for electronics or machinery: it keeps parts within safe temperatures to preserve performance and lifespan. Investors care because effective thermal design reduces failures, improves efficiency and can lower warranty, production and regulatory costs, directly affecting a product’s competitiveness and profit margins.

advanced packaging technical

"By aligning silicon design, advanced packaging, mechanical integration, and thermal"

Advanced packaging describes modern methods for arranging, connecting and enclosing semiconductor chips so they work together more efficiently in a smaller space—think of stacking and wiring tiny electronic building blocks instead of leaving them as separate items on a circuit board. It matters to investors because these techniques can boost product speed, reduce power use, shrink device size and lower manufacturing costs, all of which influence a maker’s competitiveness, profit margins and market share.

coolant distribution units (cdus) technical

"from cold plates and manifolds to coolant distribution units (CDUs) supported by"

Coolant Distribution Units (CDUs) are devices that manage and direct the flow of cooling liquids in large data centers or industrial systems. They help keep equipment from overheating by efficiently distributing coolant to where it's needed, ensuring smooth operation and preventing damage, much like a thermostat controls temperature in your home.

AI-generated analysis. Not financial advice.

AUSTIN, Texas, March 11, 2026 /PRNewswire/ -- JetCool, a Flex (NASDAQ: FLEX) company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities.

As AI training and inference workloads accelerate, silicon power densities are advancing into sustained multi-kilowatt ranges per device. Thermal architecture now directly impacts system performance, long-term reliability, and deployment timelines. Through this collaboration, JetCool has developed a single-phase direct-to-chip cooling solution designed to integrate with Broadcom's mechanical and thermal reference architecture, enabling sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm² per device.

By aligning silicon design, advanced packaging, mechanical integration, and thermal engineering early in development, Broadcom and JetCool are enabling AI platforms engineered for performance and repeatable manufacturing. Combining JetCool's direct-to-chip liquid cooling, Flex's global manufacturing scale, and Broadcom's custom AI silicon expertise, the partnership establishes a production-ready thermal foundation for hyperscale AI infrastructure.

"At Broadcom, we design AI systems to lead at hyperscale," said Ken Kutzler, VP of AI Systems Development for Broadcom's ASIC Products Division. "Supporting multi-kilowatt ASIC platforms requires a tight coordination across silicon architecture, advanced packaging, power delivery, and thermal engineering. Our partnership with JetCool, combined with Flex's manufacturing and integration capabilities, provides a clear path from advanced ASIC innovation to high-volume AI XPU deployment."

"Cooling has become a primary design constraint for next-generation AI silicon," said Bernie Malouin, PhD, VP, Liquid Cooling at Flex. "JetCool's advanced direct-to-chip cold plate technology, combined with Flex's global manufacturing scale, enables production-ready thermal solutions engineered for high-density silicon architectures. We've developed a strong partnership with the Broadcom team, and together we're advancing scalable thermal solutions for the next generation of AI infrastructure."

The partnership supports AI systems that:

• Deliver sustained multi-kilowatt-class performance for high-density ASIC platforms through advanced direct-to-chip liquid cooling
• Enable high-volume manufacturing through Flex's global scale
• Support future AI silicon generations as power densities continue to increase

Broadcom maintains a broad ecosystem of partners supporting diverse cooling approaches and deployment models. As part of this ecosystem, JetCool is working closely with Broadcom to advance high-performance direct-to-chip thermal architectures for next-generation AI platforms. JetCool provides end-to-end liquid cooling infrastructure from cold plates and manifolds to coolant distribution units (CDUs) supported by Flex's global manufacturing capabilities to enable scalable deployment across hyperscale AI environments.

About Flex

Flex (Reg. No. 199002645H) is the manufacturing partner of choice that helps a diverse customer base design and build products that improve the world. Through the collective strength of a global workforce across 30 countries and responsible, sustainable operations, Flex delivers technology innovation, supply chain, and manufacturing solutions to diverse industries and end markets.

About JetCool

JetCool, a Flex company, is a global leader in advanced thermal management for compute-intensive applications. Trusted by top chipmakers, OEMs, and data centers, JetCool delivers a comprehensive portfolio of liquid cooling solutions that enhance performance, increase energy efficiency, and support sustainability goals. Engineered for the demands of artificial intelligence (AI) and next-generation computing, JetCool's liquid cooling technologies deliver reliable, scalable, and future-ready performance for data centers worldwide.

 

 

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SOURCE Flex

FAQ

What did JetCool and Broadcom announce on March 11, 2026 regarding AI XPU cooling for FLEX?

They announced a collaboration to deliver production-ready direct-to-chip liquid cooling for next-generation AI XPUs. According to Broadcom and JetCool, the design supports sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm2.

How does the JetCool solution affect ASIC thermal performance for FLEX AI platforms?

It enables sustained multi-kilowatt-class performance through single-phase direct-to-chip cooling. According to Broadcom, this thermal approach supports high heat flux and helps maintain performance and long-term reliability in dense AI systems.

What role does Flex (FLEX) play in the JetCool and Broadcom partnership?

Flex provides global manufacturing and integration scale to enable high-volume deployment of the cooling system. According to Flex, their capabilities make the JetCool-Broadcom solution production-ready for hyperscale AI environments.

What specific thermal metric did JetCool and Broadcom cite for next-generation AI silicon?

They cited operation at heat flux levels of 4 W/mm2 per device for multi-kilowatt ASICs. According to Broadcom, that metric guided integration of silicon design, packaging, mechanical, and thermal engineering.

Will the JetCool-Broadcom cooling solution support future AI silicon generations for FLEX?

Yes, the collaboration is designed to support future AI silicon as power densities rise. According to JetCool, aligning silicon, packaging, mechanical, and thermal design early enables scalable support for higher power-density devices.

What components comprise JetCool's liquid cooling infrastructure for FLEX hyperscale deployment?

JetCool supplies cold plates, manifolds, and coolant distribution units (CDUs) as a full liquid cooling stack. According to Flex, these end-to-end components are integrated with manufacturing to enable scalable hyperscale deployment.