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Veeco Instruments Inc. reports developments in semiconductor process equipment used in advanced device fabrication and packaging. The company designs, develops and manufactures laser annealing, ion beam, metal organic chemical vapor deposition (MOCVD), single-wafer etch and clean, lithography and related thin-film processing systems.
Recurring news includes customer equipment orders for Spector Ion Beam Deposition, Lumina MOCVD and WaferEtch Wet Processing systems, including applications in indium phosphide lasers, silicon photonics and optical transceivers for data-center communications. Updates also cover quarterly and annual financial results, management conference participation and other material corporate disclosures tied to orders, manufacturing demand and operating performance.
Veeco (Nasdaq: VECO) announced that its stockholders voted to approve all proposals related to the pending merger with Axcelis (Nasdaq: ACLS) at a Special Meeting on Feb. 6, 2026.
The companies said the Merger remains subject to customary closing conditions and final regulatory approval from the State Administration for Market Regulation in China, and they continue to expect closing in the second half of 2026. Final voting results will be reported in a Form 8-K.
Veeco (NASDAQ: VECO) said management will participate at the 28th Annual Needham Growth Conference on Tuesday, January 13, 2026 at The Lotte NY Palace Hotel in New York. Management will be available for in-person investor meetings during the conference.
Comtech (NASDAQ: CMTL) appointed Mary Jane Raymond to its Board of Directors, effective December 11, 2025, bringing the Board to eight members.
Ms. Raymond has over three decades of public company finance and governance experience, including service as Chief Financial Officer of Coherent from 2014–2024 when Coherent reported revenue exceeding $5.8 billion. She held senior finance, risk management and M&A roles at Hudson Global, Dun & Bradstreet, Lucent Technologies and Cummins, and since 2019 has been an independent director and Audit Committee member at Veeco Instruments (NASDAQ: VECO).
Company leadership cited her governance, finance, internal control, M&A and operational capabilities as reasons for the appointment; Ms. Raymond said she looks forward to contributing to Comtech’s ongoing progress.
Veeco (NASDAQ: VECO) announced an evaluation shipment of its laser spike annealing (LSA) system to a leading semiconductor memory company for advanced DRAM R&D. The shipment expands Veeco's presence in the DRAM market and is positioned as a step toward high-volume manufacturing (HVM) adoption for next-generation DRAM and high bandwidth memory (HBM).
The evaluation is expected to last about one year, with follow-on orders anticipated in 2027 and beyond. Veeco says the LSA platform delivers high-temperature, millisecond annealing with reduced thermal budgets and claims market-leading performance and cost of ownership. Yole projects HBM market CAGR at ~30% through 2030, reaching about $100B annualized.
Veeco (NASDAQ: VECO) reported Q3 2025 revenue of $165.9 million, down from $184.8 million a year earlier. GAAP net income was $10.6 million, or $0.17 diluted EPS, versus $22.0 million, or $0.36 diluted EPS, in Q3 2024. Non-GAAP net income was $21.8 million, or $0.36 diluted EPS, versus $28.3 million, or $0.46 diluted EPS, a year ago.
Management highlighted order wins for 300mm GaN single‑wafer and AsP batch MOCVD systems and reiterated the pending merger with Axcelis. Q4 2025 guidance: revenue $155M–$175M, GAAP diluted EPS (loss) $(0.07)–$0.05, and Non‑GAAP diluted EPS $0.16–$0.32. A conference call was scheduled for Nov 5, 2025 at 5:00pm ET.
Veeco (NASDAQ: VECO) received an order for a Propel®300 MOCVD system from a leading power semiconductor IDM for GaN epitaxy on 300mm Si wafers. The order reinforces Veeco’s position in 300mm MOCVD technology and follows prior Propel®300 shipments across compound semiconductor markets.
Veeco highlights a 2.3x chip-per-wafer advantage moving from 200mm to 300mm, compatibility with existing 300mm production lines, and features including TurboDisc MOCVD technology, automated wafer handling, best-in-class thickness and doping uniformity, low defectivity, and long campaigns without in-situ cleaning. Yole Group projects the GaN device market to grow at a 35% CAGR from $555M (2025) to $2.5B (2030), driven by automotive, industrial, and data center power-efficiency demand.
Veeco (NASDAQ: VECO) announced multiple orders for its WaferStorm, WaferEtch and AP300 wet processing and lithography systems from a leading specialist foundry to support advanced packaging and silicon photonics.
Deliveries are scheduled to begin in Q1 2026. Systems will target applications across AI, automotive, aerospace and defense, and communications, and include processes such as Cu pillars, flip-chip bumping, FOWLP and high-density fan-out packaging.
Veeco (NASDAQ: VECO) will release Q3 2025 financial results after market close on Wednesday, November 5, 2025. The company will host a conference call to review results at 5:00 PM ET the same day.
To join by phone dial 1-877-407-8029 (toll-free) or 1-201-689-8029. A live webcast will be available at ir.veeco.com, and a replay will be posted on Veeco's website beginning at 8:00 PM ET on November 5, 2025.
Investor and media contact names and phone numbers are provided for follow-up.
Veeco (NASDAQ: VECO) said on October 14, 2025 that a leading optical communications laser manufacturer ordered multiple Lumina MOCVD systems, naming Lumina as the customer’s production tool of record for InP epitaxy on 4-inch and 6-inch wafers.
The systems will fabricate InP lasers for datacom optical transceivers. Veeco highlighted TurboDisc technology, within-wafer and wafer-to-wafer uniformity, low defectivity, continuous long campaigns without reactor clean interruptions, and seamless wafer-size transition up to 6 inches.
Market context: Yole forecasts a 13% CAGR for datacom optical transceivers from $8.1B in 2024 to $14.7B in 2029, driven by AI intra-data-center demand.
Veeco (NASDAQ: VECO) launched the Lumina+ MOCVD system and secured a first commercial multi‑tool order from Rocket Lab (NASDAQ: RKLB) on Oct 6, 2025. The tools support Rocket Lab’s CHIPS Act‑backed project to expand domestic compound semiconductor production and will be installed at Rocket Lab’s Albuquerque facility.
The release says Lumina+ offers the largest As/P batch size in MOCVD, best‑in‑class throughput, lowest cost per wafer, and industry‑leading uniformity, enabling Rocket Lab to double production capacity for space‑grade solar cells.