Micron Delivers Industry’s Highest Capacity SOCAMM2 for Low-Power DRAM in the AI Data Center
Micron (Nasdaq: MU) announced customer sampling of a 192GB SOCAMM2 module built with LPDDR5X, delivering 50% more capacity in the same footprint as prior SOCAMM and using a 1-gamma DRAM process that the company says yields >20% power-efficiency improvement.
Micron claims SOCAMM2 can reduce time to first token by more than 80% in real-time inference, offers speeds up to 9.6 Gbps, improves power efficiency by more than two-thirds versus equivalent RDIMMs, and ships customer samples now with high-volume production aligned to customer launch schedules.
Micron (Nasdaq: MU) ha annunciato l'anteprima per i clienti di un modulo 192GB SOCAMM2 costruito con LPDDR5X, offrendo il 50% in più di capacità nello stesso ingombro del SOCAMM precedente e utilizzando un processo DRAM a 1 gamma che l'azienda sostiene offrire un miglioramento dell'efficienza energetica di oltre il 20%.
Micron afferma che SOCAMM2 può ridurre il tempo al primo token di più dell'80% nell'inferenza in tempo reale, offre velocità fino a 9,6 Gbps, migliora l'efficienza energetica di oltre due terzi rispetto agli RDIMM equivalenti e ora spedisce campioni ai clienti, con la produzione in larga scala in linea con i programmi di lancio dei clienti.
Micron (Nasdaq: MU) anunció la muestra para clientes de un módulo 192GB SOCAMM2 construido con LPDDR5X, que ofrece un 50% más de capacidad en la misma huella que el SOCAMM anterior y utiliza un proceso DRAM de 1 gamma que la empresa dice que genera una mejora de eficiencia energética de más del 20%.
Micron afirma que SOCAMM2 puede reducir el tiempo hasta el primer token en un más del 80% en la inferencia en tiempo real, ofrece velocidades de hasta 9,6 Gbps, mejora la eficiencia energética en más de dos tercios frente a RDIMMs equivalentes, y ya envía muestras a clientes con la producción en volumen alineada a los calendarios de lanzamiento de los clientes.
Micron (나스닥: MU)가 LPDDR5X로 제작된 192GB SOCAMM2 모듈의 고객 샘플링을 발표했으며, 기존 SOCAMM 대비 같은 폼 팩터에서 용량이 50% 증가하고 1-감마 DRAM 공정으로 전력 효율이 20% 이상 개선된다고 회사가 밝힙니다.
Micron은 SOCAMM2가 실제 추론에서 토큰 생성 시간를 80% 이상 단축할 수 있으며, 속도는 최대 9.6 Gbps, 같은 RDIMM 대비 전력 효율을 두 배 이상으로 향상시키고, 현재 고객 샘플을 출하하고 대량 생산을 고객 출시 일정에 맞춰 진행하고 있다고 주장합니다.
Micron (Nasdaq: MU) a annoncé l'échantillonnage client d'un module 192GB SOCAMM2 fabriqué avec LPDDR5X, offrant 50 % de capacité supplémentaire dans la même empreinte que le SOCAMM précédent et utilisant un procédé DRAM à 1 gamma qui, selon l'entreprise, permet une amélioration de l'efficacité énergétique de plus de 20 %.
Micron affirme que le SOCAMM2 peut réduire le temps jusqu’au premier jeton d'plus de 80 % dans l'inférence en temps réel, offre des vitesses allant jusqu'à 9,6 Gbps, améliore l'efficacité énergétique d'un peu plus des deux tiers par rapport aux RDIMM équivalents, et expédie désormais des échantillons clients avec une production en volume alignée sur les calendriers de lancement des clients.
Micron (Nasdaq: MU) kündigte Kundenausproben eines 192GB SOCAMM2-Moduls an, das mit LPDDR5X gefertigt ist und 50 % mehr Kapazität bei demselben Footprint wie der frühere SOCAMM bietet. Es verwendet einen 1-Gamma-DRAM-Prozess, der laut dem Unternehmen eine Leistungsverbesserung von über 20 % ermöglicht.
Micron behauptet, SOCAMM2 könne die Zeit bis zum ersten Token in Echtzeit-Inferenz um mehr als 80 % reduzieren, bietet Geschwindigkeiten von bis zu 9,6 Gbps, verbessere die Energieeffizienz gegenüber identischen RDIMMs um mehr als zwei Drittel und versendet jetzt Kundensamples, während die Großserienproduktion entsprechend den Markteinführungsterminen der Kunden erfolgt.
ميكرون (بورصة ناسداك: MU) أعلنت عن عينات العملاء من وحدة 192GB SOCAMM2 المصممة بـ LPDDR5X، حيث توفر سعة أقوى بنسبة 50% في نفس البصمة التي كانت عليها وحدة SOCAMM السابقة وتستخدم عملية DRAM بنطاق gamma واحد تقول الشركة إنها تُنتِج تحسناً في كفاءة الطاقة يزيد عن 20%.
وتزعم ميكرون أن SOCAMM2 يمكنه تقليل وقت الوصول إلى الرمز الأول بأكثر من 80% في الاستدلال في الوقت الحقيقي، ويقدم سرعات تصل إلى 9.6 جيبت/ث، ويحسّن كفاءة الطاقة بأكثر من ثلثي مقارنة بـ RDIMMs المكافئة، وهو يشحن عينات العملاء الآن مع إنتاج عالي الحجم متوافق مع جداول إطلاق العملاء.
- Customer sampling launched for 192GB SOCAMM2 modules
- 50% more capacity in the same SOCAMM footprint
- >20% power-efficiency improvement from 1-gamma DRAM
- Module speeds up to 9.6 Gbps and data-center focus
- Announcement references customer sampling; commercial volume not specified
- No firm high-volume production dates disclosed in the announcement
Insights
Micron begins customer sampling of 192GB SOCAMM2, claiming higher capacity and material power efficiency gains for AI data centers.
Micron is shipping customer samples of 192GB SOCAMM2 as of
The business mechanism is straightforward: higher per-module capacity and lower power per bit can lower system-level memory count and energy consumption in AI servers. Key dependencies include actual customer integration, interoperability with server platforms, and timing of high-volume production tied to customer launch schedules. Concrete items to watch near-term are customer sampling feedback, announced customer designs or qualifications, and alignment of high-volume production to those launch schedules; these factors will clarify whether the claimed capacity and
192GB SOCAMM2, built with LPDDR5X, extends Micron’s leadership in power-efficient solutions for AI infrastructure
BOISE, Idaho, Oct. 22, 2025 (GLOBE NEWSWIRE) -- In an era of unprecedented AI innovation and growth, the entire data center ecosystem is transforming toward more energy-efficient infrastructure to support sustainable growth. With memory playing an increasingly critical role in AI systems, low-power memory solutions have become central to this transformation. Micron Technology, Inc. (Nasdaq: MU) today announced customer sampling of 192GB SOCAMM2 (small outline compression attached memory modules) to enable broader adoption of low-power memory within AI data centers. SOCAMM2 extends the capabilities of Micron’s first-to-market LPDRAM SOCAMM, delivering
A Media Snippet accompanying this announcement is available by clicking on this link.
Building on a five-year collaboration with NVIDIA, Micron pioneered the use of low-power server memory in the data center. SOCAMM2 delivers LPDDR5X’s inherent advantages — exceptionally low power consumption and high bandwidth — to the main memory of AI systems. Designed to meet the evolving demands of massive-context AI platforms, SOCAMM2 provides the high data throughput required for AI workloads while delivering new levels of energy efficiency, setting a new standard for AI training and inference systems. This combination of advantages will make SOCAMM2 a key memory solution for leading-edge AI platforms in the years ahead.
“As AI workloads become more complex and demanding, data center servers must achieve increased efficiency, delivering more tokens for every watt of power,” said Raj Narasimhan, senior vice president and general manager of Micron’s Cloud Memory Business Unit. “Micron’s proven leadership in low-power DRAM ensures our SOCAMM2 modules provide the data throughput, energy efficiency, capacity and data center-class quality essential to powering the next generation of AI data center servers.”
Through specialized design features and enhanced testing, Micron SOCAMM2 products transform low-power DRAM, initially designed for mobile phones, into data center-class solutions. Extensive experience in high-quality data center DDR memory helps Micron ensure that SOCAMM2 meets the stringent quality and reliability requirements of our data center customers.
SOCAMM2 improves power efficiency by more than two-thirds4 compared with equivalent RDIMMs, while packing its performance into a module one-third the size5, optimizing data center footprint and maximizing capacity and bandwidth. SOCAMM’s modular design and innovative stacking technology improves serviceability and aids the design of liquid-cooled servers.
Micron has been an active participant in the JEDEC SOCAMM2 specification definition and is working closely with industry partners to drive standards that will accelerate low-power adoption in AI data centers to improve power efficiency across the entire industry. SOCAMM2 customer samples are shipping now in capacities up to 192GB per module and speeds up to 9.6 Gbps, with high-volume production aligned to customer launch schedules.
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About Micron Technology, Inc.
Micron Technology, Inc., is an industry leader in innovative memory and storage solutions, transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.
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1 Performance improvement validated by Micron internal testing: Llama 3 70B model inference with OSL=128 on GH200 NVL2 (288GB HBM3E + 1TB LPDDR5x) using LMCache.
2 Compared to Micron’s previous generation LPDDR5X.
3 Memory capacity based on NVL144 rack systems, which can incorporate six 192GB SOCAMM2 modules for each of 36 CPUs.
4 Calculated based on power used in watts by one 128GB, 128-bit bus width SOCAMM2 module compared to two 128GB, 128-bit bus width DDR5 RDIMMs.
5 Calculation compares SOCAMM2 area (14 x 90mm) versus a standard server RDIMM.
