Smartkem to Present Disruptive MicroLED Technology at IDW Japan 2025

Rhea-AI Summary

Smartkem (NASDAQ: SMTK) will present its first MicroLED-in-Package MiP4 backlight at the 32nd International Display Workshops in Hiroshima on December 4, 2025 at 16:40 local time.

Steven Tsai, Head of Technology Transfer, will present "From Chip to Panel: High-Brightness, Low-Power Mini-LED Backlighting via MicroLED-in-Package (MiP4)" and be available for meetings Dec 3–5. The MiP4 integrates four sub-85µm MicroLEDs via a proprietary Redistribution Layer into a single 12V chip-first package, achieving 34,047 nits peak brightness and reducing GaN usage by 84% versus COB. Smartkem positions MiP4 as a lower-power, lower-cost backlight compatible with existing die-bonding equipment and aimed at the LCD market (~65% of global display industry).

News Market Reaction

+5.63%

4 alerts

+5.63% News Effect

+3.2% Peak Tracked

+$523K Valuation Impact

$10M Market Cap

0.0x Rel. Volume

On the day this news was published, SMTK gained 5.63%, reflecting a notable positive market reaction. Argus tracked a peak move of +3.2% during that session. Our momentum scanner triggered 4 alerts that day, indicating moderate trading interest and price volatility. This price movement added approximately $523K to the company's valuation, bringing the market cap to $10M at that time.

Data tracked by StockTitan Argus on the day of publication.

Key Figures

LCD market share: 65% Sub-microLED size: sub-85um Integrated uLEDs per package: 4 +5 more

8 metrics

LCD market share 65% Share of global display industry targeted by MiP4 backlight

Sub-microLED size sub-85um Size of each of the four MicroLEDs in MiP4 structure

Integrated uLEDs per package 4 Number of MicroLEDs connected in series in each MiP4 package

Operating voltage 12V Native operating voltage supported by MiP4 chip

GaN usage reduction 84% Reduction in GaN usage versus COB implementations

Peak brightness 34,047 nits Peak brightness achieved in a 400-zone MiP4 backlight

Backlight zones 400 Number of dimming zones in the MiP4 backlight demonstration

Backlight size 12.3-inch Size of Smartkem’s first MiP4 backlight shown at the conference

Market Reality Check

Price: $1.02 Vol: Volume 62,964 is below 20...

low vol

$1.02 Last Close

Volume Volume 62,964 is below 20-day average of 197,919, suggesting limited pre-news activity. low

Technical Price 1.73 is trading above 200-day MA at 1.69, showing slight longer-term recovery.

Peers on Argus

Among close peers, ASYS rose 25.57% and AXTI gained 6.57%, while ATOM fell 1.17%...

1 Up 1 Down

Among close peers, ASYS rose 25.57% and AXTI gained 6.57%, while ATOM fell 1.17%, indicating mixed moves rather than a unified sector trend around this Smartkem news.

Historical Context

5 past events · Latest: Dec 10 (Positive)

Pattern 5 events

Date	Event	Sentiment	Move	Catalyst
Dec 10	Biometric tech update	Positive	+10.1%	All-organic-transistor biometric sensor unveiled with IEEE conference presentation.
Dec 01	Display tech showcase	Positive	+5.6%	MiP4 MicroLED backlight presentation at IDW aimed at LCD display market.
Nov 20	Merger LOI extension	Neutral	-14.7%	Extended non-binding LOI for all-stock merger to form AI infrastructure company.
Nov 20	Merger LOI extension	Neutral	-14.7%	Extended LOI and investment deadline details for proposed Jericho merger.
Nov 20	Merger LOI extension	Neutral	-14.7%	Further description of LOI terms and capital, approvals, and listing conditions.

Pattern Detected

Recent positive technology announcements (MiP4 backlight, organic biometric sensor) were followed by positive price reactions, while merger-related LOI extensions coincided with sharp declines.

Recent Company History

Over the last few weeks, Smartkem highlighted several technology and strategic milestones. On Nov 20, 2025, multiple releases on a proposed all-stock merger with Jericho Energy saw shares fall 14.65%, despite the potential creation of a Nasdaq-listed AI infrastructure company. On Dec 1, 2025, this MiP4 MicroLED backlight presentation news was followed by a 5.63% gain, and the Dec 10, 2025 all-organic biometric sensor announcement coincided with a 10.13% increase, suggesting stronger market reception to core technology progress than to M&A plans.

Market Pulse Summary

The stock moved +5.6% in the session following this news. A strong positive reaction aligns with how...

Analysis

The stock moved +5.6% in the session following this news. A strong positive reaction aligns with how Smartkem’s stock previously responded to core technology news, such as the MiP4 backlight and all-organic biometric sensor updates that saw moves of 5.63% and 10.13%. However, recent filings highlighted liquidity pressures, going-concern language, and reliance on external financing. Past merger-related headlines coincided with a 14.65% decline, underscoring that sentiment has shifted quickly before, and financing or execution risks could still influence sustainability of gains.

Key Terms

microled-in-package (mip4), redistribution layer (rdl), microled, lcd, +2 more

6 terms

microled-in-package (mip4) technical

"Smartkem's breakthrough MicroLED-in-Package (MiP4) Backlight at IDW Japan"

MicroLED-in-package (MIP4) is a display technology approach where extremely small light-emitting chips are placed and connected within a single package to form pixels, like arranging tiny, individually controlled tiles inside a framed panel. It matters to investors because this packaging can deliver brighter, more energy-efficient, longer-lasting and thinner displays than conventional screens, affecting product competitiveness, manufacturing costs and supply-chain opportunities for companies involved in displays and consumer electronics.

redistribution layer (rdl) technical

"proprietary Redistribution Layer (RDL) material, which interconnects four chip-first"

A redistribution layer (RDL) is a very thin patterned metal layer added to a semiconductor chip or package to reroute tiny internal electrical contacts to larger, more accessible pads on the outside. It helps connect the chip to the rest of a circuit during assembly and packaging. For investors, RDL quality and supply affect manufacturing yield, product reliability, assembly cost and performance, so advances or shortages can influence a maker’s margins and production capacity — like improving plumbing to reduce leaks and speed flow.

microled technical

"Smartkem's 'chip-first' MicroLED architecture introduces a breakthrough approach"

MicroLED is a type of display technology that uses tiny, individual light-emitting tiles to create images with bright colors, sharp contrast, and wide viewing angles. Because of their efficiency and high quality, microLED screens can provide clearer and more vibrant visuals, which can enhance the appeal and performance of electronic devices. For investors, advancements in microLED technology may signal potential growth opportunities in the electronics and display markets.

lcd technical

"enhance today's Liquid Crystal Display (LCD) market, which represents approximately 65%"

A liquid crystal display (LCD) is a flat-panel screen technology that uses a layer of liquid crystals to control light and form images, like tiny adjustable window blinds that let varying amounts of light through to make pictures. Investors care because LCD production, demand and pricing affect revenue, profit margins and supply chains for electronics makers and retailers, so shifts in LCD costs or adoption can change company earnings and capital needs.

cob technical

"Compared to COB, MiP4 reduces GaN usage by 84 percent while achieving"

COB stands for “close of business” and means the end of the business day—typically the time when markets and companies stop official activity for that day. Investors pay attention because COB sets deadlines for filings, orders, and company actions; it’s like a daily deadline or the final whistle in a game that decides whether something takes effect today or is deferred until the next business day.

die bonding technical

"Compatibility with existing MiniLED die bonding equipment"

Die bonding is the assembly step that physically attaches a tiny silicon chip (the “die”) to its package or circuit board using solder, adhesive, or other methods; think of it as securing a miniature engine into its mount so it can be connected and cooled. It matters to investors because the quality and cost of die bonding affect manufacturing yield, product reliability, thermal and electrical performance, and therefore production costs, profit margins and supply risk for semiconductor and electronics makers.

AI-generated analysis. Not financial advice.

Smartkem Head of Technology Transfer, Steven Tsai, will present Smartkem's breakthrough MicroLED-in-Package (MiP4) Backlight at IDW Japan on Thursday, December 4, 2025.

MANCHESTER, England, Dec. 1, 2025 /PRNewswire/ -- Smartkem, Inc. (NASDAQ: SMTK), a company developing a new class of organic semiconductor technology, will be presenting its first MicroLED-in-Package Backlight at the 32^nd International Display Workshops (IDW) Conference in Hiroshima, Japan, on Thursday, December 4, 2025 at 16:40 local time.

In a special topic of interest segment on Micro/Mini LEDs to be chaired by Rumiko Yamaguchi (Akita Univ.) and co-chaired by Tauto Nakanishi (JNC), Steven Tsai, Smartkem's Head of Technology Transfer, will be delivering a presentation based on the publication of a technical paper titled 'From Chip to Panel: High-Brightness, Low-Power Mini-LED Backlighting via MicroLED-in-Package (MiP4)'.

First debuted at Touch Taiwan in April 2025, and exhibited at Display Week in May 2025, Smartkem's first MicroLED-in-Package (MiP4) backlight using its proprietary technology has the potential to disrupt the global display market. Smartkem's 'chip-first' MicroLED architecture introduces a breakthrough approach to MicroLED display manufacturing with a low temperature process that simplifies production, improves yields and delivers an enhanced display performance. This new MicroLED-in-Package (MiP4) backlight simplifies assembly and yield management for display manufacturers and is designed for seamless integration of MicroLEDs to enhance today's Liquid Crystal Display (LCD) market, which represents approximately 65% of the global display industry¹.

Presenter	Steven Tsai, Head of Technology Transfer
Location	Phoenix Hall, International Conference Center Hiroshima, Japan
Date	Thursday, December 4, 2025
Time	16:40 local time
Presentation Title	From Chip to Panel: High-Brightness, Low-Power Mini-LED Backlighting via MicroLED-in Package (MiP4)
Abstract	We present MiP4, a Mini-LED structure integrating four sub-85um sized uLEDs in series via RDL on glass. The chip supports native 12V operation, reducing power loss and SMT complexity. Compared to COB, MiP4 reduces GaN usage by 84 percent while achieving 34,047 nits peak brightness in a 400-zone backlight.

 

Steven Tsai will be in attendance throughout the conference from December 3-5, and available for 1-on-1 meetings to showcase Smartkem's first 12.3-inch MicroLED-in-Package (MiP4) backlight.

Smartkem's MiP4
At the core of this advancement is Smartkem's proprietary Redistribution Layer (RDL) material, which interconnects four chip-first MicroLEDs in a series to form a single high-voltage chip—the MiP4. This MiP4 package is designed to replace existing MiniLED packages in LCD backlights and signage applications, offering:

• Higher brightness at lower power
• Lower expected production costs
• Compatibility with existing MiniLED die bonding equipment
• Shipping in MiP4-on-blue tape format for seamless industry adoption

 

About Smartkem

Smartkem is seeking to change the world of electronics with a new class of transistors developed using its proprietary advanced semiconductor materials. Our TRUFLEX® semiconductor polymers enable low temperature printing processes that are compatible with existing manufacturing infrastructure to deliver low-cost, high-performance displays. Our semiconductor platform can be used in a range of display technologies including MicroLED, LCD and AMOLED, as well as in applications in advanced computer and AI chip packaging, sensors, and logic.

Smartkem designs and develops its materials at its research and development facility in Manchester, UK and operates a field application office in Hsinchu, Taiwan, close to collaboration partner, The Industrial Technology Research Institute (ITRI) where it provides prototyping services. Smartkem is developing a commercial-scale production process and Electronic Design Automation (EDA) tools to demonstrate the commercial viability of manufacturing a new generation of displays using its materials.

The company has an extensive IP portfolio including 140 granted patents across 17 patent families, 14 pending patents and 40 codified trade secrets.

For more information, visit the Smartkem website or follow on LinkedIn.

Forward-Looking Statements

All statements in this press release that are not historical are forward-looking statements, including, among other things, its market position and market opportunity, expectations and plans as to its product development, manufacturing and sales, and relations with its partners and investors. These statements are not historical facts but rather are based on Smartkem, Inc.'s current expectations, estimates, and projections regarding its business, operations and other similar or related factors. Words such as "may," "will," "could," "would," "should," "anticipate," "predict," "potential," "continue," "expect," "intend," "plan," "project," "believe," "estimate," and other similar or elated expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond the Company's control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described in the Company's filings with the Securities and Exchange Commission. The Company undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available.

 

¹ Omdia Report

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SOURCE SmartKem, Inc.

FAQ

When and where will Smartkem (SMTK) present its MiP4 MicroLED backlight?

Smartkem will present at IDW Hiroshima on December 4, 2025 at 16:40 local time in Phoenix Hall, International Conference Center Hiroshima.

What key performance figures does Smartkem report for the MiP4 backlight (SMTK)?

The MiP4 achieves a reported 34,047 nits peak brightness and reduces GaN usage by 84% compared with COB.

How does Smartkem's MiP4 package (SMTK) change manufacturing for MicroLED backlights?

MiP4 uses a chip-first RDL architecture for a single 12V high-voltage chip that simplifies assembly, reduces SMT complexity, and is compatible with existing MiniLED die-bonding equipment.

Will Smartkem executives be available for meetings at IDW Japan 2025?

Yes. Steven Tsai will attend December 3–5 and is available for 1-on-1 meetings to showcase the 12.3-inch MiP4 backlight.

What applications and market does Smartkem target with MiP4 (SMTK)?

MiP4 is designed to replace MiniLED packages in LCD backlights and signage, targeting the LCD segment which represents about 65% of the global display industry.