SK hynix to Showcase Next-generation Technology At FMS 2024
Rhea-AI Summary
SK hynix Inc. announced its participation in FMS 2024, a global semiconductor memory event in Santa Clara, California, from August 6-8. The company will showcase advancements in memory technologies and present its future visions in the AI space. Key highlights include:
1. A keynote speech on "AI Memory & Storage Solution Leadership and Vision for AI Era"
2. Display of next-generation AI memory products, including 12-layer HBM3E and 321-high NAND
3. Demonstration of customer systems featuring SK hynix's flagship products
4. Sponsorship of the FMS Super Women Conference to promote diversity in the industry
SK hynix aims to promote its leadership in AI memory solutions and showcase its technological competitiveness in the global market.
Positive
- Planned mass production of 12-layer HBM3E in Q3 2024
- Scheduled shipment of 321-high NAND from H1 2025
- Strong partnerships with leading technology companies
- Expanding product portfolio to include integrated AI memory solutions
Negative
- None.
- To display AI memory product portfolio, introduce vision through keynote speech
- Key female leader to speak on role of diversity for technological innovation
- To promote stronger leadership in AI with competitiveness in integrated solutions
The Future Memory and Storage, formerly known as the Flash Memory Summit for NAND providers mainly, was rebranded this year to invite a wider range of participants including DRAM and storage providers amid growing interest in AI technology.
SK hynix said that it will expand the scope of participation this year through not only display of the products, but also delivering keynote speech to introduce its future visions.
The company plans to take full advantage of the event to promote its competitiveness leading the AI memory solution industry as it did with the announcement of the development of the industry's highest 321-layer NAND at FMS last year.
Opening the event will be a keynote speech by Unoh Kwon, Head of HBM Process Integration and Chunsung Kim, Head of SSD PMO, at SK hynix, on "AI Memory & Storage Solution Leadership and Vision for AI Era." The two executives will introduce the company's DRAM and NAND product portfolios and AI memory solutions optimized for AI implementation, respectively.
At the event, SK hynix will display the samples of the next-generation AI memory products such as the 12-layer HBM3E, expected to be mass produced in the third quarter, and 321-high NAND planned to be shipped from the first half of next year.
The company will also display the systems of customers completed with its flagship products to show its strong partnership with the world's biggest technology companies.
In a bid to show its commitment to diversity, SK hynix has also decided to sponsor the FMS Super Women Conference taking on the sidelines of the event to encourage prominent female leaders in the memory industry. Haesoon Oh, Head of NAND Advanced Process Integration and the company's first female executive-level fellow researcher, will make a presentation on the role of diversity for SK hynix's future technology innovation.
"With the AI era opening in full, the importance of memory solutions, a combination of multiple products to increase performance, instead of single DRAM and NAND products, is growing," said Justin Kim, President and the Head of AI Infra at SK hynix. "At the FMS, we will imprint our competitiveness and technological leadership in the global market."
About SK hynix Inc.
SK hynix Inc., headquartered in
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SOURCE SK hynix Inc.