Marvell Technology (MRVL) Stock News

Marvell Technology (NASDAQ: MRVL) has appointed Rajiv Ramaswami, the current President and CEO of Nutanix, to its Board of Directors effective July 22, 2025. Ramaswami brings over 30 years of technology industry experience, with expertise across software, cloud services, network infrastructure, and semiconductors.

Prior to his current role at Nutanix, Ramaswami served as COO of Products and Cloud Services at VMware and held senior leadership positions at prominent technology companies including Broadcom, Cisco, Nortel, Tellabs, and IBM. He holds advanced degrees in Electrical Engineering and Computer Science from UC Berkeley and IIT Madras.

Marvell Technology (NASDAQ: MRVL) has announced a strategic collaboration with Ferric Inc. to develop optimized integrated power solutions for Marvell's custom silicon platforms. The partnership focuses on implementing Ferric's Integrated Voltage Regulators (IVRs) into Marvell's processors for AI and cloud infrastructure.

Ferric's proprietary thin-film magnetic technology enables DC-DC power converters that are 10x smaller than conventional solutions. These IVRs can be integrated at the silicon level, delivering power with minimal distance and loss, which results in improved efficiency, speed, and scalability for multi-kilowatt compute platforms.

Marvell Technology (NASDAQ: MRVL) has introduced the industry's first 2nm custom Static Random Access Memory (SRAM), designed to enhance the performance of custom XPUs and devices for cloud data centers and AI clusters. The innovative SRAM delivers up to 6 gigabits of high-speed memory while operating at up to 3.75 GHz. Key benefits include up to 15% total die area savings and 66% reduction in on-chip memory standby power consumption. The custom SRAM achieves the industry's highest bandwidth per square millimeter, allowing chip designers to integrate more compute cores, expand memory, or reduce device size. This development is part of Marvell's broader custom technology platform strategy, which includes previous innovations like CXL technology and custom HBM technology, aimed at improving memory hierarchy performance in accelerated infrastructure.

Marvell Technology (NASDAQ: MRVL) has unveiled its Package Integrated Voltage Regulator (PIVR) power solutions, designed to revolutionize power delivery systems for AI and cloud infrastructure. The solution enables a transition from traditional board-level power systems to integrated silicon chips, offering up to 2X higher current density and 85% reduction in transmission losses. PIVR supports the development of 4+ kilowatt compute platforms, featuring improved power densities of 3-4 amperes per sq. mm. compared to typical 1.5-2 amperes per sq. mm. solutions. The technology enables real-time power tuning through dynamic voltage scaling and provides a foundation for enhanced computing operations in data centers. Marvell has partnered with industry leaders including Infineon, MPS, Empower Semiconductor, Endura Technologies, Ferric, and Photeon Technologies to deliver pre-validated PIVR solutions for custom XPU customers.

Marvell Technology (NASDAQ: MRVL) has announced a quarterly dividend payment of $0.06 per share of common stock. The dividend will be paid on July 31, 2025, to shareholders who are recorded as stockholders as of July 11, 2025. This dividend declaration represents Marvell's continued commitment to returning value to shareholders through regular dividend payments.

Marvell Technology (NASDAQ: MRVL) has unveiled its custom Ultra Accelerator Link (UALink) scale-up solution, expanding its AI compute platform capabilities. The solution includes comprehensive IPs featuring 224G SerDes, UALink Physical Layer IP, Configurable Controller IP, Scalable Switch Core, and advanced packaging options. This open standards-based technology enables efficient scaling of AI infrastructure, supporting hundreds to thousands of AI accelerators in scale-up deployments. The solution addresses hyperscalers' challenges in scaling AI infrastructure while maintaining high performance and low latency. As a member of the UALink Consortium, Marvell is contributing to developing open specifications for accelerator connectivity, with support from industry leaders like AMD for advancing scale-up networks.

Marvell Technology (NASDAQ: MRVL) reported strong Q1 FY2026 results with record revenue of $1.895 billion, representing a 63% year-over-year increase. The company posted GAAP net income of $177.9 million ($0.20 per diluted share) and non-GAAP net income of $540.0 million ($0.62 per diluted share). Cash flow from operations was $332.9 million. The growth was primarily driven by strong AI demand in the data center market, benefiting from custom silicon programs and electro-optics products. For Q2 FY2026, Marvell forecasts revenue of $2.000 billion (±5%) with expected non-GAAP diluted EPS of $0.67 (±$0.05). The company plans to host a Custom AI Investor Event on June 17, 2025, to showcase technological advances and long-term market share goals in custom AI infrastructure.

Marvell Technology (NASDAQ: MRVL) has unveiled an innovative multi-die packaging platform for custom AI accelerators. The solution enables 2.8x larger multi-chip accelerator designs compared to conventional single-die implementations, featuring a novel RDL interposer that integrates 1390 mm² of silicon and four HBM3/3E memory stacks. The platform has been qualified with a major hyperscaler and is entering production.

Key advantages include more efficient die-to-die interconnect, lower power consumption, increased chiplet yields, and reduced total cost of ownership. The modular RDL interposer design offers an alternative to traditional silicon interposers, providing supply chain flexibility. Marvell is currently collaborating with three of the top four hyperscalers to develop custom XPUs and CPUs for clouds and AI clusters.

Marvell Technology (NASDAQ: MRVL) has unveiled an innovative multi-die packaging platform for custom AI accelerators, marking a significant advancement in AI infrastructure semiconductor solutions. The platform enables 2.8x larger multi-chip accelerator designs compared to conventional single-die implementations. Key features include a novel RDL interposer that integrates 1390 mm² of silicon and four HBM3/3E memory stacks. The solution offers improved die-to-die interconnect efficiency, reduced power consumption, enhanced chiplet yields, and lower product costs. Already production-qualified with a major hyperscaler, the platform supports current HBM3/HBM3E memory and is being qualified for future HBM4 designs. Notably, Marvell is collaborating with all four top hyperscalers to develop custom XPUs, CPUs, and other devices for cloud and AI infrastructure optimization.