Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

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Key Terms

chiplet technical

A chiplet is a small, specialized piece of a computer chip designed to be combined with other chiplets on a single package to create a larger, complete processor — think of it like Lego bricks that snap together to build different models. For investors, chiplets matter because they can lower manufacturing costs, improve production yields, and speed innovation by letting designers mix and match proven building blocks, affecting profit margins and competitive position in the semiconductor industry.

3dic technical

3DIC (three-dimensional integrated circuit) is a semiconductor design that stacks multiple chips or layers of circuitry vertically and connects them so they act as a single, compact device. Think of it like stacking floors in a building instead of spreading rooms across a wide plot: it packs more functionality into a smaller space while improving speed and energy efficiency. Investors watch 3DIC adoption because it can lower manufacturing costs per function, enable faster or more power-efficient products, and create competitive advantages for makers of chips and devices, affecting revenue, margins, and market position.

uci e technical

UCIe (Universal Chiplet Interconnect Express) is an open industry standard that defines how small, separate pieces of a computer chip—called chiplets—can be snapped together inside a single package so they work as one unit. For investors, it matters because UCIe can lower development costs, speed product innovation and increase competition by allowing different makers’ components to interoperate, similar to how USB made peripherals plug-and-play across brands.

vtf (voltage transfer function) technical

The voltage transfer function (vtf) is a mathematical description of how an electronic component or circuit converts an input voltage into an output voltage, showing whether it amplifies, reduces or alters the signal. Investors pay attention because this behavior determines product performance, power use, compatibility and reliability — like a volume knob that tells you how loud a device will actually sound — and can affect manufacturing costs, customer acceptance and competitive advantage.

electromagnetic-based simulation technical

A technique that uses computer models to recreate how electric and magnetic fields behave around devices, materials or systems so engineers can predict performance without building physical prototypes. Think of it like a wind tunnel for electricity and radio waves: it helps spot problems, shorten development time, reduce testing costs and estimate regulatory or safety hurdles, which matters to investors because it lowers technical risk and can speed a product’s path to market.

02/17/2026 - 11:00 AM

Solution addresses design bottleneck by automating complex workflows

SANTA ROSA, Calif.--(BUSINESS WIRE)-- Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications.

3D Interconnect Designer simplifies high-speed 3D interconnect design for silicon bridges and interposers.

As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect designs for multi-die and stacked-die applications which traditional workflows struggle to handle efficiently. As a result, teams spend significant time manually optimizing the interconnects that include vias, transmission lines, solder balls, and micro-bumps while ensuring signal and power integrity in densely packed systems. This results in more design spins and longer product development cycles, creating a bottleneck that can delay product launches and increase development costs.

Keysight EDA software streamlines the process with a dedicated workflow for designing and optimizing 3D interconnects accurately. The tool handles complex geometries, including hatched or waffled ground planes, which are critical to overcome manufacturing and fabrication constraints, especially silicon processes such as interposers and bridges, in advanced package designs. By enabling engineers to quickly design, optimize, and validate 3D interconnects used in chiplets and 3DICs, it minimizes iterations and speeds time-to-market.

Key benefits include:

Accelerates Design Cycles: Streamlined automation removes time-consuming manual steps in 3D interconnect design, minimizing errors and boosting first-pass success
Reduced Compliance Risk: Validates designs against emerging standards such as UCIe and BoW, ex VTF (Voltage Transfer Function), early in the lifecycle, reducing the risk of late-stage failures that lead to costly redesigns
Predicts Performance Accurately: Electromagnetic-based simulation provides precise electrical analysis of printed circuit boards (PCB) and package 3D interconnect designs

The solution integrates with Keysight's EDA tools as well as supporting the standalone version, enabling teams to incorporate 3D interconnect design and optimization into existing workflows. When combined with Chiplet PHY Designer, engineers can design and optimize 3D interconnects specifically for chiplets and three-dimensional integrated circuits (3DICs), ensuring accuracy and reducing costly iterations in multi-die systems.

Nilesh Kamdar, EDA Design and Verification General Manager at Keysight, said:
“With today's complexity, manual 3D interconnect design and optimization have become a significant bottleneck. By streamlining the process and providing early insights into potential issues like signal and power integrity, we're enabling engineers to get products to market faster and deliver compliant designs on tighter timelines.”

Resources

Video: Chiplet 3D Interconnect Designer
Webpage: Chiplet 3D Interconnect Designer
Webpage: What’s New in High-Speed Digital Design
Demonstration at DesignCon: The Chiplet 3D Interconnect Designer will be showcased at the Keysight booth #1039, during the conference.

About Keysight Technologies

At Keysight (NYSE: KEYS), we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product life cycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world. Learn more at Keysight Newsroom and www.keysight.com.