SCHMID GROUP ships first InfinityLine P+ Panel-Level Plating System A Breakthrough in Integrated Plating Technology
SCHMID Group (NASDAQ: SHMD) shipped its first InfinityLine P+ panel-level plating system on October 8, 2025, beginning commercialization of a new integrated plating platform.
The InfinityLine P+ is a touch-free, double-sided vertical cluster plating system with segmented, moveable anodes, DI-water-cooled titanium contacts suitable for seed layers down to 200 nm, and integrated photoresist stripping inside the plating workflow. It targets advanced substrate, panel-level packaging, and high-density PCB makers, and offers Industry 4.0 compatibility, AGV/OHT readiness, web-based HMI, MES connectivity, and modular integration with other SCHMID systems. Initial customer installations and pilot runs are scheduled for the upcoming quarter.
SCHMID Group (NASDAQ: SHMD) ha spedito la sua prima InfinityLine P+ sistema di placcatura a livello di pannello l'8 ottobre 2025, dando inizio alla commercializzazione di una nuova piattaforma di placcatura integrata.
InfinityLine P+ è un sistema di placcatura a cluster verticale, touch-free, a doppia faccia con anodi segmentati e movibili, contatti in titanio raffreddati ad acqua DI, adatti a strati di seme fino a 200 nm, e stripping integrato della fotoresistenza all'interno del flusso di lavorazione della placcatura. Si rivolge a produttori di substrati avanzati, imballaggi a livello di pannello e PCB ad alta densità, offrendo compatibilità Industry 4.0, prontezza AGV/OHT, HMI basata su web, connettività MES e integrazione modulare con altri sistemi SCHMID. Installazioni iniziali presso i clienti e run pilota sono programmati per il trimestre prossimo.
SCHMID Group (NASDAQ: SHMD) envió su primera InfinityLine P+ sistema de recubrimiento a nivel de paneles el 8 de octubre de 2025, comenzando la comercialización de una nueva plataforma de galvanoplastia integrada.
InfinityLine P+ es un sistema de apilamiento vertical sin contacto, de doble cara, con ánodos segmentados y movibles, contactos de titanio enfriados por DI, aptos para capas de semilla de hasta 200 nm, y stripping de fotoresistencia integrado dentro del flujo de trabajo de recubrimiento. Está orientado a fabricantes de sustratos avanzados, embalaje a nivel de panel y PCBs de alta densidad, y ofrece compatibilidad Industry 4.0, preparación AGV/OHT, HMI basado en web, conectividad MES y una integración modular con otros sistemas SCHMID. Las instalaciones iniciales de clientes y las pruebas piloto están programadas para el próximo trimestre.
SCHMID Group (NASDAQ: SHMD) 은 2025년 10월 8일 최초의 InfinityLine P+ 패널 수준 도금 시스템을 선보였으며, 새로운 통합 도금 플랫폼의 상용화를 시작했습니다.
InfinityLine P+ 는 터치 없는 양면 수직 클러스터 도금 시스템으로 분할된 가변 애노드, DI 물 냉각 티타늄 접촉부, 시드층 두께가 최대 200 nm까지 가능하며, 도금 작업 흐름 내에 통합 포토레지스트 제거 기능을 갖추고 있습니다. 고급 기판, 패널 수준 패키징, 고밀도 PCB 제조업체를 대상으로 하며, Industry 4.0 호환성, AGV/OHT 준비성, 웹 기반 HMI, MES 연동, 다른 SCHMID 시스템과의 모듈식 통합을 제공합니다. 초기 고객 설치 및 파일럿 운용은 다가오는 분기에 예정되어 있습니다.
Groupe SCHMID (NASDAQ: SHMD) a livré son premier InfinityLine P+ système de plaquage au niveau panneau le 8 octobre 2025, marquant le démarrage de la commercialisation d'une nouvelle plateforme de plaquage intégrée.
Le InfinityLine P+ est un système de placage vertical en cluster sans contact, double-face, avec des anodes segmentées et mobiles, des contacts en titane refroidis par eau DI adaptés aux couches d'amorçage jusqu'à 200 nm, et un décapage de résine photosensible intégré dans le flux de travail de plaquage. Il s'adresse aux fabricants de substrats avancés, d'emballage au niveau panneau et de PCB à haute densité, et offre une compatibilité Industry 4.0, une préparation AGV/OHT, une interface HMI web, une connectivité MES et une intégration modulaire avec d'autres systèmes SCHMID. Les premières installations chez les clients et les tests pilotes sont prévus pour le trimestre à venir.
SCHMID Group (NASDAQ: SHMD) lieferte seine erste InfinityLine P+ Panel-Level-Beschichtungsanlage am 8. Oktober 2025 aus und begann mit der Kommerzialisierung einer neuen integrierten Plattierungsplattform.
Der InfinityLine P+ ist ein berührungsloses, zweiseitiges vertikales Cluster-Beschichtungssystem mit segmentierten, beweglichen Anoden, DI-Wasser gekühlten Titankontakten, geeignet für Seed-Layers bis zu 200 nm, und integrierter Photoresist-Abstripping innerhalb des Beschichtungsworkflows. Es richtet sich an Hersteller von fortgeschrittenen Substraten, Panel-Level-Verpackung und Hochdichte-PCBs und bietet Industry-4.0-Kompatibilität, AGV/OHT-Bereitschaft, webbasierte HMI, MES-Konnektivität und modulare Integration mit anderen SCHMID-Systemen. Erste Kundeninstallationen und Pilotläufe sind für das kommende Quartal geplant.
SCHMID Group (NASDAQ: SHMD) شحنت أول نظام طلاء على مستوى اللوحة InfinityLine P+ في 8 أكتوبر 2025، بدء تسويق منصة طلاء متكاملة جديدة.
InfinityLine P+ هو نظام طلاء عمودي مكوّن من عنقود بدون لمس، ذو وجهين مع أنودات مقسّمة ومتحركة، وتلامسات من التيتانيوم مبردة بمياه DI مناسبة لطبقات البذور حتى 200 nm، وإزالة photoresist مدمجة داخل سير عمل الطلاء. يستهدف صانعي الركائز المتقدمة والتعبئة على مستوى اللوحة وPCBs ذات الكثافة العالية، ويقدم توافق Industry 4.0، جاهزية AGV/OHT، واجهة HMI قائمة على الويب، اتصال MES، وتكامل modular مع أنظمة SCHMID الأخرى. التركيبات الأولية لدى العملاء والتجارب التجريبية مقررة للربع القادم.
SCHMID Group (NASDAQ: SHMD) 于 2025 年 10 月 8 日发布其首个 InfinityLine P+ 面板级镀层系统，开启了一个新的集成镀膜平台的商业化。
InfinityLine P+ 是一个无触摸、双面垂直簇状镀膜系统，带有分段、可移动的阳极，DI 水冷却的钛接触件，适用于种子层厚度至 200 nm，并在镀膜工作流中集成光刻胶去除。它面向高级基板、面板级封装和高密度 PCB 制造商，并提供 Industry 4.0 兼容性、AGV/OHT 就绪、基于网页的 HMI、MES 连接，以及与其他 SCHMID 系统的模块化整合。初步的客户安装和试点运行计划在下个季度。
- First InfinityLine P+ unit shipped, initiating commercialization
- Integrated photoresist stripping reduces tool-to-tool transfers
- DI-water-cooled titanium contacts support seed layers down to 200 nm
- Segmented, moveable anodes enable uniform copper distribution control
- Industry 4.0 compatibility with AGV/OHT, web HMI, and MES connectivity
- Modular integration with existing SCHMID systems for flexible layouts
- No customer order sizes, contract values, or revenue impact disclosed
- Commercial rollout timeline limited to "initial installations and pilot runs"
- No quantified manufacturing capacity, throughput, or yield data provided
Insights
SCHMID shipped its first InfinityLine P+ on
The system consolidates panel-level pre-treatment, electroplating and integrated photoresist stripping into a single, touch-free vertical cluster. Key disclosed engineering features—segmented movable anodes, DI-water-cooled titanium contacts rated for seed layers down to 200 nm, and integrated stripping—reduce handling steps and create a more compact process flow compared with separate tools. The stated Industry 4.0 connectivity and modular compatibility with existing SCHMID lines support plug‑and‑play deployment in automated facilities.
Dependencies and risks center on execution: the announcement documents shipment of a first unit and pilots scheduled in the
Concrete items to watch in the next 3–12 months include pilot run results, any customer references or published yield figures, integration time with MES/AGV systems, and repeatable performance on 200 nm seed layers under production currents. Those milestones will determine whether this shipment translates into meaningful equipment orders and adoption.
FREUDENSTADT, Germany , Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a leading global provider of equipment and solutions for the electronics industry, today announced the shipment of its first InfinityLine P+ system – a newly developed panel-level plating equipment with integrated photoresist stripping. With this innovation, SCHMID is offering a modern, efficient, and low-maintenance alternative to Advanced Substrate and Panel Level Packaging manufacturers.
A New Era in Panel-Level Plating
The InfinityLine P+ is a touch-free, double-sided vertical cluster plating system, configurable with multiple plating, pre-treatment, cleaning, and rinsing modules. Each plating chamber integrates pre-acid-dip, plating and post-rinse sequences. Segmented and moveable anodes enable uniform control of copper distribution across the panel. Novel DI-water-cooled, titanium contacts ensure reliable operation even on extremely thin seed layers.
Unlike competing systems, the InfinityLine P+ integrates photoresist stripping directly into the plating workflow, minimizing handling, transfer steps, and tool-to-tool transitions. The result is a more compact, efficient, and low-maintenance architecture that reduces both operating and capital costs.
The InfinityLine P+ system is ideally positioned to compete and win against existing plating equipment solutions in dynamic manufacturing environments with frequent design changes, thin seed layers, or stringent process integration requirements.
Technical Highlights & Customer Benefits
- Touch-free panel handling to avoid contamination and mechanical impacts.
- Segmented, moveable anodes for uniform copper distribution control.
- DI-water-cooled, titanium contacts, sealed and maintenance-free, suitable for seed layers down to 200 nm (depending on current density).
- Integrated photoresist stripping, eliminating the need for separate stripping equipment.
- Full Industry 4.0 compatibility, AGV and OHT-ready logistics, web-based HMI, and MES connectivity.
- Seamless integration with other SCHMID systems (H+, V+, C+, etc.), enabling modular growth and flexible layouts.
Together, these features deliver higher equipment uptime, reduced footprint, shorter process chains, and lower total cost of ownership.
Executive Statement
“The shipment of our first InfinityLine P+ marks a significant milestone in the evolution of plating technology. Our vision was to create a system that unites the entire plating workflow – from pre-treatment and electroplating to photoresist stripping – in a single, integrated, low-maintenance, and modular platform.
“Compared to solutions from our competitors, the InfinityLine P+ offers unique differentiation: integrated stripping, segmented current distribution, and unmatched reliability on thin seed layers. This makes the InfinityLine P+ exceptionally powerful in dynamic manufacturing environments where flexibility and yield are decisive.
“I am convinced that this technology sets a new benchmark for the next generation of panel-level plating,” said Steffen Beck, Director Technology of SCHMID Group.
Outlook & Availability
The shipment of the first InfinityLine P+ unit marks the beginning of commercialization. Initial customer installations and pilot runs are scheduled for the upcoming quarter. SCHMID invites interested customer to explore demonstrations, integration concepts, and service models now available for the InfinityLine P+.
With the InfinityLine P+, SCHMID expands its InfinityLine family with a key enabling technology for next-generation advanced packaging and high-density PCB applications – delivering a highly competitive alternative to existing plating platforms.
Forward-Looking Statements
This press release contains statements that constitute "forward-looking statements". All statements other than statements of historical fact included in this press release are forward-looking statements. Forward-looking statements are subject to numerous conditions, many of which are beyond the control of the Company, including those set forth in the "Risk Factors" section of the Company’s registration statement and final prospectus for the offering filed with the SEC. Copies are available on the SEC’s website, www.sec.gov. The Company undertakes no obligation to update these statements for revisions or changes after the date of this release, except as required by law.
About the SCHMID Group
The SCHMID Group is a global leader in providing solutions for the high-tech industry in the fields of electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH are headquartered in Freudenstadt, Germany. Founded in 1864, the company currently employs over 800 people worldwide and operates technology centers and production facilities at multiple locations, including Germany and China, along with several global sales and service locations. The Group focuses on developing customized equipment and process solutions for a variety of industries, including electronics, renewable energy, and energy storage. Our system and process solutions for the production of substrates, printed circuit boards, and other electronic components ensure cutting-edge technology, high yields at low production costs, maximum efficiency, quality, and sustainability through environmentally friendly manufacturing processes.
For more information about the SCHMID Group, please visit: www.schmid-group.com
Contact:
press@schmid-group.com
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/eefe1e37-bb95-4de7-9108-67137a2f635e
FAQ
What did SCHMID (SHMD) announce on October 8, 2025 about InfinityLine P+?
When will SHMD begin customer pilots and installations for InfinityLine P+?
What key technical features does SHMD's InfinityLine P+ offer for manufacturers?
How does InfinityLine P+ affect process integration for advanced packaging customers?
Is InfinityLine P+ compatible with factory automation and MES systems?
Does SCHMID disclose customer contracts or financial impact from the InfinityLine P+ shipment?
