Kulicke & Soffa Industries Inc. reports recurring developments in semiconductor assembly technology, including capital equipment and expendable tools used to assemble semiconductor devices. The company serves automotive, compute, industrial, memory and communications markets, with business areas tied to ball bonding, wedge bonding, advanced solutions, and aftermarket products and services.
News for KLIC commonly covers quarterly financial results, business outlook updates, conference-call schedules, dividends, and product portfolio expansion. Recent company updates have addressed memory-focused interconnect solutions, the ProMEM suite, advanced thermo-compression and hybrid bonding, vertical wire technologies, power semiconductor assembly, advanced dispense, and the ASTERION™-TW ultrasonic terminal welding system for power module manufacturing.
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) has announced significant milestones in the adoption of its Thermo-Compression Bonding (TCB) technology. The company has introduced its latest APTURA™ Thermo-Compression platform and secured multiple customer wins for its TCB offerings. K&S has also demonstrated an alternative path to chip-to-wafer hybrid bonding through industry collaborations.
Additionally, K&S has joined the 'US-Joint' consortium, led by Resonac Holdings , to support advanced packaging solutions development. The consortium will establish an R&D facility in Silicon Valley, expected to be fully operational by 2025. K&S reports that its TCB business has grown over 10 times in the past four years, indicating strong market adoption of this technology for advanced chiplet and stacked-die applications in AI, HPC, Mobile, and Edge devices.
Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC), a global leader in semiconductor, LED, and electronic assembly equipment, has announced a conference call scheduled for August 7, 2024, at 4:30 pm EDT. The call will discuss the company's third fiscal quarter 2024 financial results and business outlook. K&S will release its financial results on the same day at approximately 4:00 pm EDT.
Interested parties can access the call by dialing +1-877-407-8037 (US) or +1-201-689-8037 (international). A live webcast and replay will be available at investor.kns.com. A replay of the call will be accessible until August 15, 2024, by calling +1-877-660-6853 (US) or +1-201-612-7415 (international) with the replay ID 13743543.
Kulicke & Soffa Industries (NASDAQ: KLIC) declared a quarterly dividend of $0.20 per share, payable on July 9, 2024, to shareholders of record as of June 20, 2024. The company, founded in 1951, specializes in semiconductor and electronics assembly solutions. Its product range supports various markets, including advanced display, automotive, communications, computing, consumer electronics, data storage, energy storage, and industrial sectors.
Kulicke & Soffa announced a significant order for 1,000 RAPID™ Pro systems for a key customer in the Assembly and Test market, supporting the semiconductor industry's digital transformation. The order includes the latest ProSuite technology, enhancing production capabilities for wire bonded packages. The company's Ball Bonding segment revenue has surged by over 50% in the second fiscal quarter of 2024.
Kulicke and Soffa reported financial results for the second quarter of 2024, with a net revenue of $172.1 million and a net loss of $102.7 million. The company experienced a decrease in gross margin and operating margin compared to the previous year. Despite challenges in the Advanced Display market, the company remains focused on operational efficiency. Kulicke & Soffa aims to achieve new milestones in customer and market adoption over the coming quarters.
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