Sivers & GlobalFoundries Advance AI Data Center Optical Solutions

GlobalFoundries (NASDAQ:GFS) and Sivers Semiconductors (STO:SIVE) announced a strategic collaboration to develop advanced silicon photonics for AI data centers.

Rhea-AI Summary

GlobalFoundries (NASDAQ:GFS) and Sivers Semiconductors (STO:SIVE) announced a strategic collaboration to develop advanced silicon photonics for AI data centers. Sivers' laser arrays will be integrated into GF's silicon photonics platform and SCALE™ optical engine solutions, targeting architectures like CPO and LPO in a projected $25B pluggable optics market by 2030.

Argus Jun 2 session

+5.84% close to close Open Argus

Details

News Market Reaction – GFS

In the Jun 2 session, GFS gained 5.84%, reflecting a notable positive market reaction.

Data tracked by StockTitan Argus on the day of publication.

Market Context

The stock moved +5.8% in the session following this news. A strong positive reaction aligns with Glo...

Analysis

The stock moved +5.8% in the session following this news. A strong positive reaction aligns with GlobalFoundries’ ongoing emphasis on AI infrastructure and silicon photonics. Prior AI-tagged news produced mixed moves, with an average next-day change of -0.33%, so a large gain would stand out versus history. Investors might weigh how deeply this Sivers collaboration embeds into existing CPO and SCALE platforms, while also considering broader sector volatility and the potential for enthusiasm around AI data center optics to normalize after initial momentum.

Key Figures

Pluggable optics market: $25B by 2030

Pluggable optics market

$25B by 2030

Target market size for pluggable optics cited in collaboration release

Previous AI Reports

5 past events · Latest: May 04

Same Type 5 events

1. May 04

   CPO module launch

   24h Move

   +4.4%

   Introduced SCALE optical module CPO platform for AI data center connectivity.

2. Aug 28

   RRAM AI IoT tech

   24h Move

   -1.1%

   Announced 22FDX+ RRAM technology for wireless and AI IoT applications.

3. Jun 04

   US AI investment

   24h Move

   +2.3%

   Unveiled $16B U.S. investment to expand AI-focused chip manufacturing.

4. Feb 27

   MIT AI research deal

   24h Move

   -5.6%

   Launched MIT collaboration centered on silicon photonics and AI chips.

5. Aug 28

   AI summit theme

   24h Move

   -1.6%

   Announced Technology Summit 2024 focused on ‘AI Everywhere’ platforms.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

silicon photonics, co-packaged optics (cpo), linear pluggable optics (lpo), silicon photonics co-packaged advanced light engine (scale), +4 more

8 terms

silicon photonics technical

"to develop advanced silicon photonics solutions for the high-growth AI infrastructure market."

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

co-packaged optics (cpo) technical

"including co-packaged optics (CPO), linear pluggable optics (LPO), and other emerging data center interconnect"

Co-packaged optics (CPO) are a way of placing optical transmitters and receivers directly next to or on the same chip package as a high-speed switch or processor, rather than keeping them on separate circuit boards. By moving the light-based communications closer to the switching brain, CPO cuts power use, reduces delay and can greatly increase data capacity — changes that can lower operating costs, enable denser data centers, and shift competitive dynamics among hardware suppliers and cloud operators.

linear pluggable optics (lpo) technical

"including co-packaged optics (CPO), linear pluggable optics (LPO), and other emerging data center interconnect"

Linear pluggable optics are small, hot‑swappable modules that plug into network equipment to convert electrical signals into light (and back) for high‑speed fiber links, using advanced analog optics to support long‑distance, high‑capacity connections. They matter to investors because they let telecoms and data centers increase or change network capacity by swapping inexpensive modules instead of replacing whole systems, affecting upgrade cycles, equipment sales and capital spending — like changing a light bulb to brighten a room instead of rebuilding the house.

silicon photonics co-packaged advanced light engine (scale) technical

"available in GF's Silicon Photonics Co-packaged Advanced Light Engine (SCALE™) platform for next-generation optical"

A silicon photonics co-packaged advanced light engine (scale) is a compact optical transmitter/receiver system built using silicon-based photonics and placed directly beside a networking chip to move data with light instead of electrical signals; “co-packaged” means the optics sit in the same package as the processor, and “scale” signals a design meant to be produced and expanded cost-effectively. For investors, it matters because this approach can dramatically cut power use, increase data speed and lower per-unit cost in data centers and communications equipment—similar to replacing slow, power-hungry road trucks with a built-in high-speed rail — which can improve product competitiveness, margins and capital efficiency.

wavelength-division multiplexing technical

"solution combines integrated photonic devices, coarse and dense wavelength-division multiplexing (CWDM, DWDM) and"

Wavelength-division multiplexing is a fiber-optic technique that sends many separate data streams at once by using different colors (wavelengths) of light on the same glass cable, like adding extra lanes to a highway without building new roads. For investors, it matters because it multiplies network capacity and efficiency, reducing the cost of carrying more traffic and enabling higher-speed services that can drive revenue growth and influence spending on telecom and data-center infrastructure.

cwdm technical

"solution combines integrated photonic devices, coarse and dense wavelength-division multiplexing (CWDM, DWDM) and"

CWDM (Coarse Wavelength Division Multiplexing) is a fiber‑optic technology that lets a single fiber carry multiple separate data streams by using different colors of light, like adding extra lanes to a highway without laying new road. For investors, CWDM matters because it can boost network capacity and cut per‑unit transmission cost with relatively low equipment spending, affecting revenue potential, capital expenditure plans and competitive positioning in telecom and data‑center businesses.

dwdm technical

"solution combines integrated photonic devices, coarse and dense wavelength-division multiplexing (CWDM, DWDM) and"

Dense Wavelength Division Multiplexing (DWDM) is an optical networking technology that lets many separate data streams travel simultaneously over a single fiber by using different colors of light, like adding lanes to a highway without laying new road. For investors, DWDM matters because it enables service providers and data centers to increase capacity, cut per‑unit transmission costs, and delay expensive fiber builds, affecting revenue potential, capital spending and competitive positioning.

optical interconnects technical

"co-packaged optics and optical interconnects."

Optical interconnects are systems that use light instead of electrical signals to move data between parts of computers, data centers, or telecom equipment, like replacing copper wires with tiny light pipes. They matter to investors because they can greatly increase speed and capacity while lowering power use and heat, making digital networks faster and cheaper to scale; think of swapping a crowded city road for a high-speed rail line that carries much more traffic efficiently.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Sivers' laser arrays to support GlobalFoundries' silicon photonics platform and SCALE™ optical engine solutions targeting a $25B Pluggable Optics market by 2030

KISTA, Sweden, June 2, 2026 /PRNewswire/ -- Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, today announced a strategic collaboration with GlobalFoundries (NASDAQ: GFS) (GF), to develop advanced silicon photonics solutions for the high-growth AI infrastructure market.

Sivers Semiconductors' laser arrays will be integrated into reference designs built on GF's silicon photonics platform. The collaboration supports a range of optical connectivity architectures, including co-packaged optics (CPO), linear pluggable optics (LPO), and other emerging data center interconnect solutions. Sivers' laser arrays will also be available in GF's Silicon Photonics Co-packaged Advanced Light Engine (SCALE™) platform for next-generation optical sub-assemblies and light engine architectures. GF's SCALE CPO solution combines integrated photonic devices, coarse and dense wavelength-division multiplexing (CWDM, DWDM) and advanced packaging enablement to improve bandwidth density and system scalability.

"The rapid expansion of AI workloads and hyperscale data center architectures demand advanced photonics technologies that deliver higher bandwidth, improved energy efficiency, and scalable optical connectivity," said Raymond Biagan, CRO at Sivers Semiconductors. "Our collaboration with GlobalFoundries positions both companies at the leading edge of silicon photonics innovation."

"GlobalFoundries continues to see strong momentum for silicon photonics solutions as AI data center architectures evolve toward higher bandwidth density and improved power efficiency," said Vikas Gupta, Senior Fellow, Silicon Photonics Product Line at GlobalFoundries. "Pairing Sivers Semiconductors' laser array technology with our silicon photonics and SCALE CPO platforms provides our customers with advanced, scalable optical engine solutions for high-bandwidth co-packaged optics and optical interconnects."

For more information, please visit https://www.sivers-semiconductors.com/. 

About Sivers Semiconductors 

Sivers Semiconductors is a critical enabler of a greener data economy with energy-efficient photonics & wireless solutions. Our differentiated high-precision laser and RF beamformer technologies help our customers in key markets such as AI Datacenters, SATCOM, Defense and Telecom solve essential performance challenges while enabling a much greener footprint. For additional information, please visit us at: www.sivers-semiconductors.com. (SIVE.ST)

About GF 

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF's talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com.

Media Contact   
Tyler Weiland 
Shelton Group
+1-972-571-7834
tweiland@sheltongroup.com

Company Contact
Heine Thorsgaard
CFO 
ir@sivers-semiconductors.com

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SOURCE Sivers Semiconductors

FAQ

What did GlobalFoundries (GFS) announce with Sivers Semiconductors on June 2, 2026?

GlobalFoundries announced a strategic collaboration with Sivers Semiconductors to develop advanced silicon photonics solutions for AI infrastructure. According to Sivers Semiconductors, its laser arrays will be integrated into GF’s silicon photonics platform and SCALE optical engine solutions for data center connectivity.

How will Sivers Semiconductors’ laser arrays be used in GlobalFoundries’ silicon photonics platform (GFS)?

Sivers’ laser arrays will be integrated into reference designs built on GlobalFoundries’ silicon photonics platform. According to Sivers Semiconductors, these arrays will also be available in GF’s SCALE co-packaged advanced light engine platform for next‑generation optical sub-assemblies and light engine architectures.

What AI data center applications does the GlobalFoundries (GFS) and Sivers collaboration target?

The collaboration targets optical connectivity for AI data centers, including co-packaged optics and linear pluggable optics. According to GlobalFoundries, the combined technologies aim to support high-bandwidth co-packaged optics and optical interconnects with improved bandwidth density and power efficiency.

What is the market opportunity mentioned in the GlobalFoundries (GFS) and Sivers silicon photonics announcement?

The companies are targeting a projected $25 billion pluggable optics market by 2030. According to Sivers Semiconductors, their joint silicon photonics and SCALE optical engine solutions are designed to address this opportunity in high-growth AI infrastructure and data center interconnects.

How does GlobalFoundries’ SCALE CPO solution support the Sivers collaboration for GFS investors?

GlobalFoundries’ SCALE CPO solution combines integrated photonic devices, CWDM/DWDM multiplexing and advanced packaging. According to GlobalFoundries, pairing this with Sivers’ laser arrays aims to enhance bandwidth density, scalability and power efficiency for AI data center optical connectivity.