QuickLogic Corporation to Exhibit and Present at Chiplet Summit 2026

Rhea-AI Summary

QuickLogic (NASDAQ: QUIK) will exhibit and present at Chiplet Summit 2026 in Santa Clara, Feb 17–19. The company will staff Booth #416 to demo eFPGA IP and eFPGA-based chiplets and will deliver a technical session on Feb 19 titled "Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A".

The presentation by Trey Peterson, Applications Engineer, is scheduled for Session E-202 on Feb 19 from 3:00 p.m. to 4:20 p.m.

News Market Reaction – QUIK

+0.72%

1 alert

+0.72% News Effect

+$852K Valuation Impact

$119.12M Market Cap

On the day this news was published, QUIK gained 0.72%, reflecting a mild positive market reaction. This price movement added approximately $852K to the company's valuation, bringing the market cap to $119.12M at that time.

Data tracked by StockTitan Argus on the day of publication.

Market Context

This announcement centers on QuickLogic’s participation in Chiplet Summit 2026, highlighting its eFP...

Analysis

This announcement centers on QuickLogic’s participation in Chiplet Summit 2026, highlighting its eFPGA IP, chiplet solutions, and a technical session on Intelae 18A. It reinforces positioning in heterogeneous integration and advanced packaging rather than introducing new financial metrics. Recent history shows notable contract expansions and design wins, including an approximate $88 million SRH FPGA contract ceiling and government-backed projects. Investors may watch for how such visibility converts into additional orders, design wins, or updates under the existing $125,000,000 shelf framework.

Key Figures

Conference dates: February 17–19, 2026 Booth number: 416 Presentation session: Session E-202 +5 more

8 metrics

Conference dates February 17–19, 2026 Chiplet Summit 2026 in Santa Clara, California

Booth number 416 QuickLogic exhibit location at Chiplet Summit 2026

Presentation session Session E-202 Technical talk on Feb 19 from 3:00–4:20 p.m.

Presentation time 3:00 p.m. – 4:20 p.m. Technical session on Thursday, February 19

Exhibit hours Feb 18 12:30 p.m. – 8:00 p.m. Chiplet Summit 2026 exhibit schedule

Exhibit hours Feb 19 12:00 p.m. – 3:00 p.m. Chiplet Summit 2026 exhibit schedule

Shelf registration $125,000,000 Maximum aggregate offering under S-3 shelf

ATM program size $20,000,000 At-the-market equity program with Needham & Company

Historical Context

5 past events · Latest: Feb 05 (Neutral)

Pattern 5 events

Date	Event	Sentiment	24h Move	Catalyst
Feb 05	Earnings date notice	Neutral	-2.8%	Scheduled Q4 and full-year 2025 earnings call for early March 2026.
Jan 14	Product orders news	Positive	+6.7%	Announced orders for Strategic Radiation Hardened FPGA Development Kits on 12 nm.
Dec 18	Contract expansion	Positive	+10.1%	Expanded U.S. government SRH FPGA contract ceiling to about $88 million.
Dec 09	Design win news	Positive	+1.8%	University of Saskatchewan selected QuickLogic eFPGA Hard IP for StarRISC MCU.
Dec 02	Design win news	Positive	-1.8%	Idaho Scientific chose eFPGA Hard IP for crypto‑agile hardware security solutions.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Pattern Detected

Recent contract and design-win announcements often coincided with positive price reactions, while scheduling/housekeeping items showed weaker or negative moves.

Recent Company History

Over the past few months, QuickLogic’s news flow featured several strategic wins and government-related programs. On Dec 18, 2025, the Strategic Radiation Hardened FPGA contract ceiling was raised to about $88 million, followed by positive market reaction. Design wins with Idaho Scientific and the University of Saskatchewan in early December highlighted broader eFPGA adoption. A January 2026 development‑kit orders update and a February 2026 earnings‑date notice rounded out the flow. Today’s Chiplet Summit participation fits the ongoing theme of positioning its eFPGA and chiplet technologies in advanced nodes and specialized markets.

Key Terms

embedded fpga (efpga), efpga ip, chiplet, heterogeneous integration

4 terms

embedded fpga (efpga) technical

"a developer of embedded FPGA (eFPGA) IP and ruggedized FPGAs"

An embedded FPGA (eFPGA) is a small, reprogrammable block of digital circuitry built directly into a semiconductor chip that lets designers change hardware behavior after the chip is manufactured—like having a set of Lego pieces inside a device that can be rearranged to add or tweak features. For investors, eFPGAs matter because they can extend a product’s useful life, speed time-to-market for new features, reduce recall or redesign costs, and create recurring licensing or customization revenue, all of which affect a company’s competitiveness and margins.

efpga ip technical

"attendees can learn how its eFPGA IP and eFPGA-based chiplets enable flexible"

eFPGA IP is a licensed design block that lets chip makers include a small, reprogrammable logic area—like a programmable toolbox—inside a custom chip. Investors care because it enables hardware to be updated or repurposed after manufacturing, reducing product risk and extending device lifecycles; licensing and integration of eFPGA IP can be a recurring-revenue business and a competitive differentiator for semiconductor customers.

chiplet technical

"ruggedized FPGAs and chiplet solutions, today announced it will exhibit"

A chiplet is a small, specialized piece of a computer chip designed to be combined with other chiplets on a single package to create a larger, complete processor — think of it like Lego bricks that snap together to build different models. For investors, chiplets matter because they can lower manufacturing costs, improve production yields, and speed innovation by letting designers mix and match proven building blocks, affecting profit margins and competitive position in the semiconductor industry.

heterogeneous integration technical

"focused on chiplet architectures, advanced packaging, and heterogeneous integration."

Heterogeneous integration is the practice of combining different types of electronic components — such as processors, memory, sensors and specialized chips — into a single package or tightly linked module, rather than building everything on one uniform chip. Like putting varied ingredients into one compact lunchbox to save space and improve function, it matters to investors because it can boost product performance, lower power use, shorten development time and create competitive or cost advantages that affect revenue and margins.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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SAN JOSE, Calif., Feb. 11, 2026 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) IP and ruggedized FPGAs and chiplet solutions, today announced it will exhibit and deliver a technical presentation at Chiplet Summit 2026, the industry's premier conference focused on chiplet architectures, advanced packaging, and heterogeneous integration.

Chiplet Summit 2026 will take place February 17–19 in Santa Clara, California. QuickLogic will exhibit at Booth #416, where attendees can learn how its eFPGA IP and eFPGA-based chiplets enable flexible, scalable architectures for advanced heterogeneous integration.

In addition, QuickLogic will present a technical session titled:

"Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A"

The presentation will be delivered by Trey Peterson, Applications Engineer at QuickLogic, during Session E-202 on Thursday, February 19, from 3:00 p.m. to 4:20 p.m. The session will explore how eFPGA chiplets can be used to add post-silicon adaptability and extend platform flexibility in advanced process nodes.

Chiplet Summit 2026 Exhibit Hours

• Wednesday, February 18: 12:30 p.m. – 8:00 p.m.
• Thursday, February 19: 12:00 p.m. – 3:00 p.m.

QuickLogic Booth: 416 

About QuickLogic
QuickLogic Corporation is a fabless semiconductor company specializing in eFPGA Hard IP, discrete FPGAs, and endpoint AI solutions. QuickLogic's unique approach combines cutting-edge technology with open-source tools to deliver highly customizable, low-power solutions for aerospace and defense, industrial, computing, and consumer markets. For more information, visit www.quicklogic.com.

QuickLogic and logo are registered trademarks of QuickLogic. All other trademarks are the property of their respective holders and should be treated as such. 

 

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SOURCE QuickLogic Corporation

FAQ

When and where will QuickLogic (QUIK) exhibit at Chiplet Summit 2026?

QuickLogic will exhibit at Chiplet Summit 2026 in Santa Clara, February 17–19. According to QuickLogic, the company will staff Booth #416 with demos of eFPGA IP and eFPGA-based chiplets during published exhibit hours.

What is the title and timing of QuickLogic's (QUIK) presentation at Chiplet Summit 2026?

QuickLogic will present "Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A" on Feb 19 from 3:00 p.m. to 4:20 p.m. According to QuickLogic, Trey Peterson will deliver the technical session in Session E-202.

Who will present QuickLogic's (QUIK) technical session at Chiplet Summit 2026?

Trey Peterson, Applications Engineer at QuickLogic, will deliver the session on Feb 19. According to QuickLogic, the talk focuses on using eFPGA chiplets for post-silicon adaptability in advanced process nodes.

What topics will QuickLogic (QUIK) cover in its Chiplet Summit 2026 presentation?

The presentation will cover using eFPGA chiplets to add post-silicon adaptability and platform flexibility. According to QuickLogic, the session examines integration on Intel® 18A and implications for heterogeneous architectures.

What are the exhibit hours for QuickLogic's (QUIK) booth at Chiplet Summit 2026?

QuickLogic's booth exhibit hours are Feb 18, 12:30 p.m.–8:00 p.m., and Feb 19, 12:00 p.m.–3:00 p.m. According to QuickLogic, attendees can visit Booth #416 during those scheduled exhibit times.