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Veeco Instruments Inc. reports developments in semiconductor process equipment used in advanced device fabrication and packaging. The company designs, develops and manufactures laser annealing, ion beam, metal organic chemical vapor deposition (MOCVD), single-wafer etch and clean, lithography and related thin-film processing systems.
Recurring news includes customer equipment orders for Spector Ion Beam Deposition, Lumina MOCVD and WaferEtch Wet Processing systems, including applications in indium phosphide lasers, silicon photonics and optical transceivers for data-center communications. Updates also cover quarterly and annual financial results, management conference participation and other material corporate disclosures tied to orders, manufacturing demand and operating performance.
Veeco (NASDAQ: VECO) announced management will participate in two investor events in early March 2026: the Morgan Stanley Technology, Media & Telecom Conference on March 3, 2026 in San Francisco and the Stifel 2026 NYC Technology 1x1 Conference on March 10, 2026 in New York.
Investors can expect management presentations and one-on-one meetings at each conference.
Veeco (NASDAQ: VECO) reported Q4 2025 revenue of $165.0M and GAAP net income of $1.1M ($0.02 diluted); Non-GAAP net income was $14.7M ($0.24 diluted). Full-year 2025 revenue totaled $664.3M with GAAP net income of $35.4M ($0.59).
The company provided 1Q26 revenue guidance of $150M–$170M and FY26 guidance of $740M–$800M, with GAAP EPS guidance of $0.83–$1.17 and Non-GAAP EPS guidance of $1.50–$1.85, and reiterated a planned merger with Axcelis.
Veeco (NASDAQ: VECO) will report fourth quarter and full year 2025 financial results after market close on Wednesday, February 25, 2026.
A conference call will begin at 5:00 PM ET; dial-in numbers and a live webcast at ir.veeco.com are available. A webcast replay posts at 8:00 PM ET the same evening.
Veeco (Nasdaq: VECO) announced that its stockholders voted to approve all proposals related to the pending merger with Axcelis (Nasdaq: ACLS) at a Special Meeting on Feb. 6, 2026.
The companies said the Merger remains subject to customary closing conditions and final regulatory approval from the State Administration for Market Regulation in China, and they continue to expect closing in the second half of 2026. Final voting results will be reported in a Form 8-K.
Veeco (NASDAQ: VECO) said management will participate at the 28th Annual Needham Growth Conference on Tuesday, January 13, 2026 at The Lotte NY Palace Hotel in New York. Management will be available for in-person investor meetings during the conference.
Comtech (NASDAQ: CMTL) appointed Mary Jane Raymond to its Board of Directors, effective December 11, 2025, bringing the Board to eight members.
Ms. Raymond has over three decades of public company finance and governance experience, including service as Chief Financial Officer of Coherent from 2014–2024 when Coherent reported revenue exceeding $5.8 billion. She held senior finance, risk management and M&A roles at Hudson Global, Dun & Bradstreet, Lucent Technologies and Cummins, and since 2019 has been an independent director and Audit Committee member at Veeco Instruments (NASDAQ: VECO).
Company leadership cited her governance, finance, internal control, M&A and operational capabilities as reasons for the appointment; Ms. Raymond said she looks forward to contributing to Comtech’s ongoing progress.
Veeco (NASDAQ: VECO) announced an evaluation shipment of its laser spike annealing (LSA) system to a leading semiconductor memory company for advanced DRAM R&D. The shipment expands Veeco's presence in the DRAM market and is positioned as a step toward high-volume manufacturing (HVM) adoption for next-generation DRAM and high bandwidth memory (HBM).
The evaluation is expected to last about one year, with follow-on orders anticipated in 2027 and beyond. Veeco says the LSA platform delivers high-temperature, millisecond annealing with reduced thermal budgets and claims market-leading performance and cost of ownership. Yole projects HBM market CAGR at ~30% through 2030, reaching about $100B annualized.
Veeco (NASDAQ: VECO) reported Q3 2025 revenue of $165.9 million, down from $184.8 million a year earlier. GAAP net income was $10.6 million, or $0.17 diluted EPS, versus $22.0 million, or $0.36 diluted EPS, in Q3 2024. Non-GAAP net income was $21.8 million, or $0.36 diluted EPS, versus $28.3 million, or $0.46 diluted EPS, a year ago.
Management highlighted order wins for 300mm GaN single‑wafer and AsP batch MOCVD systems and reiterated the pending merger with Axcelis. Q4 2025 guidance: revenue $155M–$175M, GAAP diluted EPS (loss) $(0.07)–$0.05, and Non‑GAAP diluted EPS $0.16–$0.32. A conference call was scheduled for Nov 5, 2025 at 5:00pm ET.
Veeco (NASDAQ: VECO) received an order for a Propel®300 MOCVD system from a leading power semiconductor IDM for GaN epitaxy on 300mm Si wafers. The order reinforces Veeco’s position in 300mm MOCVD technology and follows prior Propel®300 shipments across compound semiconductor markets.
Veeco highlights a 2.3x chip-per-wafer advantage moving from 200mm to 300mm, compatibility with existing 300mm production lines, and features including TurboDisc MOCVD technology, automated wafer handling, best-in-class thickness and doping uniformity, low defectivity, and long campaigns without in-situ cleaning. Yole Group projects the GaN device market to grow at a 35% CAGR from $555M (2025) to $2.5B (2030), driven by automotive, industrial, and data center power-efficiency demand.
Veeco (NASDAQ: VECO) announced multiple orders for its WaferStorm, WaferEtch and AP300 wet processing and lithography systems from a leading specialist foundry to support advanced packaging and silicon photonics.
Deliveries are scheduled to begin in Q1 2026. Systems will target applications across AI, automotive, aerospace and defense, and communications, and include processes such as Cu pillars, flip-chip bumping, FOWLP and high-density fan-out packaging.