Tower Semiconductor Launches 2025 Technical Global Symposium Series

Rhea-AI Summary

Tower Semiconductor (NASDAQ/TASE: TSEM) has announced its 2025 Technical Global Symposium (TGS) series, with events scheduled in Shanghai on September 16, 2025, and Santa Clara on November 18, 2025.

The symposiums will focus on market megatrends in AI, high-speed connectivity, and other advancing domains. CEO Russell Ellwanger will deliver keynote addresses, while technical sessions will cover Tower's solutions in Silicon Photonics, SiGe, RF SOI, power management, image sensors, and display technologies. The events will provide networking opportunities with Tower executives and industry experts.

Premier events in Shanghai and Santa Clara will showcase Tower’s latest technologies and expertise, with sessions by senior leaders and engineers, allowing networking with peers and Tower experts

MIGDAL HAEMEK, Israel, August 13, 2025 - Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced the launch of its 2025 Technical Global Symposium (TGS) – the company’s flagship annual technology and innovation event series. This year’s symposiums will be held September 16, 2025, in Shanghai, China and November 18, 2025, in Santa Clara, California.

Events will explore key market megatrends in AI, high-speed connectivity, and other rapidly advancing domains, highlighting Tower’s capabilities and technology platforms that enable customers to deliver high-performance connectivity, power-efficient architectures, and advanced imaging solutions. Attendees will gain insight into how Tower’s technologies and design enablement services can accelerate development, strengthen product differentiation, and create measurable market value.

Highlights of the events include:

• Keynote by Russell Ellwanger, CEO of Tower Semiconductor, sharing the company’s vision for the future and its commitment to driving growth in close partnership with customers.
• Expert-led technical deep dives into Tower’s industry-leading solutions in Silicon Photonics, SiGe, RF SOI, power management, image sensors, and advanced display technologies – along with its comprehensive design enablement ecosystem.
• Exclusive guest sessions from global technology leaders, providing inside perspectives on breakthroughs in AI innovation and optical communications.
• High-value networking opportunities with Tower’s senior executives, domain experts, and industry peers – enabling collaborations that drive the next wave of semiconductor innovation.

Registration for TGS China event is now open: click here to register
For additional information, agenda, and registration, please visit the event page here.

About Tower Semiconductor         

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor owns one operating facility in Israel (200mm), two in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo, shares a 300mm facility in Agrate, Italy with STMicroelectronics as well as has access to a 300mm capacity corridor in Intel’s New Mexico factory. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 

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Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com

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• TGS_2025_Press_Release_FINAL

FAQ

When and where will Tower Semiconductor's 2025 Technical Global Symposium take place?

The symposiums will be held in Shanghai, China on September 16, 2025, and in Santa Clara, California on November 18, 2025.

What technologies will be featured at Tower Semiconductor's 2025 TGS?

The symposium will showcase Tower's solutions in Silicon Photonics, SiGe, RF SOI, power management, image sensors, and advanced display technologies, along with its design enablement ecosystem.

Who will be speaking at Tower Semiconductor's 2025 Technical Global Symposium?

CEO Russell Ellwanger will deliver the keynote address, accompanied by technical sessions from Tower's domain experts and guest sessions from global technology leaders.

How can I register for Tower Semiconductor's 2025 Technical Global Symposium?

Registration is currently open for the China event through Tower Semiconductor's event page. Interested parties can visit the event page for additional information, agenda, and registration details.