Semtech Launches 224Gbps IC Family for Linear Optics Era

Key Terms

transimpedance amplifiers technical

A transimpedance amplifier is an electronic circuit that converts a tiny input current from a sensor (for example, a light-detecting photodiode) into a usable output voltage so downstream electronics can read it. Think of it as a translator that turns a whisper of electric current into a clear volume reading; its speed, noise level, and precision directly affect product performance, market appeal, and margins in industries like communications, medical devices, and instrumentation.

mach-zehnder modulator technical

A Mach–Zehnder modulator is an optical device that turns an electrical signal into a controlled beam of light by splitting, changing, and recombining the light so its intensity or timing matches the input. Think of it like a high-speed faucet for light that can quickly turn the beam up, down or shift its timing. For investors it matters because the component is a key enabler of faster, more efficient fiber‑optic communications and data‑center links, affecting demand, product performance and margins in networking and photonics markets.

co-packaged optics technical

Co-packaged optics are optical components—lasers and fiber interfaces—physically packaged together with a network switch’s main processing chip so light-based data links sit much closer to the chip instead of traveling over long electrical traces. For investors, this matters because it can dramatically cut power use, boost data speed and density, and lower system costs in large data centers and telecom equipment, much like moving a power outlet next to a heavy appliance to avoid long, inefficient extension cords.

digital signal processor technical

A digital signal processor (DSP) is a specialized microchip or software routine that quickly cleans, shapes and analyzes streams of data like sound, radio waves or sensor readings, turning messy inputs into useful information. Investors care because DSPs enable products such as phones, radios, medical instruments and autonomous systems to perform reliably and efficiently; their presence can indicate higher performance, lower power use and stronger competitive advantage in hardware and software products.

silicon photonics technical

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

indium phosphide technical

Indium phosphide is a high-performance semiconductor material used to make chips, lasers and detectors that carry and process light and very fast electrical signals. Think of it as a specialized road surface designed for high-speed light traffic—better suited than ordinary silicon for fiber-optic communications, high-frequency electronics and some sensors. Investors care because demand and supply for this material affect companies in telecom, data centers, photonics and semiconductor supply chains, influencing costs, production capacity and technology competitiveness.

thin-film lithium niobate technical

A thin, wafer-like layer of lithium niobate—a crystalline material that efficiently converts and controls light and electrical signals—used to build compact, high-speed optical and electronic components. It matters to investors because it enables faster, lower-power data transmission and sensing in telecom, data centers and advanced electronics, acting like a super-efficient highway for light that can reduce costs and create new product opportunities in growing markets.

Purpose-built TIAs and drivers address LPO through NPO at 800G, 1.6T and higher densities as AI data centers move beyond DSP-based architectures

CAMARILLO, Calif.--(BUSINESS WIRE)-- Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced a family of 224Gbps per lane Transimpedance Amplifiers (TIAs) and Mach-Zehnder Modulator (MZM) drivers for half retimed (LRO), LPO, XPO, Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) interconnect applications.

Semtech Launches 224Gbps IC Family for Linear Optics Era

The new CEI-224G-Linear and LPO-MSA compliant devices enable 800G, 1.6T and 3.2T transceivers and optical engines for AI/ML clusters, hyperscale data centers and next-generation cloud infrastructure.

As AI and machine learning workloads drive significant growth in optical interconnects, power efficiency, system cooling and cost have become increasingly critical factors alongside higher speed and throughput requirements. Semtech’s new TIAs and Drivers are purpose-built to support linear interconnect architectures that remove the power-intensive Digital Signal Processor (DSP) from optical modules while providing the performance and features required to maintain link integrity. The low latency inherent in linear channels also reduces time lags in data processing, supporting faster AI feedback loops and inference cycles.

According to LightCounting’s January 2025 Optics for AI Clusters report, the market for linear optical transceivers and CPO/NPO optics for AI cluster networks is forecast to more than double, from $5 billion in 2024 to over $10 billion in 2026, as hyperscalers accelerate deployment of higher-speed linear interconnect architectures.

“As customers move from DSP-based to linear optical architectures, the last thing they need is to piece together components from multiple sources and hope they work together,” said Amit Thakar, vice president of signal integrity product marketing at Semtech. “We developed these solutions to deliver the performance and flexibility they need across linear optics applications, from a single trusted source.”

224G TIA Family

Semtech’s 224G TIA family — the GN1834L, GN1834DL and GN1838DL — offers four- and eight-channel architectures with multiple layout options to accommodate a wide range of module designs. Integrated on-chip equalization, high linearity and low noise deliver the signal integrity performance critical for LPO and next-generation linear optics applications.

224G Driver Family

The 224G driver family — the quad GN1877 and octal GN1887 — supports Silicon Photonics (SiPho), Indium Phosphide (InP) MZM and Thin-Film Lithium Niobate (TFLN) optical transmitters with tunable gain and output swing, giving designers flexibility to optimize for power and performance across different optical components. A CEI-224G-Linear compliant host side equalizer covers the full range of host interfaces from compact NPO/CPO to different LRO/LPO/XPO trace lengths.

Link Monitoring and Telemetry

Both TIA and driver families integrate real-time link monitoring and telemetry, enabling proactive diagnostics that help reduce optical link flapping and improve overall network reliability.

Availability

GN1834L, GN1834DL and GN1887 are available now. GN1838DL and GN1877 are expected to be released in April 2026.

Customers and partners are invited to visit Semtech at booth #1812 during OFC 2026, Mar. 17–19, in Los Angeles, California, to see these demonstrations and meet with Semtech’s technical experts. Learn more at www.semtech.com/optical.

About Semtech Corporation

Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductors powering data center networking, IoT connectivity and cellular infrastructure solutions dedicated to delivering high-quality technology solutions that enable a smarter, more connected and sustainable planet. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X.

Semtech and the Semtech logo are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks, and trade names mentioned in this press release are the property of their respective owners.

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View source version on businesswire.com: https://www.businesswire.com/news/home/20260316364888/en/

Michelle Lozada, pr@semtech.com

Source: Semtech Corporation