Nova Announces the Release of Nova WMC: A Next-Generation Modular Optical Metrology Platform for Advanced Packaging
Nova (NASDAQ: NVMI) has unveiled the Nova WMC, a next-generation modular optical metrology platform designed for advanced semiconductor packaging applications. The platform features exceptional versatility, handling various wafer sizes and forms while supporting multiple metrology technologies.
The Nova WMC has already secured adoption by a leading memory manufacturer for High Bandwidth Memory applications, with additional orders from logic, advanced memory, and power device manufacturers. The platform addresses key challenges including high warpage, non-symmetric shapes, and varying surface conditions with high throughput and nanometer-level precision.
The company has recognized revenue for the first system and received multiple orders expected to generate revenue by the end of 2025.
Nova (NASDAQ: NVMI) ha presentato la Nova WMC, una piattaforma modulare di metrologia ottica di nuova generazione pensata per applicazioni avanzate di packaging dei semiconduttori. La soluzione è estremamente flessibile, gestisce diversi diametri e formati di wafer e supporta più tecnologie di metrologia.
La Nova WMC è già stata adottata da un importante produttore di memoria per applicazioni High Bandwidth Memory e ha ricevuto ulteriori ordini da produttori di circuiti logici, memorie avanzate e dispositivi di potenza. La piattaforma affronta problemi critici come elevato warpage, forme non simmetriche e superfici variabili, offrendo elevata produttività e precisione a livello nanometrico.
L'azienda ha contabilizzato ricavi per il primo sistema e ha ottenuto ordini multipli che dovrebbero generare ricavi entro la fine del 2025.
Nova (NASDAQ: NVMI) ha presentado la Nova WMC, una plataforma modular de metrología óptica de nueva generación diseñada para aplicaciones avanzadas de empaquetado de semiconductores. La plataforma ofrece gran versatilidad, admite distintos tamaños y formas de oblea y soporta múltiples tecnologías de metrología.
La Nova WMC ya ha sido adoptada por un importante fabricante de memorias para aplicaciones de High Bandwidth Memory, y ha recibido pedidos adicionales de fabricantes de lógica, memorias avanzadas y dispositivos de potencia. La plataforma aborda retos clave como alto warpage, geometrías asimétricas y condiciones de superficie variables, con alto rendimiento y precisión a nivel nanométrico.
La compañía ha reconocido ingresos por el primer sistema y ha recibido varios pedidos que se espera generen ingresos antes de finales de 2025.
Nova (NASDAQ: NVMI)가 차세대 모듈형 광학 계측 플랫폼인 Nova WMC를 공개했습니다. 이 플랫폼은 첨단 반도체 패키징용으로 설계됐으며, 다양한 웨이퍼 크기와 형태를 처리하고 다수의 계측 기술을 지원하는 뛰어난 유연성을 갖추고 있습니다.
Nova WMC는 이미 High Bandwidth Memory 용도로 주요 메모리 제조사에 채택되었고, 로직, 고급 메모리 및 전력 소자 제조사들로부터 추가 주문을 받았습니다. 이 플랫폼은 높은 워페이징(warpage), 비대칭 형상, 변화하는 표면 조건 등 주요 과제를 높은 처리량과 나노미터 수준의 정밀도로 해결합니다.
회사는 첫 시스템에 대해 수익을 인식했으며, 2025년 말까지 매출을 발생시킬 것으로 예상되는 다수의 주문을 확보했습니다.
Nova (NASDAQ: NVMI) a dévoilé la Nova WMC, une plateforme modulaire de métrologie optique de nouvelle génération destinée aux applications avancées d'emballage des semi-conducteurs. La plateforme est très polyvalente, prend en charge diverses tailles et formes de plaquettes et supporte plusieurs technologies de métrologie.
La Nova WMC a déjà été adoptée par un fabricant majeur de mémoires pour des applications High Bandwidth Memory et a reçu d'autres commandes de producteurs de circuits logiques, de mémoires avancées et de dispositifs de puissance. La plateforme relève des défis clés tels que un fort warpage, des formes non symétriques et des conditions de surface variables, tout en assurant un débit élevé et une précision au niveau nanométrique.
L'entreprise a comptabilisé des revenus pour le premier système et a reçu plusieurs commandes qui devraient générer des revenus d'ici la fin de 2025.
Nova (NASDAQ: NVMI) hat die Nova WMC vorgestellt, eine modulare optische Messplattform der nächsten Generation für fortschrittliche Anwendungen im Halbleiter-Packaging. Die Plattform ist äußerst vielseitig, verarbeitet unterschiedliche Wafergrößen und -formen und unterstützt mehrere Messtechnologien.
Die Nova WMC wurde bereits von einem führenden Speicherhersteller für High Bandwidth Memory-Anwendungen übernommen und hat weitere Aufträge von Herstellern aus Logik, fortgeschrittenem Speicherbereich und Leistungshalbleitern erhalten. Die Plattform meistert zentrale Herausforderungen wie hohe Verformungen (warpage), asymmetrische Formen und variierende Oberflächenbedingungen mit hoher Durchsatzleistung und Präzision im Nanometerbereich.
Das Unternehmen hat Umsatzerlöse für das erste System verbucht und mehrere Aufträge erhalten, die voraussichtlich bis Ende 2025 Umsätze generieren werden.
- Early market adoption by leading memory manufacturers
- Multiple orders received from diverse semiconductor manufacturers
- Revenue recognition already started with first system
- Platform addresses multiple technical challenges in a single tool
- None.
Insights
Nova's new WMC platform strengthens its competitive position in critical advanced packaging metrology with proven customer adoption and revenue generation.
Nova's release of the WMC platform represents a significant technological advancement in the optical metrology space, particularly for advanced packaging applications. The semiconductor industry is rapidly transitioning toward more complex packaging technologies like 2.5D and 3D architectures to overcome performance limitations as traditional Moore's Law scaling becomes increasingly challenging and costly.
What makes this announcement particularly noteworthy is the immediate customer traction the platform has gained. Having secured adoption from a leading memory manufacturer for High Bandwidth Memory (HBM) applications indicates strong product-market fit in a high-growth segment. HBM is crucial for AI accelerators and high-performance computing, areas experiencing explosive demand growth.
The technical differentiation of the WMC platform centers on its unique versatility to handle multiple wafer types while supporting different metrology technologies in a modular framework. This flexibility is essential for addressing the metrology challenges in advanced packaging, where conventional approaches often fall short due to issues like high warpage, non-symmetric shapes, and variable surface conditions.
From a financial perspective, Nova has already recognized revenue from the first system shipment, with multiple additional orders expected to translate to revenue by the end of 2025. This rapid commercialization timeline suggests the product has cleared the typically lengthy semiconductor qualification processes, indicating robust customer confidence in the solution's capabilities.
In the competitive landscape, this platform strengthens Nova's position in the growing advanced packaging segment, which is becoming increasingly critical as more semiconductor manufacturers adopt heterogeneous integration strategies to deliver performance improvements beyond traditional scaling approaches.
REHOVOT,
The Nova WMC represents a breakthrough in optical metrology, designed from the ground up as a completely new proprietary system. This platform stands out for its exceptional versatility, enabling it to seamlessly handle a wide range of wafer sizes and forms - including traditional and framed wafers—while supporting multiple metrology technologies in a modular manner. Thanks to this adaptability, WMC is well-positioned to meet the evolving needs of 2.5D and 3D advanced packaging processes and is uniquely equipped to deliver robust solutions for significant industry inflection points, such as hybrid bonding. With its comprehensive capabilities, WMC empowers manufacturers to solve emerging challenges, cementing its potential as a cornerstone tool for next-generation packaging applications.
The platform has already been adopted by one of the world's leading memory manufacturers for High Bandwidth Memory, and several additional orders have been placed by manufacturers of logic, advanced memory, and power devices. The strong demand for Nova WMC stems from the platform's unique ability to address major challenges such as high warpage, non-symmetric shapes, and different surface conditions in a single tool, with high throughput, and fast, repeatable scanning with large-area mapping at nanometer fidelity. The company has already recognized revenue for the first system and received orders for multiple systems, for which it expects to recognize revenue by the end of 2025.
"We are excited to introduce the Nova WMC to our customers," said Gaby Waisman, President and CEO of Nova Ltd. "This innovative platform provides manufacturers with the precision and flexibility they need to stay ahead in rapidly evolving advanced packaging manufacturing processes. The Nova WMC is a testament to our commitment to deliver cutting-edge solutions that seamlessly adapt to evolving process demands."
About Nova
Nova is a leading innovator and key provider of material, optical and chemical solutions for advanced metrology and process control in semiconductor manufacturing. Nova delivers continuous innovation by providing state-of-the-art, high-performance metrology solutions for effective process control throughout the semiconductor fabrication lifecycle. Nova's product portfolio, which combines high-precision hardware and cutting-edge software, provides its customers with deep insight into developing and producing the most advanced semiconductor devices. Nova's unique capability to deliver innovative solutions enables its customers to improve performance, enhance product yields, and accelerate time to market. Nova acts as a partner to semiconductor manufacturers from its offices worldwide. Additional information may be found on Nova's website link - https://www.novami.com/.
Nova is traded on the Nasdaq and TASE, Nasdaq ticker symbol NVMI.
Forward-Looking Statements
This press release contains forward-looking statements within the meaning of safe harbor provisions of the Private Securities Litigation Reform Act of 1995 relating to future events or our future performance, such as statements regarding, but not limited to, anticipated growth opportunities and projections about our business and its future revenues, expenses and profitability. Forward-looking statements involve known and unknown risks, uncertainties and other factors that may cause our actual results, levels of activity, performance or achievements to differ materially from any future results, levels of activity, performance or achievements expressed or implied in those forward-looking statements. Factors that may affect our results, performance, circumstances or achievements include, but are not limited to, the following: risks related to information technology security threats, sophisticated computer crime, and data privacy; foreign political and economic risks including supply-chain difficulties; regulations that could restrict our operations such as economic sanctions and export restrictions; changes in
Company Contact:
Guy Kizner, Chief Financial Officer
Tel: +972-73-229-5760
E-mail - investors@novami.com
Nova website link - https://www.novami.com/
Investor Relations Contact:
Miri Segal MS-IR LLC
E-mail - msegal@ms-ir.com
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