New power management chips from TI maximize protection, density and efficiency for modern data centers

Rhea-AI Summary

Texas Instruments (TXN) has unveiled new power-management chips for modern data centers, addressing increasing power demands driven by AI and high-performance computing. The company introduced the TPS1685, the industry's first 48V integrated hot-swap eFuse with power-path protection, capable of supporting power levels beyond 6kW.

TI also launched a new family of integrated GaN power stages (LMG3650R035, LMG3650R025, and LMG3650R070) in industry-standard TOLL packaging, achieving high efficiency (>98%) and power density (>100W/in3). These innovations are being showcased at APEC 2025, featuring implementations in notable products including Dell's 1.8kW server PSU, Vertiv's 5.5kW server PSU delivering up to 132kW per rack, and Greatwall's 8kW PSU.

Positive

• New TPS1685 eFuse reduces solution size by 50% compared to existing controllers
• GaN power stages achieve high efficiency >98% and power density >100W/in3
• Major customer adoption: Dell, Vertiv, and Greatwall implementing TI solutions
• Products available for immediate purchase in preproduction quantities

Negative

• Products currently only available in preproduction quantities, not full production

News highlights:

• The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.
• New integrated gallium nitride (GaN) power stages combine TI GaN and a high-performance gate driver with advanced protection features in an industry-standard transistor outline leadless (TOLL) package.

DALLAS, March 17, 2025 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today debuted new power-management chips to support the rapidly growing power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions. TI's new TPS1685 is the industry's first 48V integrated hot-swap eFuse with power-path protection to support data center hardware and processing needs. To simplify data center design, TI also introduced a new family of integrated GaN power stages, the LMG3650R035, LMG3650R025and LMG3650R070, in industry-standard TOLL packaging. TI is showcasing these devices at the 2025 Applied Power Electronics Conference (APEC), March 16-20, in Atlanta, Georgia.

For more information, see ti.com/TPS1685, ti.com/LMG3650R035 and ti.com/LMG3650R070.

"With data centers increasingly demanding more energy, powering the world's digital infrastructure begins with smarter, more efficient semiconductors," said Robert Taylor, general manager, Industrial Power Design Services. "While advanced chips drive AI's computational power, analog semiconductors are key to maximizing energy efficiency. Our latest power-management innovations are enabling data centers to reduce their environmental footprint while supporting the growing needs of our digital world."

Reach power levels beyond 6kW with intelligent system protection 
As power demands surge, data center designers are shifting to 48V power architectures for enhanced efficiency and scalability to support components such as CPUs, graphics processing units and AI hardware accelerators. TI's 48V stackable integrated hot-swap eFuse with power-path protection empowers designers to tackle high-power (>6kW) processing needs with a scalable device that simplifies design and reduces solution size by half compared to existing hot-swap controllers in the market.

To learn more about designing with the TPS1685, read the technical article, "Powering Modern AI Data Centers with an Integrated 48V Hot-Swap eFuse Device."

Achieve higher efficiency with TI GaN in industry-standard packaging
In addition, TI introduced a new family of integrated GaN power stages. The LMG3650R035, LMG3650R070 and LMG3650R025 leverage the benefits of TI GaN in an industry-standard TOLL package, allowing designers to take advantage of TI GaN efficiency without costly and time-consuming redesigns.

The new power stages integrate a high-performance gate driver with a 650V GaN field-effect transistor (FET) while achieving high efficiency (>98%) and high-power density (>100W/in³). They also integrate advanced protection features including over-current protection, short-circuit protection and over-temperature protection. This is especially important for AC/DC applications like server power, where designers are challenged to push more power into smaller spaces.

To learn more about TI GaN power stages in industry-standard packaging, read the technical article, "Developing industry-standard power supplies with integrated TOLL-packaged GaN devices."

Reimagining power density and efficiency at APEC 2025
At APEC 2025, TI will showcase power solutions that enable designers to reimagine new levels of power density and efficiency, including:

• Dell's 1.8kW server power-supply unit (PSU) with TI GaN power stages: Dell's first high-efficiency 12V PSU design uses a TI integrated GaN power stage. The PSU features a GaN FET with built-in driver, protection and temperature reporting to achieve over 96% system-level efficiency.
• Vertiv's 5.5kW server PSU: Part of Vertiv's PowerDirect Rack DC power system, the latest PSU from Vertiv is powered by TI GaN technology to deliver up to 132kW per rack.
• Greatwall's 8kW PSU: To help designers increase power density, Greatwall and TI co-developed an 8kW open-rack PSU using TI GaN technology and TI C2000™ real-time microcontrollers.

Throughout the show, TI power experts will lead 27 industry and technical sessions to address power-management design challenges. Visit TI in the Georgia World Congress Center, Booth No. 1213. The full schedule is available at ti.com/APEC.

Package, availability and pricing

• Preproduction quantities of the TPS1685, LMG3650R035, LMG3650R070 and LMG3650R025 are available for purchase now on TI.com.
• Multiple payment and shipping options are available.
• Evaluation modules are available for all three devices.

About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, enterprise systems and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

Trademarks
C2000 is a trademark of Texas Instruments. All registered trademarks and other trademarks belong to their respective owners.

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SOURCE Texas Instruments

FAQ

What new power management solutions did TXN announce for data centers in March 2025?

TXN announced the TPS1685 48V integrated hot-swap eFuse and a new family of GaN power stages (LMG3650R035, LMG3650R025, LMG3650R070) for enhanced data center power management.

What efficiency levels can TXN's new GaN power stages achieve?

TXN's new GaN power stages achieve efficiency levels exceeding 98% with power density greater than 100W/in3.

How does TXN's TPS1685 hot-swap eFuse improve data center design?

The TPS1685 supports power levels beyond 6kW and reduces solution size by half compared to existing hot-swap controllers, while providing power-path protection.

Which major companies are implementing TXN's new power management solutions?

Dell, Vertiv, and Greatwall are implementing TXN's power management solutions in their server PSUs, with power capacities of 1.8kW, 5.5kW, and 8kW respectively.