MicroVision Introduces Advanced Photonics Technology for Next-Generation AI Data Center Scale-Up Architecture

MicroVision’s Scantinel unit is adapting its lidar photonics core for AI data center connectivity and is exploring licensing and partnerships.

Rhea-AI Summary

MicroVision (MVIS) announced that its wholly owned subsidiary Scantinel has introduced an advanced external laser small form-factor pluggable (ELSFP) photonics module for next-generation AI data center and intelligent infrastructure applications.

The ELSFP module provides a centralized, serviceable light source for co-packaged optics (CPO) systems in existing and future AI data centers and photonics-enabled cloud infrastructure. It is built around Scantinel’s photonic integrated circuit (PIC), a two-dimensional photonics platform intended to improve speed, power efficiency, and economics of high-speed optical connectivity. The PIC is the same core technology that underpins MicroVision’s FMCW lidar architecture, allowing the company to extend existing technology into AI data connectivity without, in its view, requiring significant new investment.

This photonics introduction is part of MicroVision’s broader expansion into intelligent infrastructure, and the company is in discussions with several potential licensees and development partners to accelerate commercialization.

Positive

• New ELSFP module introduced for AI data centers and intelligent infrastructure
• ELSFP built on existing PIC used in FMCW lidar, limiting need for new investment per company
• Company is in discussions with multiple potential licensees and development partners

Negative

• None.

Market Context

The active S-3 dated July 13, 2026 permits up to $50,000,000 in securities offerings, providing disc...

Analysis

The active S-3 dated July 13, 2026 permits up to $50,000,000 in securities offerings, providing disclosed financing capacity as MicroVision evaluates commercialization channels for the photonics technology.

Key Terms

external laser small form-factor pluggable, co-packaged optics, photonic integrated circuit, fmcw lidar

4 terms

external laser small form-factor pluggable technical

"new external laser small form-factor pluggable (ELSFP) module"

An external laser small form-factor pluggable is a compact, hot-swappable optical transceiver that uses a separately housed laser source to send data over fiber. Think of it as a removable lightbulb assembly for high-speed network cables where the bulb (the laser) sits outside the tiny plug-in unit; that design can enable higher power, simpler cooling, regulatory compliance, or easier upgrades. Investors care because this component affects networking equipment performance, interoperability, supply costs and upgrade paths in data centers and telecom infrastructure.

co-packaged optics technical

"for co-packaged optics (CPO) systems in existing"

Co-packaged optics are optical components—lasers and fiber interfaces—physically packaged together with a network switch’s main processing chip so light-based data links sit much closer to the chip instead of traveling over long electrical traces. For investors, this matters because it can dramatically cut power use, boost data speed and density, and lower system costs in large data centers and telecom equipment, much like moving a power outlet next to a heavy appliance to avoid long, inefficient extension cords.

photonic integrated circuit technical

"built around its core photonic integrated circuit (PIC)"

A photonic integrated circuit is a tiny chip that routes and processes light signals instead of electrical currents, like an electronic microchip but built to use photons. It matters to investors because these chips can make data transmission and sensing much faster, more energy-efficient and cheaper at scale, potentially enabling new high-growth products and cutting operating costs across communications, computing and sensing industries.

fmcw lidar technical

"same core technology that fuels our FMCW lidar architecture"

Frequency-modulated continuous-wave (FMCW) LiDAR is a laser-based sensing system that measures both distance and speed by sending a continuously changing-frequency beam and comparing the returned light, similar to how a police radar tunes and listens for a reflected signal. It matters to investors because FMCW designs can deliver longer range, more reliable readings in traffic or crowded environments, lower interference and better velocity data than older pulsed LiDAR, which can translate into stronger product performance, safety advantages and clearer market differentiation for companies using or supplying the technology.

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REDMOND, WA / ACCESS Newswire / September 22, 2026 / MicroVision, Inc. (NASDAQ:MVIS), a leader in advanced perception solutions for industrial, security and defense, and automotive applications today announced the introduction by its wholly owned Scantinel subsidiary of an advanced photonics solution designed to address power efficiency and performance challenges critical for next-generation AI data center scale-up architectures and other intelligent infrastructure applications.

As the global photonics community gathers in Málaga, Spain this week for the 52nd European Conference on Optical Communication and the Global Photonics Economic Forum, Scantinel revealed its new external laser small form-factor pluggable (ELSFP) module that provides a centralized, serviceable light source for co-packaged optics (CPO) systems in existing and next-generation AI data centers and photonics-enabled AI and cloud infrastructure.

Scantinel's differentiated ELSFP technology is built around its core photonic integrated circuit (PIC), a two-dimensional photonics platform designed to improve the speed, power efficiency, and economics of high-speed optical connectivity.

"The PIC technology at the center of the module is the same core technology that fuels our FMCW lidar architecture," said Glen DeVos, Chief Executive Officer of MicroVision. "Since acquiring Scantinel, our team has continued to refine and validate this technology. Its application to AI data center connectivity and photonics-enabled cloud computing demonstrates the broader value of that acquisition and our ability to expand our technology into new markets without diluting our strategic focus or requiring significant new investment."

Addressing a Critical AI Infrastructure Challenge

AI and high-performance computing are driving unprecedented demand for data movement between processors, servers, and racks. As compute density and bandwidth requirements increase, the power, efficiency and economics of moving that data are becoming increasingly important constraints for next-generation data centers and photonics-enabled cloud computing.

Scantinel's ELSFP module is designed to address that challenge by centralizing and optimizing the laser source used for high-speed optical connections. Its architecture reduces complexity and power consumption while supporting the high-bandwidth connectivity required by increasingly powerful AI infrastructure.

"The AI infrastructure challenge isn't just about computing power; it's also about moving enormous amounts of data quickly and efficiently," DeVos said. "Our photonics technology gives us an opportunity to address that challenge at a fundamental level while extending technology we have already developed into a significant new market."

The photonics introduction is part of a broader expansion of MicroVision technology into intelligent infrastructure applications. MicroVision is currently in discussions with several potential licensees and development partners as it evaluates efficient channels to accelerate commercialization of the technology.

About MicroVision

MicroVision is defining the next generation of lidar-based perception solutions for industrial, security & defense, and automotive markets. As the industry moves beyond proof of concept toward value, deployment, and commercialization, MicroVision delivers integrated hardware and software solutions designed for real-world performance, automotive-grade reliability, and economic scalability. With engineering centers in the U.S. and Germany, MicroVision leads the industry in depth and breadth of its portfolio, with both short- and long-range lidar solutions, featuring solid-state sensors with varying wavelengths, advanced sensor architectures, design-to-cost engineering, and open software solutions.

For more information, visit the company's website at www.microvision.com, on Facebook at www.facebook.com/microvisioninc, and LinkedIn at https://www.linkedin.com/company/microvision/.

MicroVision, MicroVision HALO, IRIS, MOVIA, MOSAIK, and SENTINEL are trademarks of MicroVision, Inc., and SCANTINEL is a trademark of Scantinel GmbH, in the United States and other countries. All other trademarks are the property of their respective owners.

Investor Relations Contact

Jeff Christensen
Darrow Associates Investor Relations
MVIS@darrowir.com

Media Contact

Heidi Davidson - For MicroVision
heidi@galvanizeworldwide.com
(914) 441-6862

SOURCE: MicroVision, Inc.

View the original press release on ACCESS Newswire

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What is Scantinel’s ELSFP module designed to do in AI data centers?

Scantinel’s ELSFP module is designed to centralize and optimize the laser source used for high-speed optical connections in AI data centers. Its architecture aims to reduce complexity and power consumption while supporting the high-bandwidth connectivity needed as compute density and data-movement requirements rise.

How does the new photonics platform relate to MicroVision’s existing lidar business?

The ELSFP module is built around Scantinel’s photonic integrated circuit, which MicroVision states is the same core technology that fuels its FMCW lidar architecture. This allows the company to apply an already developed technology platform to AI data center connectivity and photonics-enabled cloud computing.

Which markets beyond AI data centers is MicroVision targeting with this technology?

The company positions the photonics introduction as part of an expansion into intelligent infrastructure applications, including photonics-enabled AI and cloud infrastructure, in addition to its existing focus on industrial, security and defense, and automotive lidar-based perception solutions.