SK hynix Develops Industry's First 1c DDR5
Rhea-AI Summary
SK hynix has developed the industry's first 16Gb DDR5 using its 1c node, the sixth generation of the 10nm process. This breakthrough marks the beginning of extreme scaling closer to 10nm in memory process technology. The company achieved this by extending the platform of its industry-leading 1b technology.
Key improvements include:
- Enhanced cost competitiveness through new material adoption and EUV process optimization
- 11% improvement in operating speed to 8Gbps
- 9% improvement in power efficiency
- Potential 30% reduction in data center electricity costs
SK hynix plans to begin mass production within the year, with volume shipment expected in 2025. The company aims to apply this technology to next-generation products like HBM, LPDDR6, and GDDR7.
Positive
- First in industry to develop 16Gb DDR5 using 1c node technology
- 11% improvement in operating speed to 8Gbps
- 9% enhancement in power efficiency
- Potential 30% reduction in data center electricity costs
- 30% increase in productivity through design innovation
- Mass production readiness within the year
- Planned application to high-value products like HBM, LPDDR6, and GDDR7
Negative
- None.
- 1c node, 6th generation of 10nm process, developed in most efficient way by applying platform of industry-leading 1b technology
- Cost competitiveness improved with adoption of new material, optimization of EUV process, while power efficiency enhanced to help reduce electricity cost of data centers by
30% maximum - Mass production expected to be ready this year for volume shipment in 2025
- Application of 1c node to leading-edge DRAM products to bring differentiated values to customers
The success marks the beginning of the extreme scaling to the level closer to 10nm in the memory process technology.
The degree of difficulty to advance the shrinking process of the 10nm-range DRAM technology has grown over generations, but SK hynix has become the first in the industry to overcome the technological limitations by raising the level of completion in design, thanks to its industry-leading technology of the 1b, the fifth generation of the 10nm process.
SK hynix said it will be ready for mass production of the 1c DDR5 within the year to start volume shipment next year.
In order to reduce potential errors stemming from the procedure of advancing the process and transfer the advantage of the 1b, which is widely applauded for its best performing DRAM, in the most efficient way, the company extended the platform of the 1b DRAM for development of 1c.
The new product comes with an improvement in cost competitiveness, compared with the previous generation, by adopting a new material in certain process of the extreme ultra violet, or EUV, while optimizing the EUV application process of total. SK hynix also enhanced productivity by more than
The operating speed of the 1c DDR5, expected to be adopted for high-performance data centers, is improved by
"We are committed to providing differentiated values to customers by applying the 1c technology equipped with the best performance and cost competitiveness to our major next-generation products including HBM, LPDDR6, and GDDR7," said Head of DRAM Development Kim Jonghwan. "We will continue to work towards maintaining the leadership in the DRAM space and position as the most-trusted AI memory solution provider."
*HBM(High Bandwidth Memory): a high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to conventional DRAM products. Since the introduction of the first HBM, the generation has shifted to HBM2, HBM2E, HBM3, HBM3E, HBM4 and HBM4E. |
*LPDDR: low power DRAM for mobile devices, including smartphones and tablets, which aims to minimize power consumption and features low voltage operation. The latest specifications are for the 7th generation, succeeding the series that end with 1, 2, 3, 4, 4X, 5 and 5X. |
*GDDR(Graphics DDR): a standard specification of graphics DRAM defined by the Joint Electron Device Engineering Council (JEDEC) and specialized for processing graphics more quickly. Its generation has shifted from GDDR3, GDDR5, GDDR5X, GDDR6 to GDDR7. With the newer generation promising faster speed and higher power efficiency, GDDR has now become one of the most popular memory chips for AI. |
About SK hynix Inc.
SK hynix Inc., headquartered in
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SOURCE SK hynix Inc.