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Veeco Instruments Inc. reports developments in semiconductor process equipment used in advanced device fabrication and packaging. The company designs, develops and manufactures laser annealing, ion beam, metal organic chemical vapor deposition (MOCVD), single-wafer etch and clean, lithography and related thin-film processing systems.
Recurring news includes customer equipment orders for Spector Ion Beam Deposition, Lumina MOCVD and WaferEtch Wet Processing systems, including applications in indium phosphide lasers, silicon photonics and optical transceivers for data-center communications. Updates also cover quarterly and annual financial results, management conference participation and other material corporate disclosures tied to orders, manufacturing demand and operating performance.
Axcelis Technologies (NASDAQ:ACLS) and Veeco Instruments have announced a transformative all-stock merger creating a semiconductor equipment company with an estimated $4.4 billion enterprise value. Under the agreement, Veeco shareholders will receive 0.3575 Axcelis shares for each Veeco share, resulting in Axcelis shareholders owning 58% and Veeco shareholders 42% of the combined entity.
The merged company will be headquartered in Beverly, Massachusetts, with Dr. Russell Low as CEO. On a pro-forma basis for FY2024, the combined company generated $1.7 billion in revenue, 44% non-GAAP gross margin, and $387 million in adjusted EBITDA. The merger is expected to achieve $35 million in annual cost synergies within 24 months and be accretive to non-GAAP earnings per share within the first year post-closing.
The transaction is anticipated to close in second half of 2026, subject to shareholder and regulatory approvals.Veeco Instruments (NASDAQ: VECO), a leading manufacturer of semiconductor process equipment, has announced its participation in six major technology and semiconductor investor conferences throughout August and September 2025.
The company will present at events including the Oppenheimer Technology Conference (August 12), Needham Semiconductor Conference (August 21), Jefferies Technology Conference (August 26), Evercore ISI Conference (August 27), Benchmark TMT Conference (September 3), and Citi Global TMT Conference (September 4). The Oppenheimer conference presentation will be available via webcast on Veeco's investor relations website.
Veeco Instruments (NASDAQ: VECO) reported its Q2 2025 financial results with revenue of $166.1 million, down from $175.9 million in Q2 2024. The company posted GAAP net income of $11.7 million ($0.20 per diluted share) and non-GAAP net income of $21.5 million ($0.36 per diluted share).
The company's performance was driven by shipments of wet processing and lithography systems for Advanced Packaging and Ion Beam Deposition systems for EUV mask blanks, particularly in High-Performance Computing and AI technologies. For Q3 2025, Veeco expects revenue between $150-170 million and non-GAAP EPS of $0.20-0.35.
Veeco Instruments (NASDAQ: VECO), a leading manufacturer of semiconductor process equipment, has scheduled its second quarter 2025 financial results announcement for Wednesday, August 6, 2025, after market close.
The company will host a conference call at 5:00 PM ET to discuss the results. Investors can access the call via phone (toll-free: 1-877-407-8029 or 1-201-689-8029) or through a live webcast on Veeco's investor relations website. A replay will be available on the company website starting at 8:00 PM ET the same day.
Veeco Instruments (NASDAQ: VECO) has completed private exchange transactions for all of its outstanding 3.75% Convertible Senior Notes due 2027. The company exchanged notes with an aggregate principal amount of $25.0 million for approximately 1.6 million newly issued shares of common stock and $5.4 million in cash, including accrued interest. The original notes represented about 1.8 million underlying shares based on a conversion ratio of 71.5372 shares per $1,000 principal amount.
This strategic move follows the settlement of Veeco's 2025 Notes at maturity in January, strengthening the company's balance sheet by reducing ongoing interest expenses and outstanding debt while providing greater financial flexibility. The exchanges were executed under Section 4(a)(2) of the Securities Act of 1933, with ICR Capital LLC serving as financial advisor.
Veeco Instruments Inc. (NASDAQ: VECO), a leading manufacturer of semiconductor process equipment, has announced its participation in two upcoming investor events. The company will attend TD Cowen's 53rd Annual Technology, Media & Telecom Conference on May 28, 2025, at the InterContinental New York Barclay, and the Northland Growth Conference on June 25, 2025, which will be held virtually. At both events, Veeco management will be available for one-on-one meetings with investors.
Veeco specializes in laser annealing, ion beam, single wafer etch & clean, lithography, and metal organic chemical vapor deposition (MOCVD) technologies, which are crucial for semiconductor device fabrication and packaging.
Veeco Instruments (NASDAQ: VECO) has secured over $35 million in orders for its AP300™ Lithography systems from various IDM and OSAT customers. The orders, scheduled for delivery in 2025, support capacity expansions driven by AI and high-performance computing demands. The AP300™ systems offer industry-leading performance for Advanced Packaging applications, featuring lower total cost of ownership, high uptime, and process flexibility.
The systems are designed to handle next-generation advanced packaging processes, including copper pillar for 2.5/3D packaging, flip chip bumping, fan-out WLP, and high-density fan-out packaging. Veeco's Advanced Packaging Lithography business is projected to achieve strong year-over-year growth in 2025, driven by global megatrends in AI and high-performance computing.
Veeco Instruments (NASDAQ: VECO) has achieved a significant milestone as a global Semiconductor IDM has qualified their WaferStorm® and WaferEtch® platform for two new advanced packaging applications. The customer has already placed initial orders in Q1.
The selection was based on three key advantages:
- Best-in-class process performance
- Unique processing capabilities
- Lower cost of ownership compared to competitors
This qualification represents important market expansion opportunities for Veeco's wet processing technology. The company specializes in manufacturing semiconductor process equipment, including laser annealing, ion beam, single wafer etch & clean, lithography, and MOCVD technologies. These solutions play a crucial role in fabricating and packaging advanced semiconductor devices.
Veeco Instruments (NASDAQ: VECO) announced that two leading-edge logic manufacturers have selected its Laser Spike Annealing (LSA) Platform as Production Tool of Record for new applications at their gate-all-around nodes. The company anticipates high-volume manufacturing orders as customers ramp up advanced nodes production.
The LSA platform, recognized for optimal annealing in low thermal-budget applications, performs millisecond annealing in front-end semiconductor manufacturing to reduce resistance in transistor structures through dopant activation. The technology portfolio includes the NSA500 system, extending capabilities to Backside Power Delivery and Contact Annealing for advanced nodes.
These selections represent successful ongoing collaborations and validate Veeco's strategy to expand its Served Available Market through leading-edge investments.