Welcome to our dedicated page for Taiwan Semi news (Ticker: TSM), a resource for investors and traders seeking the latest updates and insights on Taiwan Semi stock.
Taiwan Semiconductor Manufacturing Company Ltd. reports news on its role as a pure-play semiconductor foundry and foreign-issuer ADR traded under TSM. Company updates commonly cover advanced process technology, including A-series and N-series logic nodes, design enablement, and manufacturing services for artificial intelligence, high-performance computing, mobile, automotive and IoT applications.
Recurring announcements also address annual Form 20-F reporting, customer technology symposiums, advanced packaging and test collaborations, and governance or management changes tied to TSMC's global operations across Asia, Europe and North America. The company's disclosures describe foundry services spanning advanced, specialty and advanced packaging technologies for a broad customer ecosystem.
TSMC (NYSE: TSM) announced a significant partnership with DENSO, who will acquire a minority stake in Japan Advanced Semiconductor Manufacturing, Inc. (JASM) for US$0.35 billion, securing over 10% equity. The JASM fab, scheduled for construction in 2022, aims to ramp up production capacity to 55,000 12-inch wafers monthly by late 2024, with an estimated total investment of US$8.6 billion. This collaboration is expected to bolster semiconductor supply in the automotive sector, directly creating approximately 1,700 high-tech jobs in Japan.
TSMC has honored 11 partners with the 2021 OIP Partner of the Year awards during its OIP Ecosystem Forum. These awards recognize excellence in semiconductor design enablement, highlighting collaborative efforts that promote innovation. TSMC's Open Innovation Platform aims to reduce design barriers and accelerate implementation in the semiconductor community. This initiative has been pivotal in enabling next-generation designs, bringing together creative thinking from global partners. TSMC continues to lead with 281 process technologies and the latest advancements in semiconductor manufacturing.
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TSMC (NYSE: TSM) is showcasing innovations in advanced logic technology and packaging at its 2021 Technology Symposium held online from June 1-2. Key highlights include the introduction of N6RF for enhanced 5G performance, N5A for automotive applications, and advancements in the 3DFabric technology. TSMC also confirms risk production of the N4 technology by Q3 2021 and anticipates N3 to begin volume production in H2 2022, promising significant performance and efficiency improvements. Over 5,000 participants are registered, underscoring TSMC's strong industry presence.
TSMC (TWSE: 2330, NYSE: TSM) submitted its 2020 annual report on Form 20-F to the U.S. Securities and Exchange Commission. The report details the company's operations, including the use of 281 distinct process technologies and the manufacture of 11,617 products for 510 customers in 2020. TSMC is recognized as the leading dedicated semiconductor foundry, pioneering 5-nanometer production capabilities. The full report is available online, and hard copies can be requested via email.
TSMC (TWSE: 2330, NYSE: TSM) has been awarded the 2021 IEEE Corporate Innovation Award recognizing its leadership in 7-nanometer semiconductor foundry technology, which significantly contributes to advancements in various applications. Since the 7nm technology's volume production began in April 2018, TSMC has manufactured over one billion good dies, enhancing innovations in areas like AI, data centers, and 5G. TSMC invests approximately 8% of its revenue in R&D, amounting to US$2.96 billion in 2019, to maintain its technology leadership.