Supermicro Showcases the Future of HPC Clusters and AI Infrastructure at Supercomputing 2025
Supermicro (NASDAQ:SMCI) announced its showcase at Supercomputing 2025 on November 17, 2025, highlighting AI, HPC, and liquid-cooled data center solutions.
Key exhibits include rack-scale NVIDIA GB300 NVL72 (72 Blackwell Ultra GPUs, 36 Grace CPUs, 279GB HBM3e per GPU), 4U HGX B300 liquid-cooled racks, 1U GB200 NVL4 nodes, Super AI Station desktops, liquid-cooled SuperBlade and FlexTwin platforms, and density-optimized MicroBlade and BigTwin systems. The company emphasized its DCBBS architecture and direct liquid cooling with Rear Door Heat Exchangers (50kW/80kW), Sidecar CDUs up to 200kW, and closed-loop water/dry towers to improve efficiency, scalability, and time-to-online for enterprise AI and HPC deployments.
Supermicro (NASDAQ:SMCI) ha annunciato la sua vetrina a Supercomputing 2025 il 17 novembre 2025, mettendo in evidenza soluzioni AI, HPC e data center raffreddati a liquido.
Tra le esposizioni principali: NVIDIA GB300 NVL72 a rack scale (72 GPU Blackwell Ultra, 36 CPU Grace, 279 GB HBM3e per GPU), rack liquidi 4U HGX B300, nodi 1U GB200 NVL4, stazioni desktop Super AI, piattaforme liquid-cooled SuperBlade e FlexTwin, nonché sistemi ad alta densità MicroBlade e BigTwin. L’azienda ha sottolineato la sua architettura DCBBS e il raffreddamento a liquido diretto con scambiatori di calore posteriore (50 kW/80 kW), CDUs laterali fino a 200 kW e torri d’acqua/a ciclo chiuso per migliorare efficienza, scalabilità e time-to-online per implementazioni aziendali di AI e HPC.
Supermicro (NASDAQ:SMCI) anunció su exhibición en Supercomputing 2025 el 17 de noviembre de 2025, destacando soluciones de IA, HPC y centros de datos enfriados por líquido.
Las exhibiciones clave incluyen NVIDIA GB300 NVL72 a escalas de rack (72 GPUs Blackwell Ultra, 36 CPUs Grace, 279 GB HBM3e por GPU), racks HGX B300 líquidos de 4U, nodos GB200 NVL4 de 1U, estaciones de escritorio Super AI, plataformas liquid-cooled SuperBlade y FlexTwin, y sistemas de alta densidad MicroBlade y BigTwin. La compañía destacó su arquitectura DCBBS y el enfriamiento directo por líquido con intercambiadores de calor de puerta trasera (50 kW/80 kW), CDUs laterales de hasta 200 kW y torres cerradas de agua/aire para mejorar la eficiencia, la escalabilidad y el tiempo hasta entrar en línea para implementaciones empresariales de IA y HPC.
Supermicro (NASDAQ:SMCI)가 2025년 11월 17일에 열리는 슈퍼컴퓨팅 2025에서의 쇼케이스를 발표하며 AI, HPC, 액체 냉각 데이터 센터 솔루션을 강조했습니다.
주요 전시는 랙 규모의 NVIDIA GB300 NVL72(72 Blackwell Ultra GPU, 36 Grace CPU, GPU당 279GB HBM3e), 4U HGX B300 액체 냉각 랙, 1U GB200 NVL4 노드, Super AI 스테이션 데스크탑, 액체 냉각 SuperBlade 및 FlexTwin 플랫폼, 고밀도 MicroBlade 및 BigTwin 시스템을 포함합니다. 회사는 DCBBS 아키텍처와 뒤쪽 열 교환기(Rear Door Heat Exchangers, 50kW/80kW), 사이드카 CDU 최대 200kW, 순환형 물/건물형 탑(CLOSED-LOOP)으로 대기업 AI 및 HPC 배치의 효율성, 확장성, 온라인 전환 시간을 개선하는 직접 액체 냉각을 강조했습니다.
Supermicro (NASDAQ:SMCI) a annoncé son exposition lors du Supercomputing 2025 le 17 novembre 2025, en mettant en avant des solutions IA, HPC et des centres de données refroidis par liquide.
Les expositions clés comprennent le NVIDIA GB300 NVL72 à l’échelle rack (72 GPU Blackwell Ultra, 36 CPU Grace, 279 Go HBM3e par GPU), racks liquides 4U HGX B300, nœuds 1U GB200 NVL4, stations de bureau Super AI, plateformes liquid-cooled SuperBlade et FlexTwin, et des systèmes MicroBlade et BigTwin à haute densité. L’entreprise a mis en avant son architecture DCBBS et le refroidissement liquide direct avec des échangeurs de chaleur de porte arrière (50 kW/80 kW), des CDUs latéraux jusqu’à 200 kW, et des tours d’eau/air en circuit fermé pour améliorer l’efficacité, l’évolutivité et le temps de mise en ligne pour les déploiements IA d’entreprise et HPC.
Supermicro (NASDAQ:SMCI) hat seine Showcase-Ankündigung auf der Supercomputing 2025 am 17. November 2025 veröffentlicht und hebt KI-, HPC- und liquidgekühlte Rechenzentrumslösungen hervor.
Zu den wichtigsten Ausstellungen gehören rack-scale NVIDIA GB300 NVL72 (72 Blackwell Ultra GPUs, 36 Grace CPUs, 279GB HBM3e pro GPU), 4U HGX B300 liquid-kühlte Racks, 1U GB200 NVL4 Knoten, Super AI Station Desktops, liquid-kühlte SuperBlade- und FlexTwin-Plattformen sowie dichte MicroBlade- und BigTwin-Systeme. Das Unternehmen betonte seine DCBBS-Architektur und das direkte Flüssigkeitskühlung mit Rear Door Heat Exchangers (50 kW/80 kW), Sidecar-CDUs bis zu 200 kW und geschlossene Wasser-/Lufttürme, um Effizienz, Skalierbarkeit und Time-to-Online für Unternehmens-IA und HPC-Deployments zu verbessern.
Supermicro (NASDAQ:SMCI) أعلنت عن عرضها في مؤتمر الحوسبة العابرة للسطوح 2025 في 17 نوفمبر 2025، مع إبراز حلول الذكاء الاصطناعي، والحوسبة عالية الأداء، ومراكز البيانات المبردة بالسائل.
تشمل المعروضات الرئيسية معيار الخادم كما في الرف NVIDIA GB300 NVL72 (72 وحدة GPU من Blackwell Ultra، 36 وحدة CPU من Grace، 279 جيجابايت HBM3e لكل GPU)، رَكّات HGX B300 مبردة بسائل بحجم 4U، عقد 1U GB200 NVL4، محطات سطح مكتب Super AI، منصات SuperBlade و FlexTwin المبردة بالسائل، وأنظمة MicroBlade و BigTwin ذات الكثافة العالية. أكدت الشركة على هندستها DCBBS والتبريد بالسائل المباشر مع مبادلات الحرارة الخلفية (Rear Door Heat Exchangers) بقوة 50 كيلوات/80 كيلوات، ووحدات CDU جانبية حتى 200 كيلوات، وأبراج مائية/جافة مغلقة لإيجاد تحسين في الكفاءة والمرونة ووقت التشغيل للإطلاقات المؤسسية للذكاء الاصطناعي والحوسبة عالية الأداء.
- None.
- None.
Insights
Supermicro unveils rack-scale liquid-cooled systems and DCBBS at SC25, signaling product-driven push into large-scale AI/HPC deployments.
Supermicro showcases an expanded portfolio of high-density, liquid-cooled platforms built around NVIDIA GB300 and HGX B300 technologies, targeting CPU- and GPU-bound workloads at scale. The announcement describes integrated Data Center Building Block Solutions (DCBBS) that combine compute, storage, networking, and thermal management to shorten deployment time for complex AI and HPC stacks. The product set ranges from desktop AI workstations to 4U/8U/20-node rack systems and in-rack cooling, which together form a coherent hardware offering for turnkey installations.
Execution depends on customer adoption, supply chain delivery, and successful integration with partner technologies; these factors determine near-term commercial impact. Claims of specific cooling capacities and node densities are factual product specs here but do not prove revenue or market share changes. Watch for publicized customer wins, shipping start dates, capacity orders, or specification-based benchmarks within the next
- In-booth demos will feature new Data Center Building Block Solutions® (DCBBS) incorporating NVIDIA GB300 NVL72 and NVIDIA HGX™ B300 Systems
- Future-ready data centers are designed to drive energy efficiency, scalability, performance, and reduce time-to-online
- Advanced cooling products, including Rear Door Heat Exchangers and Sidecar Cooling Distribution Units will be on display
"Supermicro continues to lead the industry in delivering complete, next-generation infrastructure solutions in close collaboration with our technology partners," said Charles Liang, president and CEO of Supermicro. "At SC25, we are demonstrating our high-performance DCBBS architecture, direct liquid cooling, and rack-scale innovations, which empower customers to deploy AI and HPC workloads faster, more efficiently, and more sustainably."
For more information, please visit: https://www.supermicro.com/en/event/sc25
Supermicro Systems will showcase new platforms designed to improve performance for both CPU- and GPU-bound workloads in large-scale HPC and AI environments.
Key highlights include:
- NVIDIA GB300 NVL72 with Liquid Cooling – Rack-scale solution with NVIDIA GB300 Grace™ Blackwell Superchips providing 72 NVIDIA Blackwell Ultra GPUs and 36 Grace CPUs per rack with 279GB HBM3e per GPU
- 4U HGX B300 Server Liquid Cooled Rack with In-Rack CDU
- 1U NVIDIA GB200 NVL4 Server (ARS-121GL-NB2B-LCC) - A high-density, liquid-cooled compute node purpose built for large-scale HPC and AI training.
- Super AI Station Based on NVIDIA GB300 (ARS-511GD-NB-LCC) - An AI and HPC development platform integrated into a desktop workstation form factor.
- Liquid-cooled 8U 20-node and 6U 10-node SuperBlade – An advanced liquid cooled platform delivering maximum CPU and GPU density, supporting Intel® Xeon® 6900, 6700, and 6500 Series processors up to 500W.
-
Liquid-cooled 2U FlexTwin multi-node system - An advanced liquid cooled (up to
95% heat capture) platform delivering maximum CPU computing density with four independent nodes, each equipped with the highest-performance dual socket CPUs supporting either AMD EPYC™ 9005 processors or Intel® Xeon® 6900 Series processors up to 500W.
DCBBS and Direct Liquid Cooling Innovations
Supermicro's DCBBS integrates compute, storage, networking, and thermal management to simplify the deployment of complex AI and HPC infrastructure.
Key highlights include:
- Rear Door Heat Exchangers - Supporting cooling capacities of 50kW or 80kW
- Liquid-to-Air Sidecar CDUs (cooling distribution units)- Supporting cooling capacities up to 200kW, with no external infrastructure needed.
- Water Cooling and Dry Towers – Energy-efficient external towers which cool the liquid, in a closed loop design.
Optimized Product Families for HPC Workloads and AI Infrastructure
Supermicro's high-density, liquid-cooled systems address use cases across financial services, manufacturing, climate and weather modeling, oil and gas, and scientific research. Each distinct product family is designed with an optimized combination of density, performance, and efficiency.
SuperBlade ® - The award-winning SuperBlade systems have been winning HPC customers worldwide for over 18 years. The latest generation X14 SuperBlade systems offer maximum performance and the highest density with both CPU and GPU for the most demanding HPC and AI workloads. Both air-cooling and direct-to-chip liquid cooling can be supported. With integrated InfiniBand and Ethernet switches, SuperBlade is ideal for HPC and AI applications.
FlexTwin™- The Supermicro FlexTwin architecture is purpose-built for HPC and is cost-efficient, designed to deliver maximum compute power and density in a multi-node configuration, with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling to maximize efficiency and reduce CPU thermal throttling, enabling low latency front and rear I/O with a range of flexible networking options up to 400G per node.
BigTwin® - Versatile Supermicro BigTwin is available as a 2U –4-Node or 2U 2-Node system. The Supermicro BigTwin shares power supplies and fans, which reduces power consumption. The BigTwin is available with the Intel® Xeon® 6 processor.
MicroBlade ® - The Supermicro 6U 40-node and 6U 20-node MicroBlade systems offer customers the highest density and a cost-effective single-socket x86 server solution. They have been used by leading semiconductor companies to design and develop ICs for over 10 years. MicroBlade systems support a wide range of CPUs including Intel Xeon 6300, Xeon D, and AMD EPYC 4005 Series. The latest generation MicroBlade systems can support up to 20 AMD EPYC 4005 Series CPUs and 20 GPUs in a 6U enclosure.
MicroCloud - Industry-proven design, scalable up to 10 CPU nodes or up to 5 CPU + GPU nodes per chassis. With up to 10 server nodes in only 3U of rack space, customers can increase their computing density by over 3.3x compared to industry-standard 1U rackmount servers.
Petascale Storage – Density-maximized all-flash storage systems optimized for scale-out and scale-up software-defined storage, with easy-to-deploy 1U and 2U form factors supporting industry standard EDSFF media.
Workstation - Workstation performance and flexibility in a rackmount form factor, offering increased density and security for organizations looking to utilize centralized resources.
Supermicro at SC25
Visit Supermicro at booth #3504 to check out the latest innovations and visit the in-booth theater to hear directly from experts, customers, and partners.
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in
Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
All other brands, names, and trademarks are the property of their respective owners.
View original content to download multimedia:https://www.prnewswire.com/news-releases/supermicro-showcases-the-future-of-hpc-clusters-and-ai-infrastructure-at-supercomputing-2025-302616668.html
SOURCE Super Micro Computer, Inc.