GlobalFoundries Inc. reports developments in contract semiconductor manufacturing, including financial results, manufacturing technologies, customer platforms and capital allocation. GF serves automotive, smart mobile devices, IoT, communications infrastructure, AI data-center and other semiconductor markets from a global manufacturing footprint spanning the U.S., Europe and Asia.
Company news includes updates on silicon photonics and co-packaged optics, FDX and AutoPro automotive platforms, embedded non-volatile memory such as eMRAM, share repurchases, dividends, secondary share activity, investor-day strategy and intellectual-property actions tied to its process technologies.
GlobalFoundries (Nasdaq: GFS) broke ground on the first new semiconductor fab at its Malta, New York, site under a U.S.-Japan initiative.
GF is the technology provider and operator for two planned fabs under the initiative, which provides up to $21 billion in funding from Japan. An initial investment of approximately $10 billion, supported by $570 million in New York State incentives, is accelerating construction of the first fab. GF expects it to come online in 2029 and add approximately 900,000 300mm wafers of annual manufacturing capacity when fully operational. An additional investment of approximately $10 billion will support a second fab as the project advances, with approximately the same capacity.
GlobalFoundries (Nasdaq: GFS) reported preliminary third-quarter 2026 revenue of $1.899 billion, with higher operating profitability but a net loss. Revenue rose 13% year over year and 6% sequentially. Gross margin reached 30.1%, while the net loss was $270 million, or $0.49 per diluted share. A $441 million non-cash charge for shares issued to the U.S. government primarily drove the loss. Non-IFRS adjusted net income was $298 million.
GF expects fourth-quarter revenue of $2,000 million ± $25 million and diluted earnings of $0.47 ± $0.05 per share, excluding uncertain charges for additional government share issuances. October agreements included a multi-year, $2 billion TSMC manufacturing contract and selection to operate two new Malta fabs under an initiative providing up to $21 billion in funding. Operating cash flow fell 43% year over year to $341 million. A $0.12 dividend is payable January 14, 2027.
GlobalFoundries (GFS) has been selected to provide technology and operate two new New York semiconductor fabs under a U.S.-Japan initiative.
Japan will provide up to $21 billion in funding. An initial investment of approximately $10 billion will accelerate the first Malta fab, expected to come online in 2029; approximately $10 billion more would fund a second. Each fab is expected to add approximately 900,000 300mm wafers of annual capacity, with the second addition conditional. GlobalFoundries expects to break ground on the first fab later this year at its permitted, shovel-ready site.
The company also agreed to amend its CHIPS award to reallocate $955 million toward silicon photonics, silicon-germanium and advanced packaging investments in New York and Vermont. Separately, the U.S. Department of Commerce will receive approximately four percent equity in GlobalFoundries.
GlobalFoundries (Nasdaq: GFS) unveiled its FDX Fusion semiconductor platform roadmap, with manufacturing planned to begin in Dresden, Germany, in 2028. The platform uses fully depleted silicon-on-insulator (FD-SOI) technology for Physical AI, where devices process data and interact with their surroundings. GF expects the first generation to deliver seven-nanometer-class digital performance and more than twice the density of first-generation FDX technology.
Several customers are engaged in early development and evaluation. GF targets demonstrator chips for early customer evaluation in early 2027 and plans an initial process design kit, a set of chip-design resources, for mid-2027. Ongoing Dresden expansion efforts supported under the European Chips Act framework are increasing manufacturing capacity.
GlobalFoundries (Nasdaq: GFS) reached a $2 billion manufacturing agreement with TSMC to establish U.S.-based production of silicon interposers for advanced packaging. The initial term is five years. GlobalFoundries plans to add fabrication capacity at its Malta, New York facility for TSMC's CoWoS packaging ecosystem. Volume production is expected to begin ramping in the first half of 2028, with a framework for future capacity expansion.
GlobalFoundries (GFS) will host a conference call on November 4, 2026, to review its third quarter 2026 financial results.
The call begins at 8:30 a.m. ET, following the results release. The financial results and a webcast will be available on the company’s Investor Relations website.
GlobalFoundries (GFS) and Marvell (MRVL) have expanded a multi-year agreement to increase capacity for GF’s silicon germanium (SiGe) technology at its Burlington, Vermont facility to support growing demand for next-generation optical connectivity in AI and cloud data centers.
The collaboration targets high-performance SiGe used in pluggable optical transceivers, Near-Packaged Optics (NPO) and Co-packaged Optics (CPO), and is expected to add significant capacity for Marvell’s requirements. GF’s SiGe portfolio currently supports 200G-per-lane optical links and has a roadmap for higher-speed generations as bandwidth needs grow. The deal builds on more than a decade of joint work between the companies.
GlobalFoundries (GFS) and Monolithic Power Systems (MPWR) have entered a long-term manufacturing agreement to deploy MPS’s proprietary power management process technology at GF’s advanced 300mm fab in Singapore, with volume production targeted for early 2027.
The collaboration is intended to expand manufacturing capacity for critical high-performance, ultra-efficient power management solutions serving data center, automotive, consumer and industrial markets. Products expected from the Singapore facility include next-generation power solutions for evolving automotive architectures, industrial robotics and automation, and smart power stages for AI and cloud infrastructure. The companies said combining MPS technology with GF manufacturing is expected to support their next phase of growth and provide customers with greater capacity, supply assurance and global scale.
GlobalFoundries (GFS) finalized a definitive agreement with the U.S. Department of Commerce’s CHIPS Research and Development Office for up to $375 million in R&D funding to accelerate its Quantum Technology Solutions (QTS) business and support a secure, U.S.-based quantum chip ecosystem.
The funding, to be received over five years subject to specified milestones, is intended to help scale domestic quantum semiconductor manufacturing and move customers from research and prototyping to commercial production. QTS leverages GF’s capabilities in cryogenic CMOS, advanced packaging and heterogeneous integration. The company also recently entered into a $300 million letter of intent with the same office to accelerate R&D in silicon photonics, another area it expects to be foundational for future AI infrastructure and advanced computing.
GlobalFoundries (GFS) announced customer PDK availability for its new UX platform family, two feature-rich CMOS technologies, at the GF Technology Summit in North America. The UX family includes 40nm (40UX) and 22nm (22UX) nodes designed for intelligent edge devices, advanced sensing systems and Physical AI applications.
40UX targets secure, ultra-low power microcontrollers, SoCs and always-on edge devices for wearables, IoT and wireless connectivity, with volume production at the Singapore site planned by 2027 and future production in Malta, New York. 22UX is an analog-optimized 22nm platform aimed at edge AI, imaging, mixed-signal and stacked CMOS image sensor readout ICs, to be manufactured in Dresden, Germany with a roadmap to multi-site production. Both platforms are accessible for customer engagement and prototyping via GF’s GlobalShuttle multi-project wafer program, with quarterly shuttles scheduled through 2027.