Welcome to our dedicated page for Stmicro news (Ticker: STM), a resource for investors and traders seeking the latest updates and insights on Stmicro stock.
STMicroelectronics (NYSE: STM) is a global leader in semiconductor solutions powering electronics across automotive, industrial, and IoT markets. This page aggregates all official news releases and third-party coverage related to STM's technological advancements and market activities.
Investors and industry professionals will find timely updates on quarterly earnings, product innovations like silicon carbide power modules, and strategic collaborations shaping next-generation mobility and automation solutions. The curated collection includes announcements about microcontroller developments, sensor technologies, and sustainability initiatives.
Key content categories cover financial performance, R&D breakthroughs, manufacturing expansions, and industry recognition. Each update provides insights into STM's role in enabling energy-efficient systems, smart factories, and secure IoT connectivity through its analog and digital semiconductor expertise.
Bookmark this page for streamlined access to STMicroelectronics' latest developments. Check back regularly to stay informed about the company's progress in advancing edge computing, electric vehicle technologies, and industrial automation solutions.
STMicroelectronics (NYSE: STM) is leading the STARLight project, a European consortium of 24 technology companies and universities from 11 EU countries, selected by the European Commission under the EU CHIPS Joint Undertaking initiative. The project aims to establish Europe as a leader in 300mm silicon photonics (SiPho) technology through 2028.
The initiative focuses on developing advanced Photonic Integrated Circuits (PICs) for datacenters, AI clusters, telecommunications, and automotive markets. Key technical objectives include creating modulators operating at >200 Gbps per lane, developing on-chip lasers, and exploring advanced materials like Silicon-on-Insulator (SOI), Lithium Niobate, and Barium Titanate.
The consortium includes major partners such as SOITEC, CEA-LETI, imec, NVIDIA, Ericsson, and THALES, working to establish a high-volume manufacturing line and complete value chain for silicon photonics applications.
STMicroelectronics (NYSE: STM) has strengthened its commitment to Ultra-Wideband (UWB) technology by joining the FiRa Consortium's board of directors. Rias Al-Kadi, General Manager of ST's Range and Connectivity Division, will represent the company on the board.
ST is actively involved in developing the IEEE 802.15.4ab amendment for UWB technology, which aims to improve system performance with centimeter-level accuracy, enhanced security, and reduced power consumption. The company's participation focuses on advancing the Connected Car Consortium (CCC) Digital Key ecosystem and expanding UWB applications in consumer and automotive markets.
The technology's applications include automotive access, digital keys, smart home automation, and IoT innovations, with particular emphasis on improving vehicle access systems and reducing implementation costs.
STMicroelectronics (NYSE:STM) has announced plans to develop next-generation Panel-Level Packaging (PLP) technology through a new pilot line at its Tours facility in France. The company is investing $60 million in this strategic initiative, which is expected to be operational by Q3 2026.
The advanced PLP technology represents a significant upgrade from traditional wafer-level packaging, utilizing large rectangular panels instead of circular wafers to achieve higher manufacturing throughput. ST's PLP technology, featuring Direct Copper Interconnect (DCI), currently produces over 5 million units daily on a highly automated line using 700x700mm panels.
This initiative builds upon ST's existing PLP line in Malaysia and will expand the technology's application across automotive, industrial, and consumer products, including RF, analog, power, and microcontrollers. The project will leverage synergies with the local R&D ecosystem, including the CERTEM R&D center.
STMicroelectronics (NYSE:STM) has reported the latest status of its common share repurchase program for the period of August 25-29, 2025. The company repurchased 271,723 ordinary shares (0.03% of issued share capital) at a weighted average price of €23.4140 per share, totaling €6,362,126.30.
The buyback program, approved by shareholders on May 22, 2024, aims to meet obligations from share option programs and allocations to employees and management. Following these transactions, STMicroelectronics now holds 18,960,219 treasury shares, representing approximately 2.1% of its issued share capital.
STMicroelectronics (NYSE:STM) has reported the latest status of its common share repurchase program for the period of August 18-22, 2025. The company purchased 347,979 ordinary shares (0.04% of issued share capital) at a weighted average price of €22.2975 per share, totaling €7,759,044.98.
The buyback program, approved by shareholders on May 22, 2024, aims to meet obligations from share option programs and employee stock allocations. Following these transactions, STMicroelectronics now holds 18,688,496 treasury shares, representing approximately 2.1% of its issued share capital.
STMicroelectronics (NYSE:STM), a global semiconductor leader, has announced the publication of its IFRS 2025 Semi Annual Accounts for the period ending June 28, 2025. The financial reports, prepared in accordance with International Financial Reporting Standards (IFRS-EU), have been filed with the Netherlands Authority for the Financial Markets (AFM) and are now available on both the company's website and the AFM's website.
STMicroelectronics (NYSE:STM) has reported the latest status of its common share repurchase program for the period of August 11-15, 2025. The company repurchased 300,000 ordinary shares (0.03% of issued share capital) at a weighted average price of €22.0187 per share, totaling €6,605,604.00.
The buyback program, approved by shareholders on May 22, 2024, aims to meet obligations from share option programs and allocations to employees and management. Following these transactions, STMicroelectronics now holds 18,340,517 treasury shares, representing approximately 2.0% of its issued share capital.
STMicroelectronics (NYSE:STM) has reported the latest status of its common share repurchase program for the period of August 4-8, 2025. The company repurchased 290,000 ordinary shares (0.03% of issued share capital) at a weighted average price of €21.5694 per share, totaling €6,255,128.00.
The buyback program, approved by shareholders on May 22, 2024, aims to meet obligations from share option programs and allocations to employees and management. Following these transactions, STMicroelectronics now holds 18,040,517 treasury shares, representing approximately 2.0% of its issued share capital.
STMicroelectronics (NYSE:STM) has reported the latest status of its common share repurchase program from July 28 to August 1, 2025. The company repurchased 733,818 ordinary shares (0.08% of issued share capital) at a weighted average price of €22.73 per share, totaling €16.68 million.
The buyback program, approved by shareholders on May 22, 2024, aims to meet obligations for employee share options and management stock programs. Following these transactions, STMicroelectronics now holds 17,750,517 treasury shares, representing approximately 1.9% of its issued share capital.
STMicroelectronics (NYSE:STM) has reported the latest status of its common share repurchase program for the period of July 21-25, 2025. The company repurchased 474,844 ordinary shares (0.05% of issued share capital) at a weighted average price of €24.91 per share, totaling €11.83 million.
The buyback is part of a program approved by shareholders on May 22, 2024, aimed at meeting obligations from share option programs and employee stock allocations. Following these transactions, STMicroelectronics now holds 17,839,774 treasury shares, representing approximately 2.0% of its issued share capital.
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