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SK hynix Showcases Industry-Leading Memory Technology at GTC 2025

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SK hynix is showcasing its cutting-edge memory technology at GTC 2025 in San Jose, California from March 17-21. The company's booth, titled 'Memory, Powering AI and Tomorrow', features advanced memory solutions including 12-high HBM3E and SOCAMM, a new low-power DRAM-based memory module for AI servers.

Key executives, including CEO Kwak Noh-Jung and President Justin Kim, will engage with global AI industry leaders to strengthen partnerships. Following their successful mass production of 12-high HBM3E, SK hynix plans to initiate large-scale production of 12-high HBM4 in the second half, with a model on display at the conference. The company is positioning itself as a Full Stack AI Memory Provider, focusing on solutions for AI data centers, on-device applications, and automotive businesses.

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Positive

  • First-to-market with mass production of 12-high HBM3E
  • Planned production launch of next-gen 12-high HBM4 in H2 2025
  • Expansion into AI server market with new SOCAMM memory standard

Negative

  • None.
  • Various memory products for AI data centers, on-device, automotive businesses on display

SEOUL, South Korea, March 18, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will participate in the GTC 2025, a global AI conference taking place March 17-21 in San Jose, California, with a booth titled "Memory, Powering AI and Tomorrow".

The company will present HBM and other memory products for AI data centers and on-device* and memory solutions for automotive business essential for AI era.

*On-device: a technology that implements certain functions on the device itself, instead of going through computation by a physically separated server. As for the on-device AI, a smart device's direct collection and computation of information allows fast reactions of the AI performance, while promising an improved customized AI service

Among the industry-leading AI memory technology to be displayed at the show are 12-high HBM3E and SOCAMM**, a new memory standard for AI servers.

**SOCAMM(Small Outline Compression Attached Memory Module): a low-power DRAM-based memory module for AI server

At the event, top company executives led by Chief Executive Officer Kwak Noh-Jung, President, Head of AI Infra and Chief Marketing Officer Juseon (Justin) Kim and Head of Global S&M Lee Sangrak will meet with the leaders of the global AI industry to enhance collaboration.

Following the industry's first mass production and supply of the 12-high HBM3E, SK hynix is now planning to complete the preparatory works for large-scale production of the 12-high HBM4 within the second half for immediate start of supply to order. At GTC 2025, a model of the 12-high HBM4, which is under development, will also be displayed.

"We are proud to present our line-up of industry-leading products at GTC 2025," President & Head of AI Infra Juseon (Justin) Kim said. "With a differentiated competitiveness in the AI memory space, we are on track to bring our future as the Full Stack AI Memory Provider*** forward."

*** Full Stack AI Memory Provider: SK hynix's vision to be a provider of a full-range of AI memory products and technologies

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Cision View original content to download multimedia:https://www.prnewswire.com/news-releases/sk-hynix-showcases-industry-leading-memory-technology-at-gtc-2025-302404502.html

SOURCE SK hynix Inc.

FAQ

What new memory products is SK hynix showcasing at GTC 2025?

SK hynix is showcasing 12-high HBM3E, SOCAMM (a new memory standard for AI servers), and a model of the upcoming 12-high HBM4.

When will SK hynix begin production of 12-high HBM4?

SK hynix plans to complete preparatory works and begin supply of 12-high HBM4 within the second half of 2025.

What is SOCAMM in SK hynix's new product lineup?

SOCAMM (Small Outline Compression Attached Memory Module) is a low-power DRAM-based memory module specifically designed for AI servers.

What markets is SK hynix targeting with its memory solutions?

SK hynix is targeting AI data centers, on-device applications, and automotive businesses with its memory solutions.
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