Welcome to our dedicated page for Sk Hynix news (Ticker: HXSCL), a resource for investors and traders seeking the latest updates and insights on Sk Hynix stock.
SK hynix (HXSCL) is a global leader in semiconductor technology, specializing in high-performance memory solutions including DRAM, NAND flash, and AI-optimized high-bandwidth memory (HBM). This dedicated news hub provides investors and industry professionals with timely access to official press releases, financial updates, and strategic announcements.
Our curated collection serves as a comprehensive resource for tracking technological breakthroughs, manufacturing milestones, and corporate developments. Find verified information on earnings reports, product launches, and partnership agreements essential for understanding SK hynix's market position.
Updates cover key operational areas including AI memory innovations for data centers, advanced packaging techniques, and global expansion efforts. All content is sourced from company communications to ensure accuracy and regulatory compliance.
Bookmark this page for centralized access to SK hynix's latest developments in memory technology. Return regularly for insights into how their HBM advancements and semiconductor expertise shape next-generation computing solutions.
SK hynix has achieved a significant milestone by becoming the first company to ship samples of 12-layer HBM4, a next-generation DRAM for AI applications, to major customers ahead of schedule. The company plans to begin mass production in the second half of 2025.
The new HBM4 product showcases industry-leading specifications, featuring:
- Bandwidth exceeding 2TB per second, capable of processing over 400 full-HD movies (5GB each) in one second
- Performance 60% faster than the previous HBM3E generation
- Industry-highest capacity of 36GB using Advanced MR-MUF process
This development follows SK hynix's successful track record as the first mass producer of HBM3 in 2022 and 8- and 12-high HBM3E in 2024, reinforcing their leadership in the AI memory market.
SK hynix is showcasing its cutting-edge memory technology at GTC 2025 in San Jose, California from March 17-21. The company's booth, titled 'Memory, Powering AI and Tomorrow', features advanced memory solutions including 12-high HBM3E and SOCAMM, a new low-power DRAM-based memory module for AI servers.
Key executives, including CEO Kwak Noh-Jung and President Justin Kim, will engage with global AI industry leaders to strengthen partnerships. Following their successful mass production of 12-high HBM3E, SK hynix plans to initiate large-scale production of 12-high HBM4 in the second half, with a model on display at the conference. The company is positioning itself as a Full Stack AI Memory Provider, focusing on solutions for AI data centers, on-device applications, and automotive businesses.
SK hynix has achieved a significant milestone by becoming the first Korean semiconductor company to be named one of the 2025 World's Most Ethical Companies® by Ethisphere. The recognition, which evaluated companies through the Ethics Quotient® framework across 240+ proof points, places SK hynix among just four honorees in the semiconductor industry out of 136 total honorees from 19 countries.
The company's selection reflects its systematic approach to business ethics, including annual employee compliance commitments and surveys. In 2023, SK hynix launched a program to share its business ethics system with partners, extending ethical practices throughout its supply chain. The recognition acknowledges SK hynix's commitment to ethical business practices, strong governance, environmental and social impact, and value chain initiatives.
SK hynix has become the first memory industry company to acquire TISAX certification (Trusted Information Security Assessment Exchange) for its domestic sites in Icheon, Bundang, and Cheongju. This certification validates the company's security capabilities required by the global automotive industry.
The certification comes at a important time as the importance of electronic parts grows with the expansion of electric vehicles, autonomous driving, and connected car technology. Automotive semiconductors, which require higher reliability than general semiconductors, are becoming major components in vehicles, particularly in safety systems like ADAS, brake systems, and engine control.
The TISAX certification, now mandatory for global automotive customers, will enable SK hynix to strengthen cooperation with global automakers and major automotive parts companies while minimizing duplication costs with suppliers.
SK hynix reported record-breaking financial results for 2024, with revenues of 66.19 trillion won (up 102% YoY), operating profit of 23.47 trillion won, and net profit of 19.80 trillion won. The company achieved an operating margin of 35% and net margin of 30%.
Q4 2024 showed strong performance with revenues of 19.77 trillion won (up 12% YoY), operating profit of 8.08 trillion won (up 15% YoY), and net margin of 41%. HBM (High Bandwidth Memory) contributed over 40% of total DRAM revenue, while eSSD sales continued to grow.
The company's financial position improved significantly, with cash equivalents increasing by 5.2 trillion won to 14.2 trillion won and debt decreasing by 6.8 trillion won to 22.7 trillion won. SK hynix increased its annual fixed dividend by 25% to 1,500 won per share, with total cash dividends reaching 1 trillion won annually.
SK hynix reported exceptional financial results for FY2024, achieving record-breaking performance with revenues of 66.1930 trillion won, operating profit of 23.4673 trillion won (35% margin), and net profit of 19.7969 trillion won (30% margin). The yearly revenues surpassed the previous 2022 record by over 21 trillion won.
Fourth quarter performance showed strong growth with revenues increasing 12% to 19.7670 trillion won, operating profit up 15% to 8.0828 trillion won (41% margin), and net profit of 8.0065 trillion won. This success was driven by sustained AI memory demand, particularly HBM technology which represented over 40% of total DRAM revenue.
The company's financial position strengthened significantly, with cash equivalents increasing by 5.2 trillion won to 14.2 trillion won and debt decreasing by 6.8 trillion won to 22.7 trillion won by end-2024. SK hynix also increased its annual fixed dividend by 25% to 1,500 won per share.
SK hynix announced its participation in CES 2025 (January 7-10, Las Vegas), where it will showcase its AI memory technologies and present its vision as a 'Full Stack AI Memory Provider'. The company will highlight several key products, including:
- HBM3E 16-layer products, developed in November 2024 using advanced MR-MUF process
- The D5-P5336 122TB enterprise SSD model developed by subsidiary Solidigm
- QLC-based 61TB products developed in December
- On-device AI products like LPCAMM2 and ZUFS 4.0 for edge devices
The company also announced plans to produce 6th generation HBM (HBM4) in the second half of 2025 to lead the customized HBM market. SK hynix will share exhibition space with SK Telecom, SKC, and SK Enmove under the theme 'Innovative AI, Sustainable Tomorrow.'
SK hynix has developed 'PS1012 U.2', a 61TB SSD designed for AI data centers using QLC technology. The new product features PCIe 5.0 connectivity, delivering data transfer speeds up to 32GT/s and doubling sequential read performance to 13GB/s compared to previous generation products. The company plans to provide samples to global server manufacturers within this year and expand the product line to 122TB in Q3 2024. SK hynix aims to develop 244TB products based on their 321-high 4D NAND technology. This development strengthens synergy with Solidigm in the AI data center SSD market and supports OCP 2.0 version for enhanced compatibility with various data center server devices.
SK hynix announced a new shareholder return program for 2025-27, increasing its annual fixed dividend by 25% to 1,500 won per share from 1,200 won. The total cash dividend is expected to reach 1 trillion won annually. The company will maintain its policy of allocating 50% of accumulated free cash flow for shareholder returns and set aside 5% for financial structure enhancement. Additionally, SK hynix introduced a 'Value Up' initiative that includes Capex Discipline, maintaining annual investment at mid-30% of revenues. The company aims to balance shareholder returns with financial soundness while strengthening its position in AI memory.
SK hynix has begun mass production of the world's first 321-high 4D NAND Flash with 1Tb capacity, featuring triple level cell technology. The breakthrough comes through the innovative 'Three Plugs' process technology, which enables stacking over 300 layers. The new product shows 12% improvement in data transfer speed, 13% better reading performance, and 10% enhanced power efficiency compared to previous generation. Production efficiency improved by 59%. The company plans to supply these products to customers from first half 2025, targeting AI applications that require low power and high performance.
