GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications
Rhea-AI Summary
GlobalFoundries (Nasdaq:GFS) announced production-ready SLATE wafer-to-wafer bonding on its 9SW RF-SOI platform, enabling advanced 3D integration for compact 5G front-end modules. Manufactured in Singapore, 9SW SLATE is expected to reach volume production in 2H 2027.
SLATE can cut die size by up to 45% and, with 9SW, targets sub-8GHz and FR3 bands, offering over 20% efficiency improvement. A PDK is available via GF Connect, and 9SW/9SW SLATE are accessible for prototyping through GlobalShuttle shuttles in the second half of the year.
AI-generated analysis. Not financial advice.
Positive
- SLATE on 9SW can reduce overall die size by up to 45%
- 9SW platform offers more than 20% efficiency enhancement via improved Ron*Coff
- 9SW SLATE expected to ramp to volume production by 2H 2027
- Production manufactured at 300mm Singapore facility, supporting scalability
- Designers can access PDK via GF Connect and prototype through GlobalShuttle
Negative
- None.
Key Figures
Peers on Argus
GFS was up 4.47% pre-news, while key peers UMC, ON, ASX and SWKS also traded higher, indicating a broader positive move in semiconductors rather than a purely stock-specific reaction.
Historical Context
| Date | Event | Sentiment | Move | Catalyst |
|---|---|---|---|---|
| Jun 03 | Government partnership | Positive | +1.6% | Joined DOE Genesis Mission to support AI and advanced computing initiatives. |
| Jun 02 | Business acquisition | Positive | +5.8% | Completed acquisition of Synopsys’ ARC Processor IP Solutions for Physical AI platform. |
| Jun 02 | Strategic collaboration | Positive | +5.8% | Partnered with Sivers on silicon photonics for AI data center optical solutions. |
| May 21 | New business launch | Positive | +14.9% | Launched Quantum Technology Solutions with U.S. Commerce support and equity stake. |
| May 19 | Venture investment | Positive | -1.7% | Invested in Playground Global Fund IV via GF Accelerate to back deep-tech startups. |
GFS has typically reacted positively to strategic and technology announcements, with only occasional negative deviations.
Regulatory & Risk Context
Reported short interest appears relatively low, suggesting limited short-squeeze potential and typically moderate incremental volatility from short covering.
Market Pulse Summary
This announcement adds a SLATE-based 3DI path on the 9SW RF-SOI platform, targeting up to 45% die-size reduction and over 20% efficiency gains. Investors may watch execution toward the 2027 volume ramp and broader RF market adoption.
Key Terms
3d integration technical
process design kit technical
AI-generated analysis. Not financial advice.
Production-ready 3DI technology supports more compact FEMs for advanced 5G devices
MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-performance cellular front-ends. Manufactured at GF’s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027.
GF’s first-generation SLATE technology supports wafer-to-wafer (W2W) bonding, enabling designers to bond two 9SW wafers to stack and integrate large-size field-effect transistors (FETs) in vertical architectures. By folding large FETs across bonded wafers, SLATE technology can reduce overall die size by up to
First introduced in 2023, the 9SW RF-SOI platform is GF’s most advanced RF solution for front-end modules (FEMs), spanning sub-8GHz and FR3 frequency ranges for 5G mobile devices and satellite communications. 9SW, the fourth generation of GF’s XSW technology, delivers a significant reduction in standby currents for longer battery life with a more than
“Deploying SLATE on 9SW represents a significant step forward in RF integration, enabling our customers to design more compact and power-efficient solutions for next-generation 5G devices without compromising RF performance,” said Shankaran Janardhanan, senior vice president of GF’s RF business. “By combining our industry-leading 9SW platform with SLATE advanced packaging technology, we are unlocking new opportunities for innovation across next-generation mobile and wireless applications.”
“GF’s SLATE technology applied to its 9SW platform represents an important advancement in RF front-end integration, enabling designers to overcome traditional scaling and integration challenges,” said Vinod Kariat, corporate vice president of Custom IC and PCB group at Cadence. “Through Cadence’s Virtuoso Studio homogeneous integration, analysis and verification users can unlock SLATE’s 3D integration potential – giving designers the speed and confidence to deliver next-generation 5G front-end modules from concept to silicon.”
GF’s SLATE wafer-to-wafer bonding technology offers a roadmap for heterogeneous 3DI across its many differentiated technologies, including FDX™ FD-SOI, RF-SOI and silicon germanium (SiGe), for even greater system-level capabilities across diverse markets such as data centers, satellite connectivity, IoT and mobile devices.
An integrated process design kit (PDK) is available through the GF Connect portal to help jumpstart the design process. 9SW and 9SW SLATE are available for prototyping through GF’s GlobalShuttle™ multi-project wafer program with shuttles scheduled for the second half of the year.
About GF
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com.
Forward-looking information
This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law.
Media Contact:
Stephanie Gonzalez
stephanie.gonzalez@gf.com
