UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers

UL Solutions (NYSE: ULS) launched a certification program for direct-to-chip liquid cooling components used in AI data centers and other high-density computing systems.

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Certification evaluates liquid cooling subassemblies for safety, performance, leak integrity and interoperability, helping support reliable AI infrastructure.

• AI chips generate intense heat, making effective cooling essential to data center performance and reliability.
• The certification provides a consistent way to assess critical cooling components before deployment in AI data centers.
• Certification can help manufacturers demonstrate product readiness and help data center customers make informed purchasing and integration decisions.

NORTHBROOK, Ill.--(BUSINESS WIRE)-- UL Solutions Inc. (NYSE: ULS), a global leader in applied safety science, today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density computing systems.

UL Solutions today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density computing systems.

AI computers use chips that produce a large amount of heat. If that heat is not removed, equipment may slow down, shut off or become damaged, but traditional air cooling, such as fans or chilled air, may not be enough for today’s most powerful computing systems. With direct-to-chip liquid cooling, coolant flows through a cold plate that is attached to the chip. The coolant absorbs heat from the chip and carries it away, much like water flowing through a radiator.

“As AI data centers handle more powerful computing, they depend on even more advanced cooling systems to operate safely and reliably,” said Jennifer Scanlon, president and CEO of UL Solutions. “Our certification helps IT equipment manufacturers demonstrate product performance and safety while giving data center operators greater confidence during integration.”

AI and other high-performance computing systems are increasing energy use and heat in data centers. Global data center electricity use is expected to more than double between 2024 and 2030. Cooling can account for up to 40% of a data center’s energy use. Liquid cooling can improve heat control, but it also brings risks. Leaks, corrosion, contamination or parts that do not work well together can affect system safety, performance and reliability.

Connecting parts from different suppliers can also be a challenge. Parts may fit together but require different coolants, pressure levels or operating conditions. Industry observers have identified integration problems and limited standards as barriers to wider use of liquid cooling.

The UL Solutions certification program covers eligible liquid-filled parts and subassemblies that move coolant through information and communication technology equipment. These may include:

• Cold plates, which absorb heat directly from computer chips
• Manifolds, which send coolant to servers and equipment racks
• Quick disconnects, which allow equipment to be serviced without draining the full cooling system

UL Solutions uses UL 4501, the Outline of Investigation for Safety, Performance and Interoperability of Liquid-Filled Components and Assemblies Used in Liquid Cooling Systems, to evaluate eligible liquid cooling subassemblies. The evaluation covers coolant compatibility, pressure and leak integrity, durability, liquid flow, interoperability, production controls and installation requirements.

Evaluating these parts before adding them to a complete cooling system can help identify problems earlier and reduce the need for repeated testing. Independent certification demonstrates that an eligible product meets applicable requirements. This helps manufacturers support their product claims and helps data center customers make informed buying and integration decisions.

“AI infrastructure must scale without sacrificing safety or reliability,” said Milan Dotlich, vice president and general manager of Data Center Solutions at UL Solutions. “Independent evaluation of liquid cooling components can help organizations deploy advanced computing systems with greater confidence.”

UL Solutions can also evaluate other data center cooling equipment under applicable UL Standards. This equipment includes coolant distribution units, self-contained liquid-filled systems, liquid-cooled busways, cables, connectors, power whips, gaskets, O-rings and hoses. Requirements depend on each product’s design, function and intended use.

Learn more about UL Solutions services that support data center development and operations.

About UL Solutions

A global leader in applied safety science, UL Solutions (NYSE: ULS) transforms safety, security and sustainability challenges into opportunities for customers in more than 110 countries. UL Solutions delivers testing, inspection and certification services, advisory offerings and software solutions that support our customers’ product innovation and business growth. The UL Mark serves as a recognized symbol of trust in our customers’ products and reflects an unwavering commitment to advancing our safety mission. We help our customers innovate, launch new products and services, navigate global markets and complex supply chains, and grow sustainably and responsibly into the future. Our science is your advantage. Learn more about UL Solutions.

Source Code: ULS-IR

Source: UL Solutions

View source version on businesswire.com: https://www.businesswire.com/news/home/20260929465054/en/

Media:
Kathy Fieweger
Senior Vice President and Chief Corporate Communications Officer
Kathy.Fieweger@ul.com
+1 312-852-5156

Investors:
Yijing Brentano
Vice President, Investor Relations
IR@ul.com
+1 312-895-9873

Source: UL Solutions Inc

Key Terms

direct-to-chip liquid cooling technical

A cooling method that pumps liquid directly over the surface of a computer chip (processor or graphics unit) using a fitted plate, removing heat more efficiently than air or indirect systems. Think of it like a water jacket on an engine: keeping the hottest part cooler lets the equipment run faster, longer, and in a smaller space, which can lower energy and space costs and enable higher-performance products—factors that affect operating margins, capital needs, and adoption potential for companies and data centers.

quick disconnects technical

Coupling fittings or connectors designed to join and separate fluid, gas, pneumatic or electrical lines quickly and without tools; they use a spring-loaded collar, push-fit mechanism, or latching sleeve so two mating halves lock together securely and release with a single manual action. Quick disconnects are rated for specific pressures, temperatures and media and include seals or valves that minimize leakage when disconnected, so their safe use depends on matching the connector type and ratings to the system.