SK hynix Showcases Industry-Leading Memory Technology at GTC 2025
Rhea-AI Summary
SK hynix is showcasing its cutting-edge memory technology at GTC 2025 in San Jose, California from March 17-21. The company's booth, titled 'Memory, Powering AI and Tomorrow', features advanced memory solutions including 12-high HBM3E and SOCAMM, a new low-power DRAM-based memory module for AI servers.
Key executives, including CEO Kwak Noh-Jung and President Justin Kim, will engage with global AI industry leaders to strengthen partnerships. Following their successful mass production of 12-high HBM3E, SK hynix plans to initiate large-scale production of 12-high HBM4 in the second half, with a model on display at the conference. The company is positioning itself as a Full Stack AI Memory Provider, focusing on solutions for AI data centers, on-device applications, and automotive businesses.
Positive
- First-to-market with mass production of 12-high HBM3E
- Planned production launch of next-gen 12-high HBM4 in H2 2025
- Expansion into AI server market with new SOCAMM memory standard
Negative
- None.
- Various memory products for AI data centers, on-device, automotive businesses on display
The company will present HBM and other memory products for AI data centers and on-device* and memory solutions for automotive business essential for AI era.
*On-device: a technology that implements certain functions on the device itself, instead of going through computation by a physically separated server. As for the on-device AI, a smart device's direct collection and computation of information allows fast reactions of the AI performance, while promising an improved customized AI service
Among the industry-leading AI memory technology to be displayed at the show are 12-high HBM3E and SOCAMM**, a new memory standard for AI servers.
**SOCAMM(Small Outline Compression Attached Memory Module): a low-power DRAM-based memory module for AI server
At the event, top company executives led by Chief Executive Officer Kwak Noh-Jung, President, Head of AI Infra and Chief Marketing Officer Juseon (Justin) Kim and Head of Global S&M Lee Sangrak will meet with the leaders of the global AI industry to enhance collaboration.
Following the industry's first mass production and supply of the 12-high HBM3E, SK hynix is now planning to complete the preparatory works for large-scale production of the 12-high HBM4 within the second half for immediate start of supply to order. At GTC 2025, a model of the 12-high HBM4, which is under development, will also be displayed.
"We are proud to present our line-up of industry-leading products at GTC 2025," President & Head of AI Infra Juseon (Justin) Kim said. "With a differentiated competitiveness in the AI memory space, we are on track to bring our future as the Full Stack AI Memory Provider*** forward."
*** Full Stack AI Memory Provider: SK hynix's vision to be a provider of a full-range of AI memory products and technologies
About SK hynix Inc.
SK hynix Inc., headquartered in
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SOURCE SK hynix Inc.