Advanced packaging technologies are modern ways of assembling and connecting semiconductor chips and related parts into finished modules, using approaches such as stacking chips, placing smaller chiplets side‑by‑side, and creating much finer internal wiring to make devices smaller, faster and more energy‑efficient. They matter to investors because packaging often determines product performance, manufacturing cost, and supply reliability—so companies that adopt superior packaging can win customers, improve margins and alter competitive positions much like a maker of compact, high‑performance gadgets gaining an edge.
chiplet-based architecturestechnical
Chiplet-based architectures split a processor or complex chip into several smaller, specialized pieces (chiplets) that are packaged together to work as one unit, like building a model from Lego bricks instead of molding a single giant piece. This matters to investors because it can lower manufacturing cost, improve yields, speed up design cycles and allow companies to mix and match components from different suppliers—potentially boosting margins, time-to-market and competitive flexibility.
heterogeneous integrationtechnical
Heterogeneous integration is the practice of combining different types of electronic components — such as processors, memory, sensors and specialized chips — into a single package or tightly linked module, rather than building everything on one uniform chip. Like putting varied ingredients into one compact lunchbox to save space and improve function, it matters to investors because it can boost product performance, lower power use, shorten development time and create competitive or cost advantages that affect revenue and margins.
2.5d and 3d stackingtechnical
2.5D and 3D stacking are chip-packaging techniques that put multiple semiconductor dies closer together to boost speed and reduce power use. 2.5D places separate chips side-by-side on a shared platform like components on a circuit board, while 3D stacks chips vertically with direct connections like books piled and wired through the middle. Investors watch these approaches because they can improve performance, shrink product size, and change manufacturing cost and supply-chain dynamics.
edge computingtechnical
Edge computing is a technology that processes data close to where it is generated, such as sensors or devices, rather than sending it all to a distant central location. This allows for faster decision-making and reduces delays, much like having a local office handle urgent matters instead of waiting for instructions from a main headquarters. For investors, it signifies improved efficiency and real-time insights, which can enhance the performance of technology-dependent industries.
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Enterprises embrace emerging performance and efficiency technologies while building more resilient supply chains, ISG Provider Lens® report says
STAMFORD, Conn.--(BUSINESS WIRE)--
U.S. semiconductor companies are accelerating investments in AI-focused chip development, advanced packaging technologies and new supply chain strategies as semiconductors become increasingly critical to digital transformation and economic competitiveness, according to a new research report published today by Information Services Group (ISG) (Nasdaq: III), a global AI-centered technology research and advisory firm.
The 2026 ISG Provider Lens® Semiconductor Industry — Services and Solutions report for the U.S. finds that the rapid growth of AI and high-performance computing is reshaping semiconductor design, engineering and manufacturing. As semiconductors become strategic assets for both enterprises and governments, organizations are navigating geopolitical changes, supply chain realignment and rising pressure to innovate faster while making operations more resilient.
“Competitive advantage in semiconductors is no longer determined solely by who can design the fastest chip,” said Bob Krohn, partner and manufacturing lead, ISG. “The companies pulling ahead are those that can simultaneously manage design complexity, packaging innovation, supply chain resilience and access to specialized talent. Success increasingly depends on orchestrating an entire ecosystem, not just advancing a single technology.”
The proliferation of AI workloads is driving demand for high-performance and specialized chips in data centers, edge computing infrastructure and consumer devices. Semiconductor enterprises in the U.S. are investing in AI-optimized silicon for complex workloads, balancing performance requirements with energy efficiency. This trend is intensifying innovation and competition throughout the semiconductor ecosystem.
U.S. semiconductor companies are also adopting advanced packaging technologies and chiplet-based architectures, which combine multiple chips into a single package, to address the rising cost and complexity of chip scaling. Approaches such as heterogeneous integration and 2.5D and 3D stacking are helping enterprises improve performance, increase flexibility and accelerate innovation while enhancing energy efficiency.
Recent supply chain disruptions and U.S. government policies are prompting organizations to build resilience through domestic manufacturing investments, regional diversification and multi-source procurement. Enterprises are placing greater emphasis on risk mitigation and long-term supply security even as these efforts increase operational complexity and costs.
“Competitive advantage in semiconductors is increasingly defined by the ability to combine AI-driven design innovation with engineering and manufacturing that can withstand disruptions,” said Swadhin Pradhan, principal analyst, ISG, and lead author of the report. “Service providers are helping semiconductor companies navigate growing technical complexity through advanced engineering services, design automation and packaging expertise.”
The report also explores other trends affecting the U.S. semiconductor industry, including the introduction of sustainable manufacturing practices and expansion into emerging markets for skilled talent while strengthening regional ecosystems.
For more insights into the challenges faced by semiconductor enterprises in the U.S., along with ISG’s advice for addressing them, see the ISG Provider Lens Focal Points briefing here.
The report evaluates the capabilities of 36 providers across four quadrants: Design, Test and Verification Services, Manufacturing and Engineering Services, Supply Chain and Procurement Services and Technology Transformation and Consulting.
The report names Accenture, Capgemini, Cognizant, HCLTech, IBM, Infosys, TCS and Wipro as Leaders in all four quadrants. It names Deloitte as a Leader in three quadrants and Cyient, LTTS, NTT DATA and Quest Global as Leaders in two quadrants each. EY, Genpact, LTM, MosChip and Tech Mahindra are named as Leaders in one quadrant each.
In addition, Tech Mahindra is named as a Rising Star — a company with a “promising portfolio” and “high future potential” by ISG’s definition — in two quadrants. The report names eInfochips and LTM as Rising Stars in one quadrant each.
The 2026 ISG Provider Lens Semiconductor Industry — Services and Solutions report for the U.S. is available to subscribers or for one-time purchase on this webpage.
About ISG
ISG (Nasdaq: III) is a global AI-centered technology research and advisory firm. A trusted partner to more than 900 clients, including 75 of the world’s top 100 enterprises, ISG is a long-time leader in technology and business services that is now at the forefront of leveraging AI to help organizations achieve operational excellence and faster growth. The firm, founded in 2006, is known for its proprietary market data and research, in-depth knowledge and governance of provider ecosystems, and the expertise of its 1,500 professionals worldwide working together to help clients maximize the value of their technology investments.
