GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution

GlobalFoundries (Nasdaq: GFS) on May 4, 2026 introduced the SCALE optical module solution for co-packaged optics (CPO), billed as the industry’s first OCI MSA-capable platform.

Rhea-AI Summary

GlobalFoundries (Nasdaq: GFS) on May 4, 2026 introduced the SCALE optical module solution for co-packaged optics (CPO), billed as the industry’s first OCI MSA-capable platform. SCALE uses GF silicon photonics, supports CWDM and DWDM, and has demonstrated 8λ and 16λ bi-directional DWDM to increase bandwidth density and system scalability.

Key device capabilities include 50Gbps and 100Gbps micro-ring modulators, integrated photodiodes, TSVs, and copper pad pitches from 110μm to sub-45μm to enable 2.5D/3D stacking and volume production readiness.

Positive

• First reported OCI MSA-capable CPO platform
• Demonstrated 8λ and 16λ bi-directional DWDM on the platform
• Portfolio includes 50Gbps and 100Gbps micro-ring modulators
• Supports copper pad pitches down to sub-45μm for 2.5D/3D stacking

Negative

• No production timeline or customer commitments disclosed
• No financial metrics or revenue impact provided

Argus May 4 session

+4.38% close to close Open Argus

Details

News Market Reaction – GFS

On May 4, the day this news came out, GFS closed 4.38% above the previous close.

Data tracked by StockTitan Argus for the May 4 session.

Market Context

This announcement introduces GFS’s SCALE CPO solution, an OCI MSA-capable silicon photonics platform...

Analysis

This announcement introduces GFS’s SCALE CPO solution, an OCI MSA-capable silicon photonics platform targeting high-bandwidth AI data centers using CWDM and DWDM. It builds on prior AI initiatives, including RRAM for AI IoT and large U.S. investments in photonics and packaging. Investors may watch adoption of co-packaged optics, progress toward volume production, and how insider selling and concentrated ownership interact with future AI-related milestones. Shares already trade near a 52-week high and above the 200-day MA.

Key Figures

DWDM wavelengths: 8λ bi-directional DWDM DWDM wavelengths: 16λ bi-directional DWDM Micro-ring modulator speed: 50Gbps +5 more

DWDM wavelengths

8λ bi-directional DWDM

Demonstrated on silicon photonics platform

DWDM wavelengths

16λ bi-directional DWDM

Demonstrated on silicon photonics platform

Micro-ring modulator speed

50Gbps

Photonic device in SCALE CPO portfolio

Micro-ring modulator speed

100Gbps

Photonic device in SCALE CPO portfolio

Copper pad pitch

110μm

For 2.5D/3D stacking from organic substrates

Copper pad pitch

sub-45μm

For dense 2.5D/3D stacking to silicon interposers

Initial wavelength scaling

4λ each direction

Broadband detachable fibers over CWDM spectrum

Future wavelength target

8λ and beyond

Scaling roadmap for AI interconnects

Previous AI Reports

4 past events · Latest: Aug 28

Same Type 4 events

1. Aug 28

   AI memory platform

   24h Move

   -1.1%

   Launch of 22FDX+ RRAM technology for secure, low-power AI IoT applications.

2. Jun 04

   AI capex expansion

   24h Move

   +2.3%

   Announcement of $16B U.S. investment to expand AI-focused chip manufacturing.

3. Feb 27

   AI research pact

   24h Move

   -5.6%

   New master research agreement with MIT centered on AI and silicon photonics.

4. Aug 28

   AI tech summit

   24h Move

   -1.6%

   Technology Summit themed “AI Everywhere” highlighting GF’s essential AI chip platforms.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

co-packaged optics, silicon photonics, wavelength-division multiplexing, CWDM, +3 more

7 terms

co-packaged optics technical

"SCALE™ optical module solution for co-packaged optics (CPO)."

Co-packaged optics are optical components—lasers and fiber interfaces—physically packaged together with a network switch’s main processing chip so light-based data links sit much closer to the chip instead of traveling over long electrical traces. For investors, this matters because it can dramatically cut power use, boost data speed and density, and lower system costs in large data centers and telecom equipment, much like moving a power outlet next to a heavy appliance to avoid long, inefficient extension cords.

silicon photonics technical

"Built with GF’s advanced silicon photonics technology, the SCALE CPO solution"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

wavelength-division multiplexing technical

"utilizes both coarse and dense wavelength-division multiplexing (CWDM, DWDM)"

Wavelength-division multiplexing is a fiber-optic technique that sends many separate data streams at once by using different colors (wavelengths) of light on the same glass cable, like adding extra lanes to a highway without building new roads. For investors, it matters because it multiplies network capacity and efficiency, reducing the cost of carrying more traffic and enabling higher-speed services that can drive revenue growth and influence spending on telecom and data-center infrastructure.

CWDM technical

"utilizes both coarse and dense wavelength-division multiplexing (CWDM, DWDM)"

CWDM (Coarse Wavelength Division Multiplexing) is a fiber‑optic technology that lets a single fiber carry multiple separate data streams by using different colors of light, like adding extra lanes to a highway without laying new road. For investors, CWDM matters because it can boost network capacity and cut per‑unit transmission cost with relatively low equipment spending, affecting revenue potential, capital expenditure plans and competitive positioning in telecom and data‑center businesses.

DWDM technical

"utilizes both coarse and dense wavelength-division multiplexing (CWDM, DWDM)"

Dense Wavelength Division Multiplexing (DWDM) is an optical networking technology that lets many separate data streams travel simultaneously over a single fiber by using different colors of light, like adding lanes to a highway without laying new road. For investors, DWDM matters because it enables service providers and data centers to increase capacity, cut per‑unit transmission costs, and delay expensive fiber builds, affecting revenue potential, capital spending and competitive positioning.

through silicon vias technical

"Additional features include through silicon vias (TSVs) for high-speed signaling"

Through silicon vias are tiny vertical electrical connections that pass straight through a slice of semiconductor material to link stacked layers of a microchip, like stairways connecting floors in a building so signals travel shorter, faster routes. For investors, they matter because this packaging technique boosts speed, saves power and increases component density, but also adds manufacturing complexity and capital costs that can affect product competitiveness and profit margins.

silicon interposers technical

"sub-45μm for 2.5D/3D stacking from organic substrates to silicon interposers"

A silicon interposer is a thin slice of silicon used as a high-density connector between tiny chips and their package, carrying many small wiring paths and passive components to link multiple chips closely together. For investors, interposers matter because they enable faster, more power-efficient and compact semiconductor products, influence manufacturing complexity and cost, and can be a strategic advantage for companies making advanced chips or packaging services.

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SCALE CPO solution is the industry’s first OCI MSA capable platform and built with GF’s proven silicon photonics technology

MALTA, N.Y., May 04, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO). GF’s SCALE solution, or Silicon photonics Co-packaged Advanced Light Engine solution, is the industry’s first Optical Compute Interconnect Multi-Source Agreement (OCI MSA) capable platform, exceeding the requirements for the OCI MSA’s optical interconnect specification for modern AI scale-up architectures.

Built with GF’s advanced silicon photonics technology, the SCALE CPO solution utilizes both coarse and dense wavelength-division multiplexing (CWDM, DWDM) for bi-directional data transmission over each optical fiber for significant improvements in bandwidth density and system scalability versus traditional copper interconnects. GF has already demonstrated 8λ and 16λ bi-directional DWDM natively on its platform, a fundamental technology milestone that uniquely positions GF to support the industry’s shift to CPO and accelerate the adoption of optical scale-up interconnects. 

GF’s SCALE CPO solution and silicon photonics technology offer an advanced portfolio of fully-qualified photonic devices, such as 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes. Additional features include through silicon vias (TSVs) for high-speed signaling and power delivery and copper pad pitches ranging from 110μm down to sub-45μm for 2.5D/3D stacking from organic substrates to silicon interposers, enabling customers to move quickly from design to volume production. The platform integrates electrical ICs on single-digit advanced nodes, enabling optimization between best-in-class compute and state-of-the-art optics without compromising performance. While GF offers multiple fiber-attach approaches, the SCALE solution leverages broadband detachable fibers with flat insertion loss over the CWDM spectrum to future-proof scaling from 4λ in each direction to 8λ and beyond, while still enabling serviceability and known-good-die testability for next-generation AI interconnects.

“With over a decade of innovation and manufacturing expertise in silicon photonics technology at our disposal, GF stands ready to unlock the future of high-bandwidth, energy-efficient connectivity with our SCALE solution for co-packaged optics,” said Mike Hogan, chief business officer at GF. “Today, our technology already exceeds the requirements set by the OCI MSA, demonstrating our close collaboration with industry leaders and our technology’s readiness to scale next-generation, AI infrastructure.”

About GF
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com. 

Forward-looking information
This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law.

Media Contact:
Stephanie Gonzalez
stephanie.gonzalez@gf.com

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What is GlobalFoundries' SCALE CPO solution announced May 4, 2026 (GFS)?

SCALE is an OCI MSA-capable co-packaged optics module platform for AI interconnects. According to the company, it combines silicon photonics with CWDM and DWDM and demonstrated 8λ and 16λ bi-directional DWDM to boost bandwidth density.

How does the SCALE solution (GFS) improve bandwidth density for AI data centers?

SCALE uses CWDM and DWDM to transmit multiple wavelengths per fiber, increasing bandwidth density. According to the company, the platform supports bi-directional 8λ and 16λ DWDM and both coarse and dense WDM to scale optical capacity.

What photonic components and packaging features does GlobalFoundries list for SCALE (GFS)?

The platform includes 50Gbps and 100Gbps micro-ring modulators, integrated photodiodes, and TSVs for power and signaling. According to the company, it also supports copper pad pitches from 110μm to sub-45μm for 2.5D/3D stacking.

Did GlobalFoundries (GFS) provide production timing or customer pilots for the SCALE announcement?

No explicit production schedule or named customer pilots were provided in the announcement. According to the company, the platform is fully qualified photonic devices ready to enable customers to move from design to volume production.

Why does GlobalFoundries say SCALE is 'OCI MSA-capable' and what does that mean for GFS customers?

Being OCI MSA-capable means the platform meets OCI MSA optical interconnect specifications for scale-up architectures. According to the company, SCALE exceeds those requirements to help customers adopt standardized CPO interconnects for AI infrastructure.