SK hynix Ships World's First 12-Layer HBM4 Samples to Customers

Rhea-AI Summary

SK hynix has achieved a significant milestone by becoming the first company to ship samples of 12-layer HBM4, a next-generation DRAM for AI applications, to major customers ahead of schedule. The company plans to begin mass production in the second half of 2025.

The new HBM4 product showcases industry-leading specifications, featuring:

• Bandwidth exceeding 2TB per second, capable of processing over 400 full-HD movies (5GB each) in one second
• Performance 60% faster than the previous HBM3E generation
• Industry-highest capacity of 36GB using Advanced MR-MUF process

This development follows SK hynix's successful track record as the first mass producer of HBM3 in 2022 and 8- and 12-high HBM3E in 2024, reinforcing their leadership in the AI memory market.

Positive

• First-to-market advantage with 12-layer HBM4 samples
• Industry-leading bandwidth exceeding 2TB/second, 60% faster than previous generation
• Highest capacity (36GB) among 12-layer HBM products
• Early delivery strengthens market leadership in AI memory segment

Negative

• Mass production not starting until 2H 2025
• Still requires customer certification process completion

- Provision of 12-layer HBM4 samples, a new DRAM product with ultra-high performance for AI, to major customers comes earlier than scheduled

- Mass production of products with best-in-class bandwidth and capacity to start in 2H 2025 following certification process

- Enhancement of position as front-runner in AI ecosystem follows years of efforts to overcome technological limitations

SEOUL, South Korea, March 18, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world.

The samples were delivered ahead of schedule based on SK hynix's technological edge and production experience that have led the HBM market, and the company is to start the certification process for the customers. SK hynix aims to complete preparations for mass production of 12-layer HBM4 products within the second half of the year, strengthening its position in the next-generation AI memory market.

The 12-layer HBM4 provided as samples this time feature the industry's best capacity and speed which are essential for AI memory products.

The product has implemented bandwidth¹ capable of processing more than 2TB (terabytes) of data per second for the first time. This translates to processing data equivalent to more than 400 full-HD movies (5GB each) in a second, which is more than 60 percent faster than the previous generation, HBM3E.

*Bandwidth¹: In HBM products, bandwidth refers to the total data capacity that one HBM package can process per second.

SK hynix also adopted the Advanced MR-MUF process to achieve the capacity of 36GB, which is the highest among 12-layer HBM products. The process, of which competitiveness has been proved through a successful production of the previous generation, helps prevent chip warpage, while maximizing product stability by improving heat dissipation.

Following its achievement as the industry's first provider to mass produce HBM3 in 2022, and 8- and 12-high HBM3E in 2024, SK hynix has been leading the AI memory market by developing and supplying HBM products in a timely manner.

"We have enhanced our position as a front-runner in the AI ecosystem following years of consistent efforts to overcome technological challenges in accordance with customer demands," said Justin Kim, President & Head of AI Infra at SK hynix. "We are now ready to smoothly proceed with the performance certification and preparatory works for mass production, taking advantage of the experience we have built as the industry's largest HBM provider."

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

 

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SOURCE SK hynix Inc.

FAQ

What are the key performance specifications of SK hynix's new 12-layer HBM4?

The 12-layer HBM4 features bandwidth exceeding 2TB/second (60% faster than HBM3E) and 36GB capacity, making it the highest capacity among 12-layer HBM products.

When will SK hynix begin mass production of the 12-layer HBM4?

SK hynix plans to start mass production of 12-layer HBM4 in the second half of 2025, following customer certification processes.

How does the new HBM4's data processing capability compare to previous generations?

The HBM4 processes data 60% faster than the previous HBM3E generation, capable of handling over 400 full-HD movies (5GB each) per second.

What technological process does SK hynix use to ensure stability in the 12-layer HBM4?

SK hynix uses the Advanced MR-MUF process, which prevents chip warpage and maximizes product stability through improved heat dissipation.