GlobalFoundries and Egis Partner to Develop Next-Generation Smart Sensing Technology for Mobile and IoT Applications
Rhea-AI Summary
GlobalFoundries (Nasdaq: GFS) has announced a strategic partnership with Egis Technology to develop direct time-of-flight (dToF) sensors on GF's 55nm platform. The collaboration, revealed at GF's Technology Summit in Shanghai, introduces a first-generation FSI SPAD device featuring superior Dark Count Rate and Near-Infrared Photon Detection capabilities.
The new solution enables the development of highly integrated, low-power sensors for smart mobile, IoT, and automotive applications. Key features include high-voltage bias, VCSEL driver, MCU, and ranging core on a single chip. Applications span from laser-assisted auto focus in mobile devices to presence detection in smart buildings and collision avoidance in robots.
The 55nm SPAD technology is now available for mass production at GF's Singapore facility, with process design kit and GlobalShuttle multi-project wafer program access for prototyping.
Positive
- Partnership enables development of next-generation smart sensing technology
- Technology offers best-in-class size, weight, power and cost advantages
- Solution available for immediate mass production in Singapore facility
- Broad application potential across mobile, IoT, and automotive markets
Negative
- None.
Insights
GF's partnership with Egis brings new dToF sensor technology to production, expanding GF's footprint in high-growth sensing markets.
GlobalFoundries' collaboration with Egis Technology marks a significant advancement in direct time-of-flight (dToF) sensing technology. The partnership leverages GF's 55nm platform to deliver single-photon avalanche diode (SPAD) technology with industry-leading specifications in Dark Count Rate and Near-Infrared Photon Detection Probability—critical performance metrics for precise distance measurement applications.
What makes this development particularly valuable is the high level of integration. Rather than requiring separate chips for different functions, GF's solution combines high-voltage bias, VCSEL driver, MCU, and ranging core on a single chip. This integration translates to smaller form factors and lower power consumption—both essential advantages in mobile and IoT applications where space and battery life are premium concerns.
The announcement that the technology is now available for mass production at GF's Singapore facility signals readiness for commercial scale. This positions GF to capture market share in the rapidly growing smart sensing segment spanning mobile devices, laptops, smart appliances, and even robotics applications. For Egis, traditionally strong in display fingerprint sensors, this partnership represents a strategic diversification into the growing 3D sensor market they initiated in 2022.
The availability of a process design kit and dedicated shuttle runs through GF's multi-project wafer program further accelerates potential customer adoption by lowering barriers to entry for designers looking to prototype with this technology, potentially expanding GF's customer base beyond established partners like Egis.
New solution available for production enables low power, highly integrated, direct time-of-flight sensors
MALTA, N.Y., Sept. 23, 2025 (GLOBE NEWSWIRE) -- Today at its annual Technology Summit in Shanghai, China, GlobalFoundries (Nasdaq: GFS)(GF) announced its collaboration with Egis Technology to deliver a new direct time-of-flight (dToF) sensors on GF’s 55nm platform. This new solution supports smart sensing technologies for new and emerging applications in smart mobile, IoT and automotive end markets.
GF’s first-generation FSI (front-side illuminated) SPAD (single-photon avalanche diode) device features best-in-class Dark Count Rate and Near-Infrared Photon Detection Probability for high-SNR dToF sensing. The SPAD device, available as a p-cell, is integrated on GF’s feature-rich 55nm platform which delivers a fully integrated dToF SoC, including high-voltage bias, VCSEL driver, MCU and ranging core, on single, smaller chip. When combined with the broad IP portfolio for GF’s 55nm platform, designers can develop next-generation, application-optimized intelligent sensors with best-in-class size, weight, power and cost advantages at a faster time to market.
Egis, a leading display fingerprint sensor provider, first partnered with GF in 2022 as a strategic move to enter the emerging 3D sensor market. Applications of the new FSI SPAD technology include laser-assisted auto focus for smart mobile devices, laptops and projectors, presence detection for smart appliances and buildings to enable power saving features and collision avoidance in robots and drones.
“GF is committed to enabling the future of smart sensing technologies with solutions like our FSI SPAD device that delivers significant performance and design advantages for next-generation, intelligent sensors,” said Kamal Khouri, senior vice president of GF’s feature-rich CMOS product line. “Through our partnership with Egis, we are excited to bring these advanced direct time-of-flight sensors to the growing marketplace of devices that rely on precise data capture in our increasingly automated world.”
“Egis is proud to partner with GlobalFoundries to develop novel sensor solutions tailored for essential applications,” said Steve Lo, Chairman at Egis. “By leveraging GF’s advanced FSI SPAD technology, we continue our commitment to innovating and simplifying intuitive user experiences.”
55nm SPAD is available for mass production at GF’s high-volume manufacturing facility in Singapore. A process design kit and dedicated shuttle runs through GF’s GlobalShuttle multi-project wafer (MPW) program are available for designers to start prototyping.
About GF
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com.
About Egis Technology Inc.
Egis Technology Inc. (Egis) is a one-stop partner for sensing solutions—spanning capacitive, optical, and ultrasonic technologies and deployed across mobile, PC, automotive, and industrial applications. Beyond sensors, Egis is a global fabless semiconductor group providing connectivity IP and turnkey chiplet design services. With hundreds of patents worldwide, we deliver innovative, forward-looking solutions and intuitive user experiences that create superior value for our customers.
Forward-looking Information
This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law.
Media Contact:
GlobalFoundries
Stephanie Gonzalez
stephanie.gonzalez@gf.com
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